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1. 发明授权

US6055724A Method and device for sealing IC chip 失效
标题翻译：密封IC芯片的方法和装置
公开(公告)号：US6055724A
公开(公告)日：2000-05-02
申请号：US155720
申请日：1998-10-02
申请人： Kenichi Nishino , Shinji Kanayama , Hiroyuki Otani , Kohei Enchi , Hiroyuki Yoshida
发明人： Kenichi Nishino , Shinji Kanayama , Hiroyuki Otani , Kohei Enchi , Hiroyuki Yoshida
IPC分类号： H01L21/60 , H01L21/00 , H01L21/56 , H01L23/28 , H01R43/00 , B23P19/00
CPC分类号： H01L24/27 , H01L21/56 , H01L21/563 , H01L21/67126 , H01L24/28 , H01L2224/73203 , H01L2224/83102 , H01L2224/92125 , H01L2224/92225 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/14 , Y10T29/4913 , Y10T29/49171 , Y10T29/53178
摘要： A method and device for sealing an IC chip are provided, by which a sealing material is surely discharged onto the upper surface of a circuit board, and the occurrence of imperfect sealing can be eliminated. A first gap (h1) is provided between an application nozzle (15) and a circuit board (13) on which an IC chip (12) is mounted before discharging the sealing material (17), after which a second gap (h2) which is greater than the first gap (h1) is provided between the application nozzle (15) and the circuit board (13) while discharging the sealing material (17), thereby accomplishing the sealing of the IC chip (12), and ensuring that the sealing operation is performed after the sealing material (17) has completely come to contact with the upper surface of the circuit board (13).
摘要翻译： PCT No.PCT / JP98 / 00447 Sec。 371日期：1998年10月2日 102（e）1998年10月2日日期PCT提交1998年2月2日PCT公布。第WO98 / 34276号公报日本1998年8月6日提供了一种用于密封IC芯片的方法和装置，通过该方法和装置可靠地将密封材料排出到电路板的上表面上，并且可以消除不完全密封的发生。在排出密封材料（17）之前，在施加喷嘴（15）和安装有IC芯片（12）的电路板（13）之间设置有第一间隙（h1），之后，将第二间隙（h2）大于在排出密封材料（17）时在施加喷嘴（15）和电路板（13）之间提供第一间隙（h1），从而实现IC芯片（12）的密封，并且确保在密封材料（17）完全与电路板（13）的上表面接触之后进行密封操作。

2. 发明授权

US5894657A Mounting apparatus for electronic component 失效
标题翻译：电子元件安装装置
公开(公告)号：US5894657A
公开(公告)日：1999-04-20
申请号：US569937
申请日：1995-12-08
申请人： Shinji Kanayama , Akira Kabeshita , Satoshi Shida , Kohei Enchi , Kenji Takahashi
发明人： Shinji Kanayama , Akira Kabeshita , Satoshi Shida , Kohei Enchi , Kenji Takahashi
IPC分类号： H01L21/50 , H01L21/52 , H05K13/00 , H05K13/02 , H05K13/04 , H05K13/08 , H05K3/30
CPC分类号： H05K13/0408 , H05K13/0069 , H05K13/02 , Y10T29/53091 , Y10T29/53178 , Y10T29/53183 , Y10T29/53191
摘要： An electronic component mounting apparatus includes a feeding device for feeding a to-be-placed element including an electronic component, an anisotropic conductive film, or a paste, a holding device for holding the fed element, an element moving device for supporting and moving the holding device in a first direction and placing the element held by the holding device on a circuit board, and a board moving device for holding and moving the circuit board in a second direction generally at right angles to the first direction where the element moving device is moved.
摘要翻译：一种电子部件安装装置，包括：馈送装置，用于馈送包括电子部件，各向异性导电膜或糊状物的待放置元件，用于保持馈送元件的保持装置;用于支撑和移动的元件移动装置保持装置在第一方向上并且将由保持装置保持的元件放置在电路板上，以及板移动装置，用于沿着与元件移动装置的第一方向成直角的第二方向保持和移动电路板移动了

