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    • 1. 发明授权
    • Structure and process for improving high frequency isolation in semiconductor substrates
    • 用于改善半导体衬底中的高频隔离的结构和工艺
    • US06642559B1
    • 2003-11-04
    • US09291494
    • 1999-04-14
    • Kenneth Vern BuerAnthony Francis QuagliettaAllen Hanson
    • Kenneth Vern BuerAnthony Francis QuagliettaAllen Hanson
    • H01L2980
    • H01L21/76H01L21/7605H01L23/481H01L23/66H01L2924/0002H01L2924/3011H01L2924/00
    • An isolation structure for high frequency integrated circuits is a conductive material disposed over a region of active gallium arsenide substrate. The conductive material over the active region creates a lossy RF path to reduce undesired coupling between adjacent conductors. In one case, two RF signal lines (1,2) terminated at the same via pad (3) have weaker coupling than in prior art via structures due to the lossy RF structure disposed on isolating fractional portions (10,11) of the via pad (3). The isolating fractional portion (10,11) are intermediate terminating fractional portions (8,9) of the via pad (3) to which the signal lines (1,2) are connected. In another case, two parallel bias lines (12,13) are disposed over an active layer region (6) increasing the RF loss between them and advantageously reducing the RF coupling. The reduced RF coupling improves RF isolation and permits increased miniaturization.
    • 用于高频集成电路的隔离结构是设置在有源砷化镓衬底的区域上的导电材料。 有源区域上的导电材料产生有损的RF路径以减少相邻导体之间的不期望的耦合。 在一种情况下,由于设置在隔离通孔的分数部分(10,11)上的有损RF结构,在相同的通孔焊盘(3)处终止的两个RF信号线(1,2)具有比现有技术的通孔结构更弱的耦合, 垫(3)。 隔离分数部分(10,11)是信号线(1,2)连接到的通孔焊盘(3)的中间终端部分部分(8,9)。 在另一种情况下,两个平行偏置线(12,13)设置在有源层区域(6)上,增加它们之间的RF损耗并且有利地减小RF耦合。 减少的射频耦合可提高RF隔离度,并允许增加小型化。