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1. 发明授权

US07538150B2 Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin 有权
标题翻译：含二氢苯并恶嗪环的树脂，酚 - 三嗪 - 醛缩合物和环氧树脂
公开(公告)号：US07538150B2
公开(公告)日：2009-05-26
申请号：US11219821
申请日：2005-09-07
申请人： Kenichi Oohori , Yoshihiro Nakamura , Hikari Murai , Yoshiyuki Takeda , Yasuyuki Hirai , Shinichi Kamoshida , Minoru Kakitani , Norihiro Abe , Syunichi Numata , Teruki Aizawa , Ken Nanaumi
发明人： Kenichi Oohori , Yoshihiro Nakamura , Hikari Murai , Yoshiyuki Takeda , Yasuyuki Hirai , Shinichi Kamoshida , Minoru Kakitani , Norihiro Abe , Syunichi Numata , Teruki Aizawa , Ken Nanaumi
IPC分类号： B32B15/08 , B32B27/04 , B32B27/28 , C08K5/521 , C08L61/08 , C08L63/02 , H05K1/05
CPC分类号： C08L61/34 , B32B27/00 , B32B27/04 , C08G59/226 , C08L63/00 , C08L2205/02 , C08L2205/03 , H05K1/0326 , Y10T428/24636 , Y10T428/24917 , Y10T428/24994 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529 , C08L2666/02 , C08L2666/16 , C08L2666/14 , C08L2666/22
摘要： The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.
摘要翻译：本发明公开了一种热固性树脂组合物，其包含（A）35〜75重量份的含有以苯并恶嗪环作为主成分的化合物的热固性树脂，（B）10〜25重量份的缩聚产物苯酚，具有三嗪环的化合物和醛，和（C）10至45重量份的环氧树脂，基于组分（A），（B）的有机固体组分的总量100重量份，和（C），和（i）重均分子量为1,000〜3000的双酚F环氧树脂，或（ii）双酚F环氧树脂和双酚A环氧树脂的混合环氧树脂，其重均分子量（C）中含有0〜100重量％的组分（C）; 以及预浸料，布线板用层叠板和使用该预浸料的布线基板。

2. 发明申请

US20060008632A1 Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same 有权
标题翻译：热固性树脂组合物和预浸料，布线板用叠层板和使用其的印刷线路板
公开(公告)号：US20060008632A1
公开(公告)日：2006-01-12
申请号：US11219821
申请日：2005-09-07
申请人： Kenichi Oohori , Yoshihiro Nakamura , Hikari Murai , Yoshiyuki Takeda , Yasuyuki Hirai , Shinichi Kamoshida , Minoru Kakitani , Norihiro Abe , Syunichi Numata , Teruki Aizawa , Ken Nanaumi
发明人： Kenichi Oohori , Yoshihiro Nakamura , Hikari Murai , Yoshiyuki Takeda , Yasuyuki Hirai , Shinichi Kamoshida , Minoru Kakitani , Norihiro Abe , Syunichi Numata , Teruki Aizawa , Ken Nanaumi
IPC分类号： B32B27/38 , B32B15/08 , C08L63/00 , B32B27/04
CPC分类号： C08L61/34 , B32B27/00 , B32B27/04 , C08G59/226 , C08L63/00 , C08L2205/02 , C08L2205/03 , H05K1/0326 , Y10T428/24636 , Y10T428/24917 , Y10T428/24994 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529 , C08L2666/02 , C08L2666/16 , C08L2666/14 , C08L2666/22
摘要： The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.
摘要翻译：本发明公开了一种热固性树脂组合物，其包含（A）35〜75重量份的含有以苯并恶嗪环作为主成分的化合物的热固性树脂，（B）10〜25重量份的缩聚产物苯酚，具有三嗪环的化合物和醛，和（C）10至45重量份的环氧树脂，基于组分（A），（B）的有机固体组分的总量100重量份，和（C），和（i）重均分子量为1,000〜3000的双酚F环氧树脂，或（ii）双酚F环氧树脂和双酚A环氧树脂的混合环氧树脂，其重均分子量（C）中含有0〜100重量％的组分（C）; 以及预浸料，布线板用层叠板和使用该预浸料的布线基板。

3. 发明授权

US07041772B2 Method for producing benzoxazine resin 有权
标题翻译：苯并恶嗪树脂的制备方法
公开(公告)号：US07041772B2
公开(公告)日：2006-05-09
申请号：US10471204
申请日：2002-03-12
申请人： Teruki Aizawa , Yasuyuki Hirai , Syunichi Numata
发明人： Teruki Aizawa , Yasuyuki Hirai , Syunichi Numata
IPC分类号： C08G14/04
CPC分类号： C08G14/06
摘要： The present invention discloses a process for producing a benzoxazine resin which comprises the steps of reacting a phenol compound, an aldehyde compound and a primary amine in the presence of an organic solvent to synthesize a benzoxazine resin and removing generated condensation water and the organic solvent from a system under heating and a reduced pressure, wherein a pressure in the reaction system at the time of removal is set to 260 mmHg or higher.
摘要翻译：本发明公开了一种苯并恶嗪树脂的制造方法，其特征在于，在有机溶剂的存在下，使酚化合物，醛化合物和伯胺反应，合成苯并恶嗪树脂，除去生成的冷凝水和有机溶剂在加热和减压下的系统，其中在除去时反应体系中的压力设定为260mmHg以上。

