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    • 1. 发明授权
    • Membrane probing of circuits
    • 电路膜探测
    • US5847571A
    • 1998-12-08
    • US675416
    • 1996-07-03
    • Ken Kuang-Fu LiuByoung-Youl MinKunio SanoTakashi Sato
    • Ken Kuang-Fu LiuByoung-Youl MinKunio SanoTakashi Sato
    • G01R1/073H01L21/66
    • G01R1/0735
    • First and second bumps electrically connected at first and second positions along a conductive run borne by a flexible substrate are respectively oriented for contact with a pad of a die under test and a pad of a tester. A probe frame is bonded to the substrate between connector frames bonded at opposite ends of the substrate. Alternatively, a pair of bumps exposed on the same surface of a flexible substrate are electrically connected at different positions along a conductive run. One of the bumps is oriented for contact with a pad of a die under test, and the other is in contact with a pad on a surface of a printed circuit board directed away from the die. The pad of the printed circuit board is provided for electrical connection to a tester.
    • 沿着沿着由柔性基板传导的导体的第一和第二位置电连接的第一和第二凸起分别被定向成与被测试模具的焊盘和测试仪的焊盘接触。 探针架结合在衬底的相对两端的连接器框架之间的基片上。 或者,暴露在柔性基板的相同表面上的一对凸块在导电性行程的不同位置电连接。 凸块中的一个被定向成与待测试的模具的焊盘接触,另一个与印刷电路板的远离模具的表面上的焊盘接触。 印刷电路板的焊盘被提供用于电连接到测试仪。
    • 2. 发明授权
    • Apparatus for aligning a semiconductor wafer with an inspection contactor
    • 用于使半导体晶片与检查接触器对准的装置
    • US5999268A
    • 1999-12-07
    • US950832
    • 1997-10-15
    • Toshihiro YonezawaKunio SanoTakashi Sato
    • Toshihiro YonezawaKunio SanoTakashi Sato
    • G01R31/28G01B11/00G01R31/02
    • G01R31/2887
    • An aligning apparatus includes a first image pickup camera for picking up an image of an inspection contactor, a moving body located so as to be movable in X-, Y-, Z- and .theta.-directions and having the first image pickup camera fixed thereon, a wafer bearer capable of being located on the moving body and supporting a semiconductor wafer, a control circuit for controlling movements of the moving body moved in the individual directions, and a second image pickup camera for picking up an image of the semiconductor wafer on the bearer moving under the control of the control circuit. Positions for the first and second image pickup cameras to pick up the images are stored, the first image pickup camera picks up an image of the contact, the position of the contact is stored, the second image pickup camera picks up an image of an electrode of a chip corresponding to the contact, the position of the electrode is stored, and then the contact and the electrode are aligned with each other in accordance with the respective positions of the contact and the electrode.
    • 对准装置包括用于拾取检查接触器的图像的第一图像拾取相机,位于X,Y,Z和Y方向上可移动并且第一图像拾取相机固定在其上的移动体 ,能够位于移动体上并支撑半导体晶片的晶片载体,用于控制沿各个方向移动的移动体的运动的控制电路和用于拾取半导体晶片的图像的第二图像拾取相机 承载在控制电路的控制下移动。 存储用于拾取图像的第一和第二图像拾取相机的位置,第一图像拾取相机拾取接触的图像,存储接触的位置,第二图像拾取相机拾取电极的图像 与电极对应的芯片,存储电极的位置,然后根据触点和电极的相应位置使触点和电极彼此对准。
    • 4. 发明授权
    • Method and apparatus for inspecting semiconductor integrated circuits,
and contactor incorporated in the apparatus
    • 用于检查半导体集成电路的方法和装置以及包含在该装置中的接触器
    • US6084419A
    • 2000-07-04
    • US28091
    • 1998-02-23
    • Takashi SatoKunio Sano
    • Takashi SatoKunio Sano
    • G01R31/28G01R31/02G01R1/04G01R31/302
    • G01R31/2886
    • A wafer inspecting apparatus inspects the electric characteristics of IC chips of a wafer W. The inspection is carried out by simultaneously examining the inspecting electrodes of all IC chips in a contact manner in the state where the wafer W is held on the main chuck. The wafer inspecting apparatus is provided with a contactor, and this contactor is made up of a first contactor, a second contactor and a driving mechanism. The first contactor has a large number of contact projections on the lower surface thereof and a large number of contact electrodes on the entire upper surface thereof. The contact projections are brought into simultaneous contact with the inspecting electrodes. The contact electrodes are electrically connected to the contact projections, respectively. The second contactor has a number of contact elements, such as pogo-pins, which are brought into contact with the contact electrodes of the first contactor. The second contactor is movable, and the driving mechanism moves this second contactor in the X- and Y-directions in such a manner that the contact elements and the contact electrodes are sequentially brought into contact with each other. The contactor may include a third contactor as well. The third contactor is arranged between the first contactor and the wafer W.
