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    • 8. 发明授权
    • Echelon diffraction grating and optical waveguide element
    • 梯形衍射光栅和光波导元件
    • US06721485B1
    • 2004-04-13
    • US09806416
    • 2001-03-30
    • Koichiro NakamuraMasahiro HoriHiroaki Yamamoto
    • Koichiro NakamuraMasahiro HoriHiroaki Yamamoto
    • G02B600
    • G02B6/138G02B1/04G02B5/1814G02B5/1852C08L83/04
    • An echelon diffraction grating which has excellent heat resistance and can be produced at a low cost and an optical waveguide which has high heat resistance, small absorption of a communication wavelength of a near infrared range, and satisfies reliability and a low loss at an optical communication range. The echelon diffraction grating comprises a substrate, and an organopolysiloxane film having a maximum thickness of 1 &mgr;m to 1 mm formed on the surface of the substrate and has a plurality of steps having a predetermined width of 1 to 500 &mgr;m and a predetermined height of 5 to 500 &mgr;m formed on the organopolysiloxane film, and the organopolysiloxane film contains dimethylsiloxane and phenyl(or substituted phenyl)siloxane as essential ingredients.
    • 具有优异的耐热性并且可以低成本地生产的梯形衍射光栅和具有高耐热性,较小吸收近红外范围的通信波长的光波导,并且在光通信中满足可靠性和低损耗的光波导 梯形衍射光栅包括基板和形成在基板表面上的最大厚度为1μm至1mm的有机聚硅氧烷膜,并且具有预定宽度为1至500μm的多个台阶和预定高度 在有机聚硅氧烷膜上形成5〜500μm,有机聚硅氧烷膜含有二甲基硅氧烷和苯基(或取代的苯基)硅氧烷作为必要成分。
    • 9. 发明授权
    • Card-typed electronic apparatus having a flat card case housing a plurality of electronic parts
    • 具有容纳多个电子部件的平板卡盒的卡式电子设备
    • US06381143B1
    • 2002-04-30
    • US09664401
    • 2000-09-18
    • Koichiro Nakamura
    • Koichiro Nakamura
    • H05K114
    • H05K5/026B29C65/08B29C66/131B29C66/30221B29C66/30223B29C66/54B29C66/71B29C66/73921B29C66/8322B29L2017/006H05K1/189Y10S439/945Y10S439/946B29K2055/02B29K2069/00
    • A card-type electronic apparatus is provided with a flat card case and a circuit module housed in the card case. The circuit module is provided with a circuit substrate having a first surface and a second surface positioned on the side opposite to the first surface, at least one first electronic part mounted on the first surface of the circuit substrate and at least one second electronic part mounted on the second surface of the circuit substrate. Here, the first electronic part having the greatest height dimension on the first surface and the second electronic part having the greatest height dimension on the second surface are placed in an offset manner from each other without facing each other with the circuit substrate interpolated in between. Moreover, the circuit substrate is provided with a step portion for allowing the first electronic part having the greatest height dimension on the first surface and the second electronic part having the greatest height dimension on the second surface to be shifted in an approaching direction with each other along the thickness direction of the card case.
    • 卡式电子设备设置有容纳在卡盒中的平板卡盒和电路模块。 电路模块设置有电路基板,其具有位于与第一表面相对的一侧上的第一表面和第二表面,安装在电路基板的第一表面上的至少一个第一电子部件和安装在电路基板的第一表面上的至少一个第二电子部件 在电路基板的第二表面上。 这里,在第一表面具有最大高度尺寸的第一电子部件和在第二表面上具有最大高度尺寸的第二电子部件以彼此相互偏置的方式彼此相对地放置,同时电路基板插入其间。 此外,电路基板设置有阶梯部,用于允许第一表面具有最大高度尺寸的第一电子部件和在第二表面上具有最大高度尺寸的第二电子部件在彼此接近的方向上移动 沿着卡盒的厚度方向。