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1. 发明授权

US06879041B2 Semiconductor device with joint structure having lead-free solder layer over nickel layer 有权
标题翻译：具有接合结构的半导体器件，其具有在镍层上的无铅焊料层
公开(公告)号：US06879041B2
公开(公告)日：2005-04-12
申请号：US10396326
申请日：2003-03-26
申请人： Kenichi Yamamoto , Toshiaki Morita , Munehiro Yamada , Ryosuke Kimoto
发明人： Kenichi Yamamoto , Toshiaki Morita , Munehiro Yamada , Ryosuke Kimoto
IPC分类号： H01L23/12 , H01L21/60 , H01L23/485 , H01L23/498 , H05K3/24 , H05K3/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/10 , H01L23/49816 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05027 , H01L2224/05568 , H01L2224/05569 , H01L2224/05572 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48095 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/013 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K3/244 , H05K3/3463 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/05541 , H01L2224/05005
摘要： The impact strength resistance of a solder joint portion of a semiconductor device is improved. The semiconductor device has a joint structure wherein a jointing layer which does not contain sulfur substantially is arranged between an underlying conductive layer and a lead-free solder layer and further between the jointing layer and the lead-free solder layer is formed an alloy layer comprising elements of these layers.
摘要翻译：半导体器件的焊接部的耐冲击强度提高。半导体器件具有接合结构，其中基本上不含硫的接合层布置在下面的导电层和无铅焊料层之间，并且在接合层和无铅焊料层之间形成合金层，其包括这些层的元素。

2. 发明授权

US07217645B2 Method for manufacturing semiconductor device and electronic device and method for calculating connection condition 失效
标题翻译：半导体装置及电子装置的制造方法及连接条件的计算方法
公开(公告)号：US07217645B2
公开(公告)日：2007-05-15
申请号：US10372392
申请日：2003-02-25
申请人： Shiro Yamashita , Masahide Harada , Kenichi Yamamoto , Munehiro Yamada , Ryosuke Kimoto
发明人： Shiro Yamashita , Masahide Harada , Kenichi Yamamoto , Munehiro Yamada , Ryosuke Kimoto
IPC分类号： H01L21/44
CPC分类号： H01L24/10 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K3/3463 , H01L2224/29099 , H01L2924/00014 , H01L2924/00
摘要： Solder is connected to the electrodes of the circuit board by using a temperature profile with a constant fusion temperature, a connection interface strength evaluation test is carried out on the soldered joints to obtain an appropriate reflow range free of decreases in the strength at the connection interface. On the basis of the appropriate reflow range obtained and using as the basis the chemical compound thickness which is determined uniquely by heat load, an appropriate reflow range in an optional temperature profile with one temperature peak is obtained. By carrying out connection in this appropriate reflow range, soldered joints can be obtained without decreases in the connection interface strength in the large-scale production stage.
摘要翻译：通过使用恒定熔融温度的温度分布将焊料连接到电路板的电极，在焊接接头上进行连接界面强度评估测试，以获得在连接界面处强度没有降低的适当回流范围。基于获得的适当的回流范围和以热负荷唯一确定的化合物厚度为基准，获得具有一个温度峰值的任选温度曲线中的适当回流范围。通过在适当的回流范围内实现连接，可以在大规模生产阶段的连接界面强度不降低的情况下获得焊接接头。