    • 晶片检查装置检查晶片W的IC芯片的电特性。通过在将晶片W保持在主卡盘上的状态下以接触方式同时检查所有IC芯片的检查电极来进行检查。 晶片检查装置设有接触器,该接触器由第一接触器,第二接触器和驱动机构构成。 第一接触器在其下表面上具有大量接触突起,并且在其整个上表面上具有大量的接触电极。 接触突起与检查电极同时接触。 接触电极分别与接触突起电连接。 第二接触器具有与第一接触器的接触电极接触的多个接触元件,例如弹簧销。 第二接触器是可移动的,并且驱动机构使得第二接触器在X方向和Y方向上移动,使得接触元件和接触电极相互接触。 接触器也可以包括第三接触器。 第三接触器布置在第一接触器和晶片W之间。
    • 5. 发明授权
    • Probing test apparatus
    • 探测试验机
    • US5703494A
    • 1997-12-30
    • US553013
    • 1995-11-03
    • Kunio Sano
    • Kunio Sano
    • G01R1/073G01R1/067H01L21/66G01R31/02
    • G01R1/06705
    • A probing test apparatus comprising a probe card having a plurality of probes and first terminals contacted with and electrically connected to conductive pads of a circuit, a test head having a signal transmitting circuit through which the test signal is transmitted to the probes, a performance board having second terminals electrically connected to the signal transmitting circuit, a contact ring interposed between the performance board and the probe card and whose impedance has been adjusted, a plurality of first-type pogopins each having a pair of pin members contacting the first and second terminals to transmit the test signal to the probes, and a plurality of second-type pogopins each having a pair of pin members contacting the first and second terminals, the second-type pogopins being arranged in the contact ring, surrounding each first-type pogopin in a plane perpendicular to the axes of the pin members, and electrically connected to the first terminal grounded.
    • 一种探测测试装置,包括具有多个探针的探针和与电路的导电焊盘接触并电连接到电路的导电焊盘的探针卡,具有信号传输电路的测试头,测试信号通过该测试头传输到探头,演奏板 具有电连接到所述信号传输电路的第二端子,插入在所述性能板和所述探针卡之间并且阻抗已被调节的接触环,多个第一类型的pogopins,每个具有一对与所述第一和第二端子 将测试信号传输到探针,以及多个第二种类的pogopins,每个具有一对针构件接触第一和第二端子,第二类型的pogopins布置在接触环中,围绕每个第一类型的pogopin 垂直于销构件的轴线的平面,并且电连接到第一端子接地。
    • 6. 发明授权
    • Method of treating exhaust gas
    • 废气处理方法
    • US5254797A
    • 1993-10-19
    • US981983
    • 1992-11-24
    • Yoshinori ImotoKatsunosuke HaraMasakatsu HiraokaKunio SanoAkira Inoue
    • Yoshinori ImotoKatsunosuke HaraMasakatsu HiraokaKunio SanoAkira Inoue
    • B01D53/86A62D3/00C01B7/00F23G5/00
    • B01D53/8668B01D53/8662
    • A catalyst composition including component A and component B, the component A being a carrier, preferably having a honeycomb structure, and being a single-component oxide or a multi-component composite oxide of at least one metal of titanium, silicon and zirconium, and the component B being a catalyst component deposited on the carrier of component A and being at least one member selected from the group of noble metals and other specifically limited metals and their oxides, is very effective for decomposing and removing poisonous organic chlorine compounds, such as dioxin and the like, or poisonous organic chlorine compound-forming substances contained in an exhaust gas exhausted from an incinerator of an incineration plant provided with the incinerator and a dust collector. In addition, and the generation of the poisonous organic chlorine compound from the incineration plant can be prevented.
    • 包含组分A和组分B的催化剂组合物,组分A是载体,优选具有蜂窝结构,并且是至少一种钛,硅和锆的金属的单组分氧化物或多组分复合氧化物,以及 组分B是沉积在组分A的载体上的催化剂组分,并且是选自贵金属和其它特别有限的金属及其氧化物中的至少一种,对于分解和除去有毒的有机氯化合物是非常有效的,例如 二恶英等,或从设置有焚化炉的焚烧厂的焚化炉排出的排气中含有的有机的含氯化合物形成物质和集尘器。 此外,可以防止来自焚烧装置的有机有机氯化合物的产生。
    • 8. 发明授权
    • Probe device
    • US5550482A
    • 1996-08-27
    • US274862
    • 1994-07-14
    • Kunio Sano
    • Kunio Sano
    • G01R1/067G01R31/28G01R1/073G01R31/02
    • G01R31/2887G01R1/06705
    • A probe device for testing a wafer divided into IC chips has a vessel that accommodates a wafer mounting stand and a flexible probe card having contactor bumps. The vessel is configured in a separatable manner of a grounded aluminum cover portion to which the probe card is integrally fixed and a base portion fixed to the wafer mounting stand. The interior of the vessel is sealed with the wafer and the probe card facing each other therein. A space above the probe card forms a damper chamber into which a fluid is introduced in such a manner that the pressure thereof presses the bumps on the probe card against the wafer. Bumps in a peripheral edge portion of the probe card are placed into contact with electrodes in a peripheral edge portion of the vessel, and thence to a test head. The above configuration can prevent the effects of external electrical noise and thus enable stable electrical measurements unaffected by changes in ambient temperature. In order to remove the effects of thermal expansion of the probe card and the wafer, graticules are formed in each of X and Y directions around an array of bumps. The coordinate positions of the bumps on the probe card under normal temperature conditions are previously stored in a storage unit, the graticules are read by an imaging unit when the probe card has thermally expanded, the current coordinate positional data for the bumps is obtained from the results of this read and the stored bump coordinate positional data, and this is used to control the position of the mounting stand.