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1. 发明申请

US20100100217A1 Control System and Method for Controlled Object in Time Variant System With Dead Time, Such As Single Crystal Production Device by Czochralski Method 有权
标题翻译：时间变量系统中控制对象的控制系统和方法，如Czochralski法等单晶生产装置
公开(公告)号：US20100100217A1
公开(公告)日：2010-04-22
申请号：US11989749
申请日：2006-06-07
申请人： Kenichi Bandoh , Shigeo Morimoto , Takuji Okumura , Tetsu Nagata , Masaru Shimada , Junsuke Tomioka , Yutaka Shiraishi , Takeshi Kodama
发明人： Kenichi Bandoh , Shigeo Morimoto , Takuji Okumura , Tetsu Nagata , Masaru Shimada , Junsuke Tomioka , Yutaka Shiraishi , Takeshi Kodama
IPC分类号： G05B13/04 , G05B13/02
CPC分类号： C30B15/20 , C30B29/06
摘要： To accurately control controlled object in a time variant system with a dead time such as a Czochralski method single crystal production device (CZ equipment). The dead time, the time constant, and the process gain value of a controlled object (CZ equipment) (200) are set. The process gain preset value has specified time variant characteristics. An output value y and its first-order and second-order time differentiated values are used as the state variable x of the controlled object (200). A nonlinear state predicting unit (206) predicts a state variable value x(t+Ld) at a future point in time after the dead time, based upon the current output value y, the dead time, the time constant, and the process gain preset value. A gain scheduled sliding mode control unit (212) performs a gain scheduled sliding mode control operation based upon the state variable value x(t+Ld) at the predicted future point in time, an output deviation z(t+Ld) at the future point in time, the time constant, and the set value of the process gain at the future point in time, to determine the manipulated variable uT of the controlled object (200).
摘要翻译：在具有死区时间的时变系统中精确控制受控对象，例如Czochralski方法单晶生产装置（CZ设备）。设定受控对象（CZ设备）（200）的死区时间，时间常数和过程增益值。过程增益预设值具有指定的时变特征。使用输出值y及其一阶和二阶时间微分值作为受控对象（200）的状态变量x。非线性状态预测单元（206）基于当前输出值y，死区时间，时间常数和处理增益来预测死区时间后的未来时间点的状态变量值x（t + Ld）预设值。增益调度滑动模式控制单元（212）基于预测的未来时间点的状态变量值x（t + Ld），未来的输出偏差z（t + Ld），执行增益调度滑动模式控制操作时间常数和未来时间点处理增益的设定值，以确定受控对象（200）的操纵变量uT。

2. 发明授权

US08150784B2 Control system and method for controlled object in time variant system with dead time, such as single crystal production device by czochralski method 有权
标题翻译：时变系统中受控对象的控制系统和方法，如单晶生产装置，采用切克劳斯基法
公开(公告)号：US08150784B2
公开(公告)日：2012-04-03
申请号：US11989749
申请日：2006-06-07
申请人： Kenichi Bandoh , Shigeo Morimoto , Takuji Okumura , Tetsu Nagata , Masaru Shimada , Junsuke Tomioka , Yutaka Shiraishi , Takeshi Kodama
发明人： Kenichi Bandoh , Shigeo Morimoto , Takuji Okumura , Tetsu Nagata , Masaru Shimada , Junsuke Tomioka , Yutaka Shiraishi , Takeshi Kodama
IPC分类号： G06E1/00 , G06E3/00 , G06F15/18 , G06G7/00
CPC分类号： C30B15/20 , C30B29/06
摘要： A device controls an object in a time variant system with a dead time such as a Czochralski method single crystal production device (CZ equipment). The dead time, time constant, and process gain value of an object (CZ equipment) are set. The process gain preset value has time variant characteristics. An output value and its first-order and second-order time differentiated values serve as the state variable. A nonlinear state predicting unit predicts a state variable value at a future time, based upon the current output value, dead time, time constant, and process gain preset value. A gain scheduled sliding mode control unit performs a gain scheduled sliding mode control operation based upon the state variable value at the future time, an output deviation at the future time, the time constant, and the set value of the process gain at the future time, to determine the manipulated variable of the object.
摘要翻译：设备控制具有死区时间的时变系统中的对象，如Czochralski方法单晶生产设备（CZ设备）。设置物体（CZ设备）的死区时间，时间常数和过程增益值。过程增益预设值具有时变特征。输出值及其一阶和二阶时间微分值作为状态变量。非线性状态预测单元基于当前输出值，死区时间，时间常数和过程增益预设值来预测未来时间的状态变量值。增益调度滑动模式控制单元基于未来时间的状态变量值，未来时间的输出偏差，时间常数和未来时间的处理增益的设定值来执行增益调度滑模控制操作，以确定对象的操纵变量。