3. 发明授权

US07211892B2 Semiconductor device having a particular electrode structure 失效
标题翻译：具有特定电极结构的半导体器件
公开(公告)号：US07211892B2
公开(公告)日：2007-05-01
申请号：US11146044
申请日：2005-06-07
申请人： Shiro Yamashita , Yoichi Abe , Kenichi Yamamoto , Ryosuke Kimoto , Hiroshi Kawakubo
发明人： Shiro Yamashita , Yoichi Abe , Kenichi Yamamoto , Ryosuke Kimoto , Hiroshi Kawakubo
IPC分类号： H01L29/40
CPC分类号： H01L23/49816 , H01L24/11 , H01L24/12 , H01L24/48 , H01L25/105 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0557 , H01L2224/05571 , H01L2224/05644 , H01L2224/11822 , H01L2224/13099 , H01L2224/16 , H01L2224/32145 , H01L2224/48227 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H05K3/067 , H05K3/244 , H05K3/3463 , H05K2201/0305 , H05K2203/0361 , H05K2203/1476 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In order to inhibit the connection failure due to the degradation of the connection interface strength of the electrode pad and the warp thereof in the semiconductor device having an electrode pad, a metal layer formed on the electrode pad, and a metal bump formed on the metal layer, in the present invention, gold (Au) is contained in the metal layer, the metal bump is made of solder mainly made of Sn and designed to have an average height H of 100 μm or less per unit area in the electrode pad, and the concentration of Au of the metal layer dissolved in the solder is set to 1.3×10−3 (Vol %) or less. More preferably, the metal bump contains palladium (Pd), and the solder coating for forming the metal bump on the electrode pad is performed by using the dipping and the paste printing in combination.
摘要翻译：为了抑制由于在具有电极焊盘的半导体器件中电极焊盘的连接界面强度的劣化及其翘曲导致的连接故障，形成在电极焊盘上的金属层和形成在金属上的金属凸块在本发明中，在金属层中含有金（Au），金属凸块由主要由Sn制成的焊料制成，并且设计成在电极焊盘中的每单位面积的平均高度H为100mum以下，并且溶解在焊料中的金属层的Au浓度设定为1.3×10 -3（Vol％）以下。更优选地，金属凸块包含钯（Pd），并且通过组合使用浸渍和糊印来进行用于在电极焊盘上形成金属凸块的焊料涂层。

4. 发明申请

US20060151877A1 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US20060151877A1
公开(公告)日：2006-07-13
申请号：US11146044
申请日：2005-06-07
申请人： Shiro Yamashita , Yoichi Abe , Kenichi Yamamoto , Ryosuke Kimoto , Hiroshi Kawakubo
发明人： Shiro Yamashita , Yoichi Abe , Kenichi Yamamoto , Ryosuke Kimoto , Hiroshi Kawakubo
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L23/49816 , H01L24/11 , H01L24/12 , H01L24/48 , H01L25/105 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0557 , H01L2224/05571 , H01L2224/05644 , H01L2224/11822 , H01L2224/13099 , H01L2224/16 , H01L2224/32145 , H01L2224/48227 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H05K3/067 , H05K3/244 , H05K3/3463 , H05K2201/0305 , H05K2203/0361 , H05K2203/1476 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In order to inhibit the connection failure due to the degradation of the connection interface strength of the electrode pad and the warp thereof in the semiconductor device having an electrode pad, a metal layer formed on the electrode pad, and a metal bump formed on the metal layer, in the present invention, gold (Au) is contained in the metal layer, the metal bump is made of solder mainly made of Sn and designed to have an average height H of 100 μm or less per unit area in the electrode pad, and the concentration of Au of the metal layer dissolved in the solder is set to 1.3×10−3 (Vol %) or less. More preferably, the metal bump contains palladium (Pd), and the solder coating for forming the metal bump on the electrode pad is performed by using the dipping and the paste printing in combination.
摘要翻译：为了抑制由于在具有电极焊盘的半导体器件中电极焊盘的连接界面强度的劣化及其翘曲导致的连接故障，形成在电极焊盘上的金属层和形成在金属上的金属凸块在本发明中，在金属层中含有金（Au），金属凸块由主要由Sn制成的焊料制成，并且设计成在电极焊盘中的每单位面积的平均高度H为100mum以下，并且溶解在焊料中的金属层的Au浓度设定为1.3×10 -3（Vol％）以下。更优选地，金属凸块包含钯（Pd），并且通过组合使用浸渍和糊印来进行用于在电极焊盘上形成金属凸块的焊料涂层。