3. 发明授权

US5582341A Bonding apparatus for terminal component 失效
标题翻译：端子部件用接合装置
公开(公告)号：US5582341A
公开(公告)日：1996-12-10
申请号：US496691
申请日：1995-06-29
申请人： Shinji Kanayama , Akira Kabeshita , Satoshi Ohnakada , Kenichi Nishino , Nobuhiko Muraoka
发明人： Shinji Kanayama , Akira Kabeshita , Satoshi Ohnakada , Kenichi Nishino , Nobuhiko Muraoka
IPC分类号： G02F1/1345 , B23K20/02 , G09F9/00 , H01L23/50 , B23K37/04
CPC分类号： B23K20/023
摘要： A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.
摘要翻译：提供一种端子部件接合装置，其具有用于支撑其上具有端子部件的板的支撑台。具有加热器的压力工具以可移动的方式设置在工作台上方的垂直方向上，以便将端子部件以热和压力结合到板上。沿着压力工具的下表面设置无震动片材，沿着无震动片材的下表面设置用于端子部件的按压板，并且由比无冲击片材的热膨胀系数低的板材制成。

4. 发明授权

US6129203A IC discarding apparatus for flip chip mounting facility 失效
标题翻译：用于倒装芯片安装设备的IC废弃设备
公开(公告)号：US6129203A
公开(公告)日：2000-10-10
申请号：US29391
申请日：1998-02-27
申请人： Hiroyuki Kiyomura , Shinji Kanayama , Nobuya Matsumura , Kenichi Nishino , Kenji Takahashi , Naomi Kainou
发明人： Hiroyuki Kiyomura , Shinji Kanayama , Nobuya Matsumura , Kenichi Nishino , Kenji Takahashi , Naomi Kainou
IPC分类号： H01L21/60 , H05K13/04 , H05K13/08 , B65G23/00
CPC分类号： H05K13/0486
摘要： In a flip-chip mounting equipment, there is provided an IC removal device by which ICs (4) which have been recognized to be removed in error in spite of their faultlessness can be removed in a manner such that they are lined up in a row without being scratched on the surface and without incurring electrostatic destruction. Also the device allows an easy visual checking of the ICs with the objective of reuse. The device comprises a glass plate (2) for carrying ICs (4) and a mechanism for rotating this glass plate (2) at fixed angles, whereby if a recognition error occurs, a bonding head (1) with an IC (4) sucked thereby is moved to an IC removal position on the glass plate (2) and is then lowered until the IC (4) contacts the glass plate (2), thereby removing the IC (4). As a result, the ICs (4) can be lined up in a row without being scratched on the surface and without incurring electrostatic destruction, allowing an easy visual checking of the ICs with the objective of reuse.
摘要翻译： PCT No.PCT / JP97 / 02296 Sec。 371日期1998年2月27日 102（e）1998年2月27日PCT 1997年7月2日PCT公布。公开号WO98 / 01901 日期1998年1月15日在一种倒装芯片安装设备中，提供了一种IC去除装置，通过该IC去除装置，尽管它们的无缺陷已被识别出被错误地去除的IC（4）可以以这样的方式被去除连续排列而不会在表面上划伤而不会导致静电破坏。此外，该器件允许容易地目视检查IC的目的是重新使用。该装置包括用于承载IC（4）的玻璃板（2）和用于以固定角度旋转该玻璃板（2）的机构，由此如果发生识别错误，则吸入IC（4）的接合头（1）从而移动到玻璃板（2）上的IC去除位置，然后降低直到IC（4）接触玻璃板（2），从而去除IC（4）。结果，IC（4）可以排成一行而不会在表面上划伤而不会引起静电破坏，从而允许容易地目视检查IC以便重新使用。