4. 发明授权

US6005064A Thermosetting compounds, cured product thereof and method of preparing the thermosetting compound 失效
标题翻译：热固性化合物，其固化物及其制备方法
公开(公告)号：US6005064A
公开(公告)日：1999-12-21
申请号：US110160
申请日：1998-07-06
申请人： Yasuyuki Hirai , Teruki Aizawa , Yukio Yoshimura
发明人： Yasuyuki Hirai , Teruki Aizawa , Yukio Yoshimura
IPC分类号： C08G14/06 , C08L61/06 , C08G8/04 , C08G14/10
CPC分类号： C08G14/06 , C08L61/06
摘要： A novel thermosetting compound which is speedily curable, generates no by-products during curing and gives cured products having excellent heat resistance and inflammability.A thermosetting compound characterized in containing, per molecule, at least one structural unit represented by the formula (A) and at least one structural unit represented by the formula (B) in a (A)/(B) molar ratio of 1/0.25 to 1/9, said structural units being bonded directly or via at least one organic group with one another; ##STR1## wherein R.sup.1 is a methyl group, a cyclohexyl group, a nonsubstituted phenyl group or a phenyl group substituted with at least one substituent, and each hydrogen atom on the aromatic rings of (A) and (B), except for one of hydrogen atoms on ortho-positions of the hydroxy group in the aromatic ring of (A), may optionally be replaced with a substituent.
摘要翻译：一种新颖的热固性化合物，其可快速固化，在固化过程中不产生副产物，并产生具有优异耐热性和易燃性的固化产物。一种热固性化合物，其特征在于，以（A）/（B）摩尔比为1 / 0.25的比例，每分子含有至少一个式（A）表示的结构单元和至少一个由式（B）表示的结构单元所述结构单元直接或通过至少一个有机基团彼此键合; 其中R1是甲基，环己基，非取代的苯基或被至少一个取代基取代的苯基，以及（A）和（B）的芳环上的每个氢原子，除了氢原子之一（A）的芳环中的羟基的邻位可以任选地被取代基取代。

5. 发明授权

US5945222A Thermosetting resin composition, cured product, prepreg, metal-clad laminate and wiring board 失效
标题翻译：热固性树脂组合物，固化产品，预浸料，覆金属层压板和接线板
公开(公告)号：US5945222A
公开(公告)日：1999-08-31
申请号：US791813
申请日：1997-01-30
申请人： Hideo Nagase , Teruki Aizawa , Yasuyuki Hirai , Yoshihiko Sato
发明人： Hideo Nagase , Teruki Aizawa , Yasuyuki Hirai , Yoshihiko Sato
IPC分类号： C08L61/06 , B32B5/28 , C08G14/073 , C08L61/04 , C08L61/20 , C08L61/22 , C08L61/34 , H05K1/03 , B32B15/08 , B32B3/00
CPC分类号： H05K1/0326 , B32B5/28 , C08L61/34 , C08L61/06 , Y10S428/901 , Y10T428/24917 , Y10T428/31522 , Y10T428/31529
摘要： A thermosetting resin composition (a) comprising 60 to 97% by weight of a thermosetting resin containing dihydrobenzoxazine rings and 3 to 40% by weight of a novolac phenolic resin and a thermosetting resin composition (b) comprising 5 to 30% by weight of the thermosetting resin and 70 to 95% by weight of a novolac phenolic resin are cured fast, and the cured products thereof are excellent in mechanical properties and non-flammability.
摘要翻译：一种热固性树脂组合物（a），其包含60至97重量％的含有二氢苯并恶嗪环的热固性树脂和3至40重量％的酚醛清漆酚醛树脂和热固性树脂组合物（b），其包含5至30重量％热固性树脂和70〜95重量％的酚醛清漆酚醛树脂快速固化，其固化产物的机械性能和不燃性优异。

6. 发明授权

US5280102A Heat-resistant bonding materials 失效
标题翻译：耐热粘接材料
公开(公告)号：US5280102A
公开(公告)日：1994-01-18
申请号：US500503
申请日：1990-03-28
申请人： Haruhiko Matsuyama , Fusaji Shoji , Atsushi Honda , Teruki Aizawa
发明人： Haruhiko Matsuyama , Fusaji Shoji , Atsushi Honda , Teruki Aizawa
IPC分类号： C09J179/08 , H01B3/30 , C08G73/10 , C08G8/02 , C08G69/26
CPC分类号： H01B3/306 , C09J179/08 , Y10T428/31721
摘要： Heat-resistant bonding materials are composed of a polyimide precursor end-capped at molecule ends thereof and/or an imide compound formed from the polyimide precursor. They may also contain fine particles of at least one material selected from metals, metal oxides, metal carbides and metal nitrides.
摘要翻译：耐热接合材料由在其分子末端封端的聚酰亚胺前体和/或由聚酰亚胺前体形成的酰亚胺化合物组成。它们还可以含有选自金属，金属氧化物，金属碳化物和金属氮化物中的至少一种材料的细颗粒。

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