5. 发明授权

US09126934B2 Process for producing 4-carbonyloxyquinoline derivatives 有权
标题翻译： 4-羰基氧基喹啉衍生物的制备方法
公开(公告)号：US09126934B2
公开(公告)日：2015-09-08
申请号：US13885783
申请日：2011-11-16
申请人： Shizuo Shimano , Akinori Morikawa , Kenichi Yamamoto , Hiroki Hotta , Kazumi Yamamoto , Nozomu Nakanishi , Nobuto Minowa
发明人： Shizuo Shimano , Akinori Morikawa , Kenichi Yamamoto , Hiroki Hotta , Kazumi Yamamoto , Nozomu Nakanishi , Nobuto Minowa
IPC分类号： C07D215/38 , C07D215/20 , C07D215/14
CPC分类号： C07D215/20 , C07D215/14 , C07D215/22
摘要： An objective of the present invention is to provide a process for producing 4-carbonyl oxyquinoline derivatives useful as agricultural and horticultural pesticides and fungicides. The objective can be attained by a process for producing 4-carbonyl oxyquinoline derivatives represented by general formula (1), the process including reacting a quinolone derivative with a halogenated compound or an acid anhydride in the presence of a phase transfer catalyst and a base.
摘要翻译：本发明的目的是提供一种用作农业和园艺农药和杀真菌剂的4-羰基氧喹啉衍生物的方法。该目的可以通过制备由通式（1）表示的4-羰基氧喹啉衍生物的方法来实现，该方法包括在相转移催化剂和碱的存在下使喹诺酮衍生物与卤代化合物或酸酐反应。

6. 发明授权

US08538991B2 Information managing apparatus, information managing method, and computer product 有权
标题翻译：信息管理装置，信息管理方法和计算机产品
公开(公告)号：US08538991B2
公开(公告)日：2013-09-17
申请号：US11644644
申请日：2006-12-22
申请人： Kenichi Yamamoto , Hiromi Tanai
发明人： Kenichi Yamamoto , Hiromi Tanai
IPC分类号： G06F17/30
CPC分类号： G06F17/30011 , G06F21/6218 , G06F2221/2145
摘要： A method of a computer, the method including the computer authorizing, not only a first user, but also a second user to access data that is created by the first user and is stored in association with a community. Wherein the first user is registered as a member who belongs to a group, wherein a member belonging to the group is authorized to access data that is accessibly stored for the member of the group, and the second user is defined as a superior of the first user in organization information that indicates hierarchical-relation of users and does not belong to the group. The computer rejects access to the data for an additional user, wherein the additional user has been determined not to be within a publication range of the data, even though the user is within a publication range of the community to which the data belongs.
摘要翻译：一种计算机的方法，所述方法包括计算机不仅授权第一用户，而且授权第二用户访问由第一用户创建并与社区相关联地存储的数据。其中，第一用户被注册为属于组的成员，其中属于该组的成员被授权访问为组的成员可访问地存储的数据，并且将第二用户定义为第一用户的上级用户组织信息，表示用户的层次关系，不属于组。计算机拒绝对附加用户的数据的访问，其中已经确定附加用户不在数据的发布范围内，即使用户位于数据所属的社区的发布范围内。

7. 发明授权

US08399091B2 Pressure-sensitive adhesive sheet 失效
标题翻译：压敏粘合片
公开(公告)号：US08399091B2
公开(公告)日：2013-03-19
申请号：US12791677
申请日：2010-06-01
申请人： Kenichi Yamamoto , Toshihide Suzuki , Shouhei Wada , Mitsuyoshi Shirai , Akiko Takahashi
发明人： Kenichi Yamamoto , Toshihide Suzuki , Shouhei Wada , Mitsuyoshi Shirai , Akiko Takahashi
IPC分类号： B32B7/12
CPC分类号： C09J7/385 , Y10T428/14 , Y10T428/1476 , Y10T428/28 , Y10T428/2804 , Y10T428/2848 , Y10T428/2852 , Y10T428/2891
摘要： An adhesive sheet is provided in which properties that cause corrosion of a non-contacting metal are inhibited. The adhesive sheet is provided with a pressure-sensitive adhesive layer formed from an aqueous dispersion type adhesive composition. The pressure-sensitive adhesive composition contains an aqueous dispersion type acrylic polymer synthesized using a chain transfer agent that does not have sulfur as a composite element thereof. The amount of sulfur-containing gas (as SO42−) released from the pressure-sensitive adhesive sheet in the case of heating for 1 hour at 85° C. is 0.043 μg/1 cm2 or less, adhesive strength on an ABS sheet is 10 N/20 mm or more, and holding time as determined in an 80° C. cohesive strength test is 1 hour or more.
摘要翻译：提供了一种粘合片，其中导致非接触金属腐蚀的性质被抑制。粘合片设置有由水分散型粘合剂组合物形成的压敏粘合剂层。压敏粘合剂组合物含有使用不具有硫作为其复合元素的链转移剂合成的水分散型丙烯酸类聚合物。在85℃下加热1小时的情况下，从压敏粘合片释放的含硫气体（SO42-）为0.043μg/ lcm2以下，ABS板上的粘合强度为10 N / 20mm以上，并且在80℃的内聚强度试验中测定的保持时间为1小时以上。

