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    • 10. 发明授权
    • Semiconductor device and method for manufacturing the semiconductor device
    • 半导体装置及其制造方法
    • US08021917B2
    • 2011-09-20
    • US12612006
    • 2009-11-04
    • Kengo AkimotoMasashi Tsubuku
    • Kengo AkimotoMasashi Tsubuku
    • H01L21/84
    • H01L29/7869H01L27/1225H01L29/41733
    • An object is to suppress deterioration of element characteristics even when an oxide semiconductor is formed after a gate insulating layer, a source electrode layer, and a drain electrode layer are formed. A gate electrode layer is formed over a substrate. A gate insulating layer is formed over the gate electrode layer. A source electrode layer and a drain electrode layer are formed over the gate insulating layer. Surface treatment is performed on surfaces of the gate insulating layer, the source electrode layer, and the drain electrode layer which are formed over the substrate. After the surface treatment is performed, an oxide semiconductor layer is formed over the gate insulating layer, the source electrode layer, and the drain electrode layer.
    • 即使在形成了栅极绝缘层,源极电极层和漏极电极层之后形成氧化物半导体,也是要抑制元件特性的劣化。 在基板上形成栅极电极层。 在栅电极层上形成栅极绝缘层。 源极电极层和漏电极层形成在栅绝缘层上。 在形成在基板上的栅极绝缘层,源极电极层和漏极电极层的表面上进行表面处理。 在进行表面处理之后,在栅极绝缘层,源极电极层和漏极电极层上形成氧化物半导体层。