5. 发明授权

US06467670B2 Method and apparatus for mounting component 失效
标题翻译：组件安装方法和装置
公开(公告)号：US06467670B2
公开(公告)日：2002-10-22
申请号：US09756307
申请日：2001-01-08
申请人： Kazushi Higashi , Hiroyuki Otani , Shozo Minamitani , Shinji Kanayama , Kenji Takahashi
发明人： Kazushi Higashi , Hiroyuki Otani , Shozo Minamitani , Shinji Kanayama , Kenji Takahashi
IPC分类号： B23K2012
CPC分类号： H01L21/563 , B23K20/10 , B23K2101/40 , H01L21/67126 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75355 , H01L2224/75743 , H01L2224/75801 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/83862 , H01L2224/83874 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01039 , H01L2924/014 , H01L2924/14 , H01L2224/13099 , H01L2924/00 , H01L2224/05599
摘要： Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.
摘要翻译：密封剂11预先被供给到部件3的电接合区域5,6和安装表面4中，并且当部件3与安装表面4接触时，密封剂11被压缩和填充在所需区域之间。同时，对组件3施加超声波振动，以在组件3的电接合区域5,6和安装表面4之间产生摩擦力，彼此紧密接触，使得两个电接合区域5,6被熔化并超声波接合在一起，从而将部件3安装在安装面4上。

6. 发明授权

US07220922B2 Electronic component, component mounting equipment, and component mounting method 有权
标题翻译：电子部件，部件安装设备和部件安装方法
公开(公告)号：US07220922B2
公开(公告)日：2007-05-22
申请号：US10399915
申请日：2001-10-23
申请人： Kenichi Nishino , Shinji Kanayama , Shinjiro Tsuji , Masayuki Ida , Tomotaka Nishimoto
发明人： Kenichi Nishino , Shinji Kanayama , Shinjiro Tsuji , Masayuki Ida , Tomotaka Nishimoto
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： G02F1/13452 , H01L2924/0002 , H01R4/04 , H01R12/62 , H01R12/7076 , H05K1/118 , H05K1/189 , H05K3/361 , H05K13/046 , Y10T29/49144 , Y10T156/17 , Y10T156/1744 , H01L2924/00
摘要： Component mounting equipment mounts an FPC board onto an LCD board. The LCD board has a first electrode section on one side edge and a second electrode section on another side edge. The FPC board has a first section on one side edge and a second section on another side edge. A first mounting apparatus mounts the first section on the first electrode section. A second mounting apparatus mounts the second section on the second electrode section. In the second component mounting apparatus, the second section is separated from the second electrode section at an ACF supply section and released at a pre-press bonding section.
摘要翻译：组件安装设备将FPC板安装在LCD板上。 LCD板具有在一个侧边缘上的第一电极部分和在另一个侧边缘上的第二电极部分。 FPC基板具有在一个侧边缘上的第一部分和在另一个侧边缘上的第二部分。第一安装装置将第一部分安装在第一电极部分上。第二安装装置将第二部分安装在第二电极部分上。在第二部件安装装置中，第二部分在ACF供给部分与第二电极部分分离，并在预压接合部分处被释放。