3. 发明授权

US06626236B1 Substrate temperature control plate and substrate temperature control apparatus comprising same 失效
标题翻译：基板温度控制板及其基板温度控制装置
公开(公告)号：US06626236B1
公开(公告)日：2003-09-30
申请号：US09531684
申请日：2000-03-20
申请人： Kenichi Bandoh , Akihiro Ohsawa , Mikio Minonishi
发明人： Kenichi Bandoh , Akihiro Ohsawa , Mikio Minonishi
IPC分类号： F24F300
CPC分类号： H01L21/67248
摘要： Object of the present invention is to provide uniform heat distribution to a substrate undergoing heat treatment on top of a heat exchange plate. A heat exchange plate 1 is a flat, circular receptacle, has a cooling liquid inflow opening 11 on one end and outflow opening 13 on the other end, and cooling liquid flows on the inside. The surface of the plate 1 is divided, for example, into four zones having different heat capacities and heat transfer characteristics, and an independently controllable foil heater 21A, 23A, 25A, 27A is attached to each zone. Heater 21A covers a zone, which circumferentially surrounds a substrate placed on top of a plate, heater 23A covers a zone directly beneath a substrate, heater 25A covers a zone of the vicinity of the outflow opening 13, and heater 27A covers a zone of the vicinity of the inflow opening 11. Temperature sensors 31-33 are disposed on the inside of a plate at four locations of a second zone, which are apt to receive the affects of the first to fourth zones. Based on each plate temperature detected by the temperature sensors 31 to 33, a temperature of the substrate at a location corresponding thereto is estimated.
摘要翻译：本发明的目的是提供对热交换板顶部经受热处理的基板的均匀的热分布。热交换板1是平坦的圆形容器，一端具有冷却液流入口11，另一端具有流出口13，冷却液在内部流动。板1的表面例如被分成具有不同热容和传热特性的四个区域，并且独立可控的箔加热器21A，23A，25A，27A附接到每个区域。加热器21A覆盖周边围绕放置在板顶部的基板的区域，加热器23A覆盖基底正下方的区域，加热器25A覆盖流出开口13附近的区域，加热器27A覆盖温度传感器31-33在第二区域的四个位置处设置在板的内部，其容易受到第一至第四区域的影响。基于由温度传感器31至33检测到的每个板温度，估计与其对应的位置处的基板的温度。

