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    • 1. 发明申请
    • METHOD OF PROCESSING GLASS SUBSTRATE SURFACE
    • 玻璃基板表面处理方法
    • US20100080961A1
    • 2010-04-01
    • US12631304
    • 2009-12-04
    • Kenji OKAMURAMasabumi Ito
    • Kenji OKAMURAMasabumi Ito
    • B32B3/02B44C1/22B29D11/00
    • C03C15/02C03C17/3665C03C23/0025C03C23/006C03C2204/08C03C2218/31Y10T428/24777
    • The present invention is to provide a method for processing the whole of a glass substrate surface so as to give a surface excellent in flatness and surface roughness. The present invention provides a method of processing a glass substrate surface using a processing technique selected from the group consisting of ion-beam etching, gas cluster ion-beam etching, plasma etching, and nano-ablation, wherein a frame element satisfying the following (1) and (2) is arranged along the periphery of the glass substrate before the glass substrate surface is processed: (1) the difference between the height of the frame element and the height of the glass substrate surface is 1 mm or smaller; and (2) the frame element has a width which is not smaller than one-half the beam diameter or laser light diameter to be used in the processing technique.
    • 本发明提供一种加工整个玻璃基板表面以提供平坦度和表面粗糙度优异的表面的方法。 本发明提供一种使用选自离子束蚀刻,气体簇离子束蚀刻,等离子体蚀刻和纳米烧蚀的处理技术来处理玻璃基板表面的方法,其中满足以下( (1)和(2)在玻璃基板表面被处理之前沿着玻璃基板的周边布置:(1)框架元件的高度与玻璃基板表面的高度之间的差为1mm或更小; 和(2)框架元件具有不小于处理技术中使用的光束直径或激光光径的一半的宽度。