8. 发明申请

US20130008568A1 HIGH-STRENGTH STEEL SHEET AND METHOD FOR PRODUCING SAME 有权
标题翻译：高强度钢板及其生产方法
公开(公告)号：US20130008568A1
公开(公告)日：2013-01-10
申请号：US13636993
申请日：2011-05-10
申请人： Yoshihiro Suwa , Kenichi Yamamoto , Daisuke Maeda , Satoshi Hirose , Genichi Shigesato , Naoki Yoshinaga
发明人： Yoshihiro Suwa , Kenichi Yamamoto , Daisuke Maeda , Satoshi Hirose , Genichi Shigesato , Naoki Yoshinaga
IPC分类号： B32B15/01 , C22C38/02 , C22C38/04 , C22C38/06 , C22C38/14 , B05D3/02 , C22C38/12 , C22C38/08 , C22C38/34 , C22C38/38 , C22C38/28 , C21D8/02 , C22C38/60
CPC分类号： C21D8/0226 , C21D6/005 , C21D8/0236 , C21D2211/005 , C21D2211/008 , C22C38/001 , C22C38/005 , C22C38/02 , C22C38/04 , C22C38/06 , C22C38/14
摘要： A high-strength steel sheet includes, by mass %, C: 0.03% to 0.30%, Si: 0.08% to 2.1%, Mn: 0.5% to 4.0%, P: 0.05% or less, S: 0.0001% to 0.1%, N: 0.01% or less, acid-soluble Al: more than 0.004% and less than or equal to 2.0%, acid-soluble Ti: 0.0001% to 0.20%, at least one selected from Ce and La: 0.001% to 0.04% in total, and a balance of iron and inevitable impurities, in which [Ce], [La], [acid-soluble Al], and [S] satisfy 0.02≦([Ce]+[La])/[acid-soluble Al]
摘要翻译：高强度钢板以质量％计含有C：0.03％〜0.30％，Si：0.08％〜2.1％，Mn：0.5％〜4.0％，P：0.05％以下，S：0.0001〜0.1％，N：0.01％以下，酸溶性Al：大于0.004％且小于等于2.0％，酸溶性Ti：0.0001〜0.20％，选自Ce和La中的至少一种：0.001〜0.04 [Ce]，[La]，[酸溶性Al]和[S]满足0.02＆nlE（[Ce] + [La]）/ [酸]的铁和不可避免的杂质的平衡在Ce，La，酸可溶性Al和S的质量百分数定义为（Ce）/（La））/ [S]＆nlE; 分别为[Ce]，[La]，[酸溶性Al]和[S]，微结构以面积比计含有1％〜50％的马氏体。