4. 发明授权

US08191792B2 Temperature sensor, temperature control device, temperature controller and temperature-control method 有权
标题翻译：温度传感器，温度控制装置，温度控制器和温度控制方法
公开(公告)号：US08191792B2
公开(公告)日：2012-06-05
申请号：US11825065
申请日：2007-07-03
申请人： Kenichi Bandoh
发明人： Kenichi Bandoh
IPC分类号： F24F11/053 , G05D23/12 , G05D23/185 , G01N25/72 , G01K1/00 , G01K7/00
CPC分类号： G01K1/143 , G01K7/186 , G05D23/1919 , G05D23/22
摘要： A temperature sensor (10) includes: a temperature-sensing portion for measuring a temperature of an object (50) by contacting the object; and a supporting portion for supporting the temperature-sensing portion from a side opposite to a contact surface, the supporting portion having a space at a portion partially corresponding to the temperature-sensing portion. A temperature controller includes: a temperature control device; the temperature sensor (10) for measuring the temperature by contacting the object (50); and a controller for controlling the temperature control device. The controller includes: a mounting-state judging means for judging a mounting-state of the object (50); a switching means for switching a control gain and a target temperature of the temperature control device based on the judging result; and a control-command generating means for generating a control command based on the control gain, the target temperature and a measurement value of the temperature sensor (10).
摘要翻译：温度传感器（10）包括：温度检测部分，用于通过接触物体来测量物体（50）的温度; 以及用于从与接触表面相对的一侧支撑温度检测部分的支撑部分，所述支撑部分在部分对应于温度感测部分的部分具有空间。温度控制器包括：温度控制装置; 用于通过接触物体（50）来测量温度的温度传感器（10）; 以及用于控制温度控制装置的控制器。控制器包括：安装状态判断装置，用于判断物体（50）的安装状态; 切换装置，用于根据判断结果切换温度控制装置的控制增益和目标温度; 以及控制指令发生装置，用于基于控制增益，目标温度和温度传感器（10）的测量值产生控制命令。

5. 发明申请

US20080043803A1 Temperature sensor, temperature control device, temperature controller and temperature-control method 有权
标题翻译：温度传感器，温度控制装置，温度控制器和温度控制方法
公开(公告)号：US20080043803A1
公开(公告)日：2008-02-21
申请号：US11825065
申请日：2007-07-03
申请人： Kenichi Bandoh
发明人： Kenichi Bandoh
IPC分类号： H01L21/66 , G01K1/00
CPC分类号： G01K1/143 , G01K7/186 , G05D23/1919 , G05D23/22
摘要： A temperature sensor (10) includes: a temperature-sensing portion for measuring a temperature of an object (50) by contacting the object; and a supporting portion for supporting the temperature-sensing portion from a side opposite to a contact surface, the supporting portion having a space at a portion partially corresponding to the temperature-sensing portion. A temperature controller includes: a temperature control device; the temperature sensor (10) for measuring the temperature by contacting the object (50); and a controller for controlling the temperature control device. The controller includes: a mounting-state judging means for judging a mounting-state of the object (50); a switching means for switching a control gain and a target temperature of the temperature control device based on the judging result; and a control-command generating means for generating a control command based on the control gain, the target temperature and a measurement value of the temperature sensor (10).
摘要翻译：温度传感器（10）包括：温度检测部分，用于通过接触物体来测量物体（50）的温度; 以及用于从与接触表面相对的一侧支撑温度检测部分的支撑部分，所述支撑部分在部分对应于温度感测部分的部分处具有空间。温度控制器包括：温度控制装置; 用于通过接触物体（50）来测量温度的温度传感器（10）; 以及用于控制温度控制装置的控制器。控制器包括：安装状态判断装置，用于判断物体（50）的安装状态; 切换装置，用于根据判断结果切换温度控制装置的控制增益和目标温度; 以及控制指令发生装置，用于基于控制增益，目标温度和温度传感器（10）的测量值产生控制命令。

6. 发明授权

US08399811B2 Stage for substrate temperature control apparatus 有权
标题翻译：基板温度控制装置的阶段
公开(公告)号：US08399811B2
公开(公告)日：2013-03-19
申请号：US12596755
申请日：2008-03-28
申请人： Kenichi Bandoh , Katsuo Saio , Kazuhiko Kubota
发明人： Kenichi Bandoh , Katsuo Saio , Kazuhiko Kubota
IPC分类号： H05B3/68
CPC分类号： H01L21/67103
摘要： A stage for a substrate temperature control apparatus having high reliability at low cost by preventing thermal deformation of a plate while employing a material other than ceramics as a material of the plate. The stage is used for mounting a substrate in the substrate temperature control apparatus for controlling a temperature of the substrate, and the stage includes: a plate having a first surface facing the substrate and a second surface opposite to the first surface; and a planar heater bonded to the second surface of the plate, wherein surface treatment is performed in a first thickness on the first surface of the plate, and the surface treatment is performed in a second thickness thinner than the first thickness or no surface treatment is performed on a predetermined area of the second surface of the plate.
摘要翻译：通过在采用陶瓷以外的材料作为板的材料的同时防止板的热变形，以低成本具有高可靠性的基板温度控制装置的阶段。该台用于将基板安装在用于控制基板的温度的基板温度控制装置中，并且该台包括：具有面向基板的第一表面和与第一表面相对的第二表面的板; 以及结合到所述板的第二表面的平面加热器，其中在所述板的第一表面上以第一厚度进行表面处理，并且所述表面处理以比所述第一厚度更薄的第二厚度进行或者不进行表面处理在板的第二表面的预定区域上执行。