7. 发明授权

US06647616B1 Bump bonding unit with tray storage and transport apparatuses 失效
标题翻译：具有托盘存储和运输设备的凸块接合单元
公开(公告)号：US06647616B1
公开(公告)日：2003-11-18
申请号：US09446031
申请日：1999-12-15
申请人： Nobuya Matsumura , Hiroyuki Kiyomura , Kenichi Nishino , Kenji Takahashi , Shinji Kanayama
发明人： Nobuya Matsumura , Hiroyuki Kiyomura , Kenichi Nishino , Kenji Takahashi , Shinji Kanayama
IPC分类号： B23P2100
CPC分类号： H01L21/67144 , H01L21/67763 , H01L21/67769 , H05K13/021 , Y10T29/53174 , Y10T29/53313 , Y10T29/53317
摘要： A bump bonding unit is disclosed including a novel storage, transport, and feed system for allocating trays that hold IC chips to various operations of the bump bonding unit. The bump bonding unit includes fist and second tray storage and feed apparatuses that transport trays from empty stacks to full stacks and vice versa, and a transfer head for picking up an IC chip without a bump formed thereon and moving the IC chip to a bump formation location, and for picking up the IC chip with the bump formed thereon and moving the IC chip to a storage location. The bump bonding unit also includes a bump forming unit for forming the bump on the IC chip. Each tray storage apparatus includes a carrier that moves vertically to position a stack of trays, a tray receiver that cooperates with the carrier to support a lowermost tray in the respective stack of trays, and tray holder to support and release a tray supported by the tray receiver.
摘要翻译：公开了一种凸块焊接单元，其包括用于分配托盘的新颖的存储，输送和馈送系统，其将IC芯片保持在凸块接合单元的各种操作。凸块接合单元包括将托盘从空堆栈传送到全堆叠的第一和第二托盘存储和进给装置，反之亦然，以及用于拾取IC芯片而没有形成凸块的转移头，并将IC芯片移动到凸块形成位置，并且用于拾取IC芯片，其上形成有凸块并将IC芯片移动到存储位置。凸块接合单元还包括用于在IC芯片上形成凸块的凸块形成单元。每个托盘存储装置包括一个托架，该托架垂直移动以定位托盘堆叠;托盘托架，其与托架配合以支撑相应堆叠的托盘中的最下托盘;以及托盘托架，用于支撑和释放由托盘支撑的托盘接收器。

8. 发明授权

US5462626A Method of bonding an external lead and a tool therefor 失效
标题翻译：接合外部引线及其工具的方法
公开(公告)号：US5462626A
公开(公告)日：1995-10-31
申请号：US98813
申请日：1993-07-29
申请人： Shinji Kanayama , Akira Kabeshita , Kenichi Nishino , Satoshi Ohnakada , Takahiko Murata , Kazuhiro Kimura , Kazuto Nishida
发明人： Shinji Kanayama , Akira Kabeshita , Kenichi Nishino , Satoshi Ohnakada , Takahiko Murata , Kazuhiro Kimura , Kazuto Nishida
IPC分类号： H05K3/34 , H05K3/36 , H05K13/04 , B32B31/00
CPC分类号： H05K3/363 , H05K13/0465 , H05K2201/0394 , H05K2201/064 , H05K2201/10681 , H05K2203/0195 , H05K2203/107 , H05K3/3421 , H05K3/3494
摘要： A bonding method of for external leads which includes the steps of registering the external leads of an IC component with electrodes of a circuit substrate, setting an external lead retaining surface of a bonding tool on a flat outer tab obtained by coating plural outer end parts of the external leads of the registered IC component with resin, and bringing the external leads in touch with the corresponding electrodes. A laster beam irradiates one of the external leads registered on one of the electrodes to thereby bond them, and cooling gas is jetted on a bonding part of the external lead to cool a bonding part of the external lead and the electrode. During the irradiating step, the one of the external leads registered on one of the corresponding electrodes can be pressed against the electrode to bond the bonding part of the electrode and the external lead. A bonding tool which is used in the method includes a wall having an external lead retaining surface for being set on the flat outer tab and pressing one of the external leads, to bring the one of the external leads into touch with the corresponding one of the electrodes. A laser beam passage is provided in the bonding tool through which a laser beam is irradiated to an external lead bonding part, and a gas passage is also provided, through which cooling gas is jetted on to the external lead bonding part to cool the bonding part of the external lead and the electrode.
摘要翻译：一种用于外部引线的接合方法，包括以下步骤：将IC部件的外部引线与电路基板的电极对准，将焊接工具的外部引线保持面设置在通过涂覆多个外部端部使用树脂的注册的IC部件的外部引线，并且使外部引线与相应的电极接触。灯光束照射登记在一个电极上的一个外部引线，从而将它们接合，并且将冷却气体喷射到外部引线的接合部分上，以冷却外部引线和电极的接合部分。在照射步骤期间，登记在一个相应的电极上的外部引线中的一个可以被压在电极上，以将电极的接合部分和外部引线接合。在该方法中使用的接合工具包括具有外部引线保持表面的壁，用于设置在平坦的外部突片上并按压外部引线之一，以使外部引线中的一个与相应的一个引线保持接触电极。激光束通道设置在接合工具中，激光束通过该激光束照射到外部引线接合部分，并且还设置有气体通道，冷却气体通过该通道喷射到外部引线接合部分以冷却接合部分的外部引线和电极。

