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1. 发明申请

US20190231312A1 METHODS AND APPARATUSES FOR PACKAGING AN ULTRASOUND-ON-A-CHIP 审中-公开
公开(公告)号：US20190231312A1
公开(公告)日：2019-08-01
申请号：US16260242
申请日：2019-01-29
申请人： Keith G. Fife , Jianwei Liu , Andrew Betts
发明人： Keith G. Fife , Jianwei Liu , Andrew Betts
IPC分类号： A61B8/00
CPC分类号： A61B8/4483 , A61B8/54 , A61B8/56
摘要： Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.

2. 发明申请

US20200184177A1 ULTRASOUND FINGERPRINT DETECTION AND RELATED APPARATUS AND METHODS 审中-公开
公开(公告)号：US20200184177A1
公开(公告)日：2020-06-11
申请号：US16705504
申请日：2019-12-06
申请人： Jianwei Liu , Keith G. Fife , Sarp Satir
发明人： Jianwei Liu , Keith G. Fife , Sarp Satir
IPC分类号： G06K9/00 , B06B1/02 , H01L27/32
摘要： Aspects of the technology described herein relate to sensing a fingerprint of a subject via an ultrasound fingerprint sensor. Certain aspects relate to transmitting and receiving ultrasound data at multiple different frequencies to provide sensing data from different depths within the skin of the subject. Since different ultrasound frequencies are expected to penetrate a subject's skin to different degrees, sensing a finger at multiple ultrasound frequencies may provide information on different physical aspects of the finger. For instance, sound ultrasound frequencies may sense a surface of the skin, whereas other ultrasound frequencies may penetrate through one or more of the epidermal, dermal or subcutaneous layers. The ultrasound fingerprint apparatus may have utility in various applications, including but not limited to mobile electronic devices, such as mobile phones or tablet computers, a laptop computer or biometric access equipment.

3. 发明申请

US20200184176A1 ULTRASOUND FINGERPRINT DETECTION AND RELATED APPARATUS AND METHODS 审中-公开
公开(公告)号：US20200184176A1
公开(公告)日：2020-06-11
申请号：US16705444
申请日：2019-12-06
申请人： Jianwei Liu , Keith G. Fife , Tyler S. Ralston
发明人： Jianwei Liu , Keith G. Fife , Tyler S. Ralston
IPC分类号： G06K9/00 , G06F3/041 , B06B1/02 , H01L27/32
摘要： An ultrasound fingerprint sensor is described. The ultrasound fingerprint sensor may incorporate capacitive ultrasound sensing technology, for example in the form of an array of capacitive ultrasonic transducers. The ultrasound fingerprint sensor may be incorporated into various electronic equipment, such as mobile electronic equipment in the form of smartphones and tablet computers, as well as in biometric sensing equipment, such as fingerprint access terminals.

4. 发明申请

US20200156110A1 ANTI-STICTION BOTTOM CAVITY SURFACE FOR MICROMACHINED ULTRASONIC TRANSDUCER DEVICES 审中-公开
公开(公告)号：US20200156110A1
公开(公告)日：2020-05-21
申请号：US16683652
申请日：2019-11-14
申请人： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
发明人： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
IPC分类号： B06B1/02 , B81B3/00 , B81C1/00
摘要： A method of forming an ultrasonic transducer device includes forming an insulating layer having topographic features over a lower transducer electrode layer of a substrate; forming a conformal, anti-stiction layer over the insulating layer such that the conformal layer also has the topographic features; defining a cavity in a support layer formed over the anti-stiction layer; and bonding a membrane to the support layer.

5. 发明申请

US20210403321A1 FORMATION OF SELF-ASSEMBLED MONOLAYER FOR ULTRASONIC TRANSDUCERS 有权
公开(公告)号：US20210403321A1
公开(公告)日：2021-12-30
申请号：US17362834
申请日：2021-06-29
申请人： Jianwei Liu , Keith G. Fife
发明人： Jianwei Liu , Keith G. Fife
IPC分类号： B81C1/00 , B06B1/02 , B81B7/00 , B81B3/00
摘要： Micromachined ultrasonic transducers having a self-assembled monolayer formed on a surface of a sealed cavity are described. A micromachined ultrasonic transducer may include a flexible membrane configured to vibrate over a sealed cavity, and the self-assembled monolayer may coat some or all of the interior surfaces of the sealed cavity. During fabrication, the sealed cavity may be formed by bonding the membrane to a substrate such that the sealed cavity is between the membrane and the substrate. An access hole may be formed through the membrane to the sealed cavity and the self-assembled monolayer is formed on surface(s) of the sealed cavity by introducing precursors into the sealed cavity through the access hole.

6. 发明申请

US20190336099A1 PRESSURE PORT FOR ULTRASONIC TRANSDUCER ON CMOS SENSOR 审中-公开
公开(公告)号：US20190336099A1
公开(公告)日：2019-11-07
申请号：US16401870
申请日：2019-05-02
申请人： Keith G. Fife , Jianwei Liu , Jungwook Yang , Joseph Lutsky
发明人： Keith G. Fife , Jianwei Liu , Jungwook Yang , Joseph Lutsky
IPC分类号： A61B8/12 , B06B1/02 , G01N29/24 , B06B1/06 , H01L41/09
摘要： Micromachined ultrasonic transducers having pressure ports are described. The micromachined ultrasonic transducers may comprise flexible membranes configured to vibrate over a cavity. The cavity may be sealed, in some instances by the membrane itself. A pressure port may provide access to the cavity, and thus control of the cavity pressure. In some embodiments, an ultrasound device including an array of micromachined ultrasonic transducers is provided, with pressure ports for at least some of the ultrasonic transducers. The pressure ports may be used to control pressure across the array.