7. 发明申请

US20100271603A1 STAGE FOR SUBSTRATE TEMPERATURE CONTROL APPARATUS 审中-公开
标题翻译：基板温度控制装置的阶段
公开(公告)号：US20100271603A1
公开(公告)日：2010-10-28
申请号：US12747291
申请日：2008-12-15
申请人： Kenichi Bandoh , Jun Sasaki
发明人： Kenichi Bandoh , Jun Sasaki
IPC分类号： G03B27/52
CPC分类号： H05B3/143 , H01L21/67248 , H01L21/68735
摘要： A stage for substrate temperature control apparatus in which an extent of a transient temperature distribution that occurs when a substrate is heated or cooled can be reduced in comparison with the conventional one. The stage for substrate temperature control apparatus is a stage to be used for mounting a substrate having a predetermined diameter in a predetermined position in a substrate temperature control apparatus for controlling a temperature of the substrate, and includes: a plate formed with a step part, which is lower than a center part, on a first surface facing the substrate in a region including a position corresponding to an edge of the substrate; and a temperature control unit provided on a second surface opposite to the first surface of the plate.
摘要翻译：与现有技术相比，可以减少衬底温度控制装置的阶段，其中当衬底被加热或冷却时发生的瞬态温度分布的程度可以减小。基板温度控制装置的载台是用于将预定直径的基板在预定位置安装在用于控制基板的温度的基板温度控制装置中的阶段，并且包括：形成有台阶部分的板，在与包括与基板的边缘相对应的位置的区域中的面向基板的第一表面上，其低于中心部分; 以及设置在与所述板的第一表面相对的第二表面上的温度控制单元。

8. 发明申请

US20100133256A1 STAGE FOR SUBSTRATE TEMPERATURE CONTROL APPARATUS 有权
标题翻译：基板温度控制装置的阶段
公开(公告)号：US20100133256A1
公开(公告)日：2010-06-03
申请号：US12596755
申请日：2008-03-28
申请人： Kenichi Bandoh , Katsuo Saio , Kazuhiko Kubota
发明人： Kenichi Bandoh , Katsuo Saio , Kazuhiko Kubota
IPC分类号： H05B1/02 , H05B3/68 , H05B3/16
CPC分类号： H01L21/67103
摘要： A stage for a substrate temperature control apparatus having high responsibility at low cost by preventing thermal deformation of a plate while employing a material other than ceramics as a material of the plate. The stage for a substrate temperature control apparatus is a stage to be used for mounting a substrate in the substrate temperature control apparatus for controlling a temperature of the substrate, and the stage includes: a plate having a first surface facing the substrate and a second surface opposite to the first surface; and a planar heater bonded to the second surface of the plate, wherein surface treatment is performed in a first thickness on the first surface of the plate, and the surface treatment is performed in a second thickness thinner than the first thickness or no surface treatment is performed on a predetermined area of the second surface of the plate.
摘要翻译：通过在采用陶瓷以外的材料作为板的材料的同时防止板的热变形，以低成本承担高负责的基板温度控制装置的阶段。基板温度控制装置的平台是用于将基板安装在用于控制基板的温度的基板温度控制装置中的阶段，并且台架包括：板，其具有面向基板的第一表面和第二表面与第一表面相对; 以及结合到所述板的第二表面的平面加热器，其中在所述板的第一表面上以第一厚度进行表面处理，并且所述表面处理以比所述第一厚度更薄的第二厚度进行或者不进行表面处理在板的第二表面的预定区域上执行。

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