9. 发明授权

US06193136B1 Component mounting method and apparatus 有权
标题翻译：组件安装方法和装置
公开(公告)号：US06193136B1
公开(公告)日：2001-02-27
申请号：US09373957
申请日：1999-08-13
申请人： Kazushi Higashi , Hiroyuki Otani , Shozo Minamitani , Shinji Kanayama , Kenji Takahashi
发明人： Kazushi Higashi , Hiroyuki Otani , Shozo Minamitani , Shinji Kanayama , Kenji Takahashi
IPC分类号： B23K106
CPC分类号： H01L21/563 , B23K20/10 , B23K2101/40 , H01L21/67126 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75355 , H01L2224/75743 , H01L2224/75801 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/83862 , H01L2224/83874 , H01L2224/92125 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01039 , H01L2924/014 , H01L2924/14 , H01L2224/13099 , H01L2924/00 , H01L2224/05599
摘要： Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.
摘要翻译：密封剂11预先被供给到部件3的电接合区域5,6和安装表面4中，并且当部件3与安装表面4接触时，密封剂11被压缩和填充在所需区域之间。同时，对组件3施加超声波振动，以在组件3的电接合区域5,6和安装表面4之间产生摩擦力，彼此紧密接触，使得两个电接合区域5,6被熔化并超声波接合在一起，从而将部件3安装在安装面4上。

10. 发明授权

US06830989B1 Method and apparatus for handling arrayed part 失效
标题翻译：排列部件的处理方法和装置
公开(公告)号：US06830989B1
公开(公告)日：2004-12-14
申请号：US10069401
申请日：2002-02-26
申请人： Satoshi Shida , Shinji Kanayama , Takashi Shimizu , Kenji Takahashi , Ryoji Inutsuka , Hiroyuki Yoshida
发明人： Satoshi Shida , Shinji Kanayama , Takashi Shimizu , Kenji Takahashi , Ryoji Inutsuka , Hiroyuki Yoshida
IPC分类号： H01L21301
CPC分类号： H01L21/67271 , H01L21/67144
摘要： Handling of each arrayed component is implemented in pickup operation within a movement range of a supporting body against the size of a supporting region of the arrayed component smaller than that in the prior art. Each component supported on a supporting body in array is moved to a pickup position with a movement of the supporting body in X and Y two component array directions, and is fed to pickup operation by a tool with push-up operation by a push-up pin involved, in which after each unit region (D1 to D4) dividedly set around the pickup position of the supporting body is positioned at a pickup standby position by rotation of the supporting body in a switching manner, the component in the positioned unit region is moved in each component array direction of the supporting body and fed to pickup operation in sequence.
摘要翻译：在支撑体的移动范围内，在阵列部件的支撑区域的尺寸小于现有技术的尺寸的情况下，每个排列的部件的处理被实现在支撑体的运动范围内的拾取操作。支撑在阵列中的支撑体上的每个部件通过支撑体在X和Y两个分量阵列方向上的移动而被移动到拾取位置，并且通过具有由上推的上推操作的工具进给到拾取操作引脚，其中通过以切换方式旋转支撑体而将支撑体的拾取位置分开设置的每个单位区域（D1至D4）定位在拾取备用位置，定位单元区域中的部件为在支撑体的每个分量阵列方向上移动并依次馈送到拾取操作。

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