7. 发明申请

US20190299251A1 APPARATUSES INCLUDING A CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER DIRECTLY COUPLED TO AN ANALOG-TO-DIGITAL CONVERTER 审中-公开
公开(公告)号：US20190299251A1
公开(公告)日：2019-10-03
申请号：US16443931
申请日：2019-06-18
申请人： Chao Chen , Kailiang Chen , Leung Kin Chiu , Youn-Jae Kook , Keith G. Fife
发明人： Chao Chen , Kailiang Chen , Leung Kin Chiu , Youn-Jae Kook , Keith G. Fife
IPC分类号： B06B1/02 , H03M3/00
摘要： Aspects of technology described herein relate to ultrasound apparatuses including capacitive micromachines ultrasonic transducers (CMUTs) that are directly electrically coupled to delta-sigma analog-to-digital converters (ADCs). The apparatus may lack an amplifier or multiplexer between each CMUT and delta-sigma ADC. The apparatus may include between 100 and 20,000 CMUTs and between 100 and 20,000 delta-sigma ADCs, each of the CMUTs directly electrically coupled to one of the delta-sigma ADCs. The CMUTs and the delta-sigma ADCs may be monolithically integrated on a single substrate. The delta-sigma ADCs may lack an integrator distinct from the CMUT. An internal capacitance of the CMUT may serve as an integrator for the delta-sigma ADC.

8. 发明授权

US07459667B1 Active pixel image sensor with common gate amplifier mode 有权
标题翻译：有源像素图像传感器，具有公共栅极放大器模式
公开(公告)号：US07459667B1
公开(公告)日：2008-12-02
申请号：US11221538
申请日：2005-09-07
申请人： Hae-Seung Lee , Keith G. Fife
发明人： Hae-Seung Lee , Keith G. Fife
IPC分类号： H03F3/08 , H04N3/14
CPC分类号： H04N5/363 , H04N5/35527 , H04N5/3559 , H04N5/37452
摘要： A method and apparatus to operate a pixel circuit within an active pixel image sensor in a common gate amplifier mode. A bias voltage is applied to a row select transistor in a pixel circuit, and the row select transistor is operated in a common gate amplifier mode. Moreover, the row select transistor can be operated in the common gate amplifier mode for a reset period. An integrated photo current is transferred from a sense capacitor to a capacitor coupled between a drain of the row select transistor and a sense node. Also, a row select voltage is applied to the row select transistor, and the pixel circuit is operated in a common source amplifier mode for a readout period.
摘要翻译：一种用于在公共栅极放大器模式中操作有源像素图像传感器内的像素电路的方法和装置。偏置电压被施加到像素电路中的行选择晶体管，并且行选择晶体管以公共栅极放大器模式工作。此外，行选择晶体管可以在公共栅极放大器模式下操作复位周期。集成的光电流从感测电容器传送到耦合在行选择晶体管的漏极和感测节点之间的电容器。此外，行选择电压被施加到行选择晶体管，并且像素电路在用于读出周期的公共源放大器模式中操作。

9. 发明申请

US20210088638A1 SYMMETRIC RECEIVER SWITCH FOR ULTRASOUND DEVICES 有权
公开(公告)号：US20210088638A1
公开(公告)日：2021-03-25
申请号：US17025927
申请日：2020-09-18
申请人： Kailiang Chen , Daniel Rea McMahill , Joseph Lutsky , Keith G. Fife , Nevada J. Sanchez
发明人： Kailiang Chen , Daniel Rea McMahill , Joseph Lutsky , Keith G. Fife , Nevada J. Sanchez
IPC分类号： G01S7/52
摘要： Circuitry for an ultrasound device is described. The ultrasound device may include a symmetric switch positioned between a pulser and an ultrasound transducer. The pulser may produce bipolar pulses. The symmetric switch may selectively isolate a receiver from the pulser and the ultrasound transducer during a transmit mode of the device, when the bipolar pulses are provided by the pulser to the ultrasound transducer for transmission, and may selectively permit the receiver to receive signals from the ultrasound transducer during a receive mode. The symmetric switch may be provided with a well switch to remove well capacitances in a signal path of the device.

10. 发明申请

US20190142387A1 ULTRASOUND APPARATUSES AND METHODS FOR FABRICATING ULTRASOUND DEVICES 审中-公开
公开(公告)号：US20190142387A1
公开(公告)日：2019-05-16
申请号：US16192603
申请日：2018-11-15
申请人： Kailiang Chen , Nevada J. Sanchez , Susan A. Alie , Tyler S. Ralston , Jonathan M. Rothberg , Keith G. Fife , Joseph Lutsky
发明人： Kailiang Chen , Nevada J. Sanchez , Susan A. Alie , Tyler S. Ralston , Jonathan M. Rothberg , Keith G. Fife , Joseph Lutsky
IPC分类号： A61B8/08 , H04B11/00
摘要： Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.

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