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    • 6. 发明授权
    • Transmission circuit using strip line in three dimensions
    • 传输电路采用带状线三维
    • US6023211A
    • 2000-02-08
    • US986306
    • 1997-12-05
    • Junichi Somei
    • Junichi Somei
    • H01P3/08H01P5/02H01P5/08H05K1/02H05K3/42H05K1/11
    • H01P3/081H05K1/0251H02M2007/53876H05K2201/0715H05K2201/09336H05K2201/09627H05K2201/09845H05K3/429
    • There is provided a transmission circuit using a strip line which can be formed in three dimensions with simple construction and low cost and which has high reliability. A first microstrip line is formed by sandwiching a dielectric substrate 1 between a first strip conductor 2 provided on a top surface of the dielectric substrate 1 and a first grounding conductor 3 provided on a bottom surface of the dielectric substrate 1. A second microstrip line is formed by sandwiching the dielectric substrate 1 between a second strip conductor 4 provided on the bottom surface of the dielectric substrate 1 and a second grounding conductor 5 provided on the top surface of the dielectric substrate 1. The first strip conductor 2 and the second strip conductor 4 are electrically connected to each other by a connecting through hole 11 provided in the dielectric substrate 1.
    • 提供了一种使用带状线的传输电路,其可以以简单的结构和低成本三维形成,并且具有高可靠性。 通过将电介质基板1夹持在设置在电介质基板1的上表面上的第一带状导体2和设置在电介质基板1的底面上的第一接地导体3之间来形成第一微带线。第二微带线是 通过将电介质基板1夹持在设置在电介质基板1的底面上的第二带状导体4和设置在电介质基板1的上表面的第二接地导体5之间而形成。第一带状导体2和第二带状导体 4通过设置在电介质基板1中的连接通孔11彼此电连接。