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1. 发明授权

US06272007B1 Computer system cooling configuration 有权
标题翻译：电脑系统冷却配置
公开(公告)号：US06272007B1
公开(公告)日：2001-08-07
申请号：US09340962
申请日：1999-06-28
申请人： Kenneth Kitlas , Anita Patel , Satyanarayana Nishtala , Alan Lee Winick , Alan Lam , Winiie C. Leung , Kenneth A. Lown , Mohammed Tantoush
发明人： Kenneth Kitlas , Anita Patel , Satyanarayana Nishtala , Alan Lee Winick , Alan Lam , Winiie C. Leung , Kenneth A. Lown , Mohammed Tantoush
IPC分类号： G06F116
CPC分类号： G06F1/185 , G06F1/181 , G06F1/184 , G06F1/186 , G06F1/20
摘要： A computer system housing where a vertical printed circuit board, e.g., a riser card, is inserted into a socket on a computer system motherboard. Some internal space within the housing may allow optimization of system memory capacity through packing of additional memory modules on the riser card. The additional memory may be mounted on the riser card and may reside in the vertical space created between the riser card and the directly-mounted memory on the motherboard. The computer system housing further includes a chassis that may be partitioned into two separate sub-chassis for proper positioning of one or more cooling fans as well as to accommodate changes in computer system configurations with minimized retooling of the chassis. The cooling fans may be mounted at such locations on the chassis that allow optimization of air circulation and, hence, cooling within the housing. However, extra cooling fan(s) for the additional memory on the riser card may not be necessary in view of the creation of dedicated cooling channels within the housing by an efficient placement of the cooling fans. The optimization of fan placement within the housing results in efficient cooling of various system components and allows for increase in system component packing density without a similar increase in the number of cooling fans.
摘要翻译：一种将垂直印刷电路板（例如转接卡）插入计算机系统主板上的插座的计算机系统外壳。外壳内的一些内部空间可以通过在转接卡上包装附加的存储器模块来优化系统存储器容量。附加存储器可以安装在转接卡上，并且可以位于在转接卡和主板上直接安装的存储器之间产生的垂直空间中。计算机系统壳体还包括可以被划分成两个单独的子机架以用于一个或多个冷却风扇的适当定位的底盘，以及通过最小化底盘重新装配来适应计算机系统配置的变化。冷却风扇可以安装在底盘上的这样的位置，从而优化空气循环，从而优化壳体内的冷却。然而，考虑到通过冷却风扇的有效放置在壳体内创建专用冷却通道，可能不需要用于转接卡上的附加存储器的额外的冷却风扇。在壳体内优化风扇放置结果可以有效地冷却各种系统组件，并且可以增加系统组件的封装密度，而不会有类似的冷却风扇数量的增加。

2. 发明授权

US08453467B2 Hybrid heat exchanger 有权
标题翻译：混合式换热器
公开(公告)号：US08453467B2
公开(公告)日：2013-06-04
申请号：US11580671
申请日：2006-10-13
申请人： Charles D. Hood, III , Ioan Sauciuc , Mohammed Tantoush
发明人： Charles D. Hood, III , Ioan Sauciuc , Mohammed Tantoush
IPC分类号： F25B21/02 , F25D23/12
CPC分类号： G06F1/20 , F25B21/02 , F25B2321/0251 , F28D1/0408 , H01L23/38 , H01L35/30 , H01L37/00 , H01L2924/0002 , H01L2924/00
摘要： A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.
摘要翻译：热电冷却器组件包括冷板，第一热电冷却器和第二热电冷却器。冷板具有第一面和第二面。第一热电冷却器与冷板的第一侧热连通，第二热电冷却器与冷板的第二侧热连通。还公开了一种热交换器组件。

3. 发明申请

US20080087024A1 Hybrid heat exchanger 有权
标题翻译：混合式换热器
公开(公告)号：US20080087024A1
公开(公告)日：2008-04-17
申请号：US11580671
申请日：2006-10-13
申请人： Charles D. Hood , Ioan Sauciuc , Mohammed Tantoush
发明人： Charles D. Hood , Ioan Sauciuc , Mohammed Tantoush
IPC分类号： F25B21/02
CPC分类号： G06F1/20 , F25B21/02 , F25B2321/0251 , F28D1/0408 , H01L23/38 , H01L35/30 , H01L37/00 , H01L2924/0002 , H01L2924/00
摘要： A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.
摘要翻译：热电冷却器组件包括冷板，第一热电冷却器和第二热电冷却器。冷板具有第一面和第二面。第一热电冷却器与冷板的第一侧热连通，第二热电冷却器与冷板的第二侧热连通。还公开了一种热交换器组件。

4. 发明授权

US5969950A Enhanced heat sink attachment 有权
标题翻译：增强散热片附件
公开(公告)号：US5969950A
公开(公告)日：1999-10-19
申请号：US186269
申请日：1998-11-04
申请人： Mohammed Tantoush
发明人： Mohammed Tantoush
IPC分类号： H01L23/40 , H05K7/20
CPC分类号： H01L23/4006 , H01L2924/0002
摘要： A slug or plate of copper or some other material having high heat conductivity is attached by an adhesive such as epoxy to a heat-emitting electrical component such as a chip, ASIC, microprocessor, or the like. A heat sink having a base and a plurality of fins upstanding from the base is attached to the slug or plate by screws, nuts or other, preferably detachable, means. The bottom of the base may be formed with a socket to receive the slug. The heat sink may be larger than the slug, thereby improving heat dissipation. When it is necessary to replace the component, the heat sink is detached from the slug and re-used.
摘要翻译：通过诸如环氧树脂的粘合剂将诸如铜或其它具有高导热性的其它材料的块或板附接到诸如芯片，ASIC，微处理器等的发热电气部件。具有底座和从基座直立的多个翅片的散热器通过螺钉，螺母或其它优选可拆卸的装置附接到塞子或板。基座的底部可以形成有用于接收塞子的插座。散热器可能大于块状物，从而改善散热。当需要更换部件时，将散热器与芯块分离并重新使用。

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