9. 发明申请

US20100305216A1 OPTICALLY ACTIVE MUSCONE COMPOSITION AND FRAGRANCES OR COSMETICS CONTAINING THE SAME 审中-公开
标题翻译：光学有效的麦克风组合物和含有其的香料或化妆品
公开(公告)号：US20100305216A1
公开(公告)日：2010-12-02
申请号：US12853581
申请日：2010-08-10
申请人： Kenichi Yamamoto , Misao Yagi , Hiroyuki Matsuda , Kenji Maruyama
发明人： Kenichi Yamamoto , Misao Yagi , Hiroyuki Matsuda , Kenji Maruyama
IPC分类号： A61K8/35 , A61Q13/00
CPC分类号： C11B9/0038 , C07C45/62 , C07C45/66 , C07C45/676 , C07C49/385 , C07C49/587 , C07C49/12
摘要： (Problem) The object of the invention relates to a development of a new musk-feeling fragrance material which is a highly scenting musk-feeling fragrance, and is to provide a fragrance composition which, when added to fragrances or cosmetics, can improve the fixative property and express a high performance and excellent musky aromatic quality.(Means for resolution) A fragrance composition is prepared using, as the active ingredient, a mixture of (R)-form of optically active muscone with (S)-form of optically active muscone with the mixing ratio thereof within the range of from 90:10 to 95:5 (weight ratio) in terms of weight ratio, or a mixture of (R)-form of optically active muscone with (S)-form of optically active muscone with the mixing ratio thereof within the range of from 75:25 to 80:20 (weight ratio) in terms of weight ratio.
摘要翻译：（问题）本发明的目的在于提供一种香味组合物，该香料组合物在添加到香料或化妆品中时可以改善固色剂的香味组合物表现出高性能，优良的麝香芳香品质。（分辨方法）使用（R）型光学活性肌肉酮与（S）型光学活性肌肉酮的混合物，其混合比例为90，制备香料组合物作为活性成分：10〜95:5（重量比）的重量比，或光学活性肌肉的（R）型与光学活性肌肉的（S）形式的混合物，其混合比在75 ：25〜80:20（重量比）的重量比。

10. 发明授权

US07772970B2 Vehicle display device 有权
标题翻译：车载显示装置
公开(公告)号：US07772970B2
公开(公告)日：2010-08-10
申请号：US11783111
申请日：2007-04-05
申请人： Toshio Masuda , Kenichi Yamamoto , Kenji Hijikata , Satoshi Satomura , Hiroshi Oishi , Toyohide Sunaguchi , Yoshio Iwakami , Munenori Homma , Kouji Kaneda , Atsushi Atake , Tatsuru Fukuda , Masayuki Ushiki , Minoru Yuki , Tsuyoshi Kobayashi , Masahito Motoi , Naoki Shibata , Hiroshi Ogiwara , Katsumasa Igarashi , Junzo Shinozuka , Akihisa Nakamura
发明人： Toshio Masuda , Kenichi Yamamoto , Kenji Hijikata , Satoshi Satomura , Hiroshi Oishi , Toyohide Sunaguchi , Yoshio Iwakami , Munenori Homma , Kouji Kaneda , Atsushi Atake , Tatsuru Fukuda , Masayuki Ushiki , Minoru Yuki , Tsuyoshi Kobayashi , Masahito Motoi , Naoki Shibata , Hiroshi Ogiwara , Katsumasa Igarashi , Junzo Shinozuka , Akihisa Nakamura
IPC分类号： B60Q1/00
CPC分类号： F02D11/105 , B60K2350/1092 , F02D2200/604 , Y02T10/84
摘要： The present invention provides a vehicle display device which can display fuel consumption information of a vehicle in a useful and optimum mode for a driver. A meter_EUC calculates an instantaneous fuel consumption of a vehicle based on a mileage and a fuel injection quantity within a set time, calculates an average fuel consumption of the vehicle based on respective cumulative values of the mileage and the fuel injection quantity repeatedly calculated for every set time, and displays the deviation of the instantaneous fuel consumption with respect to the average fuel consumption as fuel consumption information on a fuel consumption meter. The display on the fuel consumption meter is performed by swinging a pointer with respect to a neutral position. When the deviation takes a positive value, the pointer is swung in the pulse direction with a swinging width corresponding to the deviation quantity, while when the deviation takes a negative value, the pointer is swung in the minus direction with a swinging width corresponding to the deviation quantity.
摘要翻译：本发明提供一种能够以驾驶员的有用且最佳模式显示车辆的燃料消耗信息的车辆显示装置。根据在设定时间内的里程和燃料喷射量计算车辆的瞬时燃料消耗量，根据对于每个集合重复计算的里程和燃料喷射量的累计值，计算出车辆的平均燃料消耗量时间，并且将相对于平均燃料消耗的瞬时燃料消耗的偏差显示为燃料消耗计量器上的燃料消耗信息。通过相对于中立位置摆动指针来执行燃料消耗计的显示。当偏差为正值时，指针以对应于偏差量的摆动宽度在脉冲方向上摆动，而当偏差为负值时，指针以负方向摆动，摆动宽度对应于偏差量。

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