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    • 3. 发明授权
    • Method for manufacturing orifice plate and liquid discharge head
    • 孔板和排液头的制造方法
    • US06397466B1
    • 2002-06-04
    • US09340462
    • 1999-06-28
    • Shuji KoyamaJunji TatsumiKen IkegameHiroaki MiharaMiki Ito
    • Shuji KoyamaJunji TatsumiKen IkegameHiroaki MiharaMiki Ito
    • B21D5376
    • B41J2/164B23K26/382B23K26/389B23K26/40B23K2103/02B23K2103/05B23K2103/08B23K2103/10B23K2103/12B23K2103/16B23K2103/26B23K2103/42B23K2103/50B41J2/162B41J2/1625B41J2/1628B41J2/1629B41J2/1634B41J2202/21Y10T29/49165Y10T29/49401
    • A method for manufacturing an orifice plate with a plate material having a through hole arranged to become an orifice for discharging liquid comprises the steps of arranging a resin layer in a position corresponding to the through hole on the surface of a conductive substrate in a configuration corresponding to the through hole in a thickness corresponding at least to the lenght of the through hole, forming a metallic layer by means of electro-forming on the exposed surface of a portion of the conductive substrated corresponding to the plate material in a thickness corresponding to the thickness of the plate material in order to obtain the metallic layer in a state where the resin layer is filled in the through hole portion, applying water repellent resin to the surface of the metallic layer having the resin layer filled therein, peeling off the metallic layer from the conductive substrate together with the resin layer to obtain the plate material in a state where the through hole portion is filled with the resin layer, and removing by laser irradiation the resin layer portion of the plate material in a state where the resin layer is filled in the through hole portion having the water repellent layer coated on the surface in order to form the through hole.
    • 用于制造具有布置成成为用于排出液体的孔口的通孔的板材的孔板的方法包括以下步骤:在对应于导电基板的表面上的通孔的与通孔相对应的位置中配置树脂层 以至少对应于通孔的长度的方式通孔,通过电铸形成金属层,所述金属层在对应于所述板材的所述导电材料的一部分的所述暴露表面上的厚度对应于 为了在树脂层填充在通孔部分的状态下获得金属层,在其中填充有树脂层的金属层的表面上施加防水树脂,剥离金属层, 从导电性基板与树脂层一起获得板状材料,其状态为通孔端口 离子被树脂层填充,并且在树脂层填充在具有涂覆在表面上的防水层的通孔部分中的状态下通过激光照射去除板材的树脂层部分,以形成通孔 孔。