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    • 4. 发明授权
    • Readily soluble, amorphous polyimide, and preparation process of same
    • 易溶,无定形聚酰亚胺及其制备方法相同
    • US5480965A
    • 1996-01-02
    • US280551
    • 1994-07-26
    • Wataru YamashitaYuichi OkawaHideaki OikawaTadashi AsanumaYuko IshiharaMitsunori MatsuoKeizaburo YamaguchiAkihiro YamaguchiShoji Tamai
    • Wataru YamashitaYuichi OkawaHideaki OikawaTadashi AsanumaYuko IshiharaMitsunori MatsuoKeizaburo YamaguchiAkihiro YamaguchiShoji Tamai
    • C07C201/12C07C205/45C07C221/00C07C225/22C08G73/10C08G73/12C08J5/18C08L79/08C08G69/26C08L77/00
    • C08G73/10C08G73/1007C08G73/1014C08G73/1017C08G73/1067Y10T428/31504Y10T428/31721
    • This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the thermoplastic polyimide and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition, a polyimide-based composite obtained by molding the above soluble and thermoplastic polyimide in combination with a fibrous reinforcement, and a fibrous reinforcement having a surface modified with the above polyimide.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein m and n are individually an integer of 0 or 1, and R is ##STR2## The polyimide of the invention is essentially amorphous, excellent in melt flow stability in the decreased temperature as compared with conventionally known polyimide and has greatly improved processability.The polyimide of the invention obtained by using a novel aromatic diamino compound as a monomer can control various properties such as melt flow ability and solubility in solvents by side chains and not by principal chain of polyimide. Thus, excellent melt flow property and solubility in solvents can be obtained while maintaining high heat resistance and adhesive property which are derived from benzophenone structure of the diamino compound of the the invention.
    • 本发明涉及易溶于有机溶剂的新型热塑性和无定形聚酰亚胺,用于聚酰亚胺的新型芳族二氨基化合物及其制备方法,包含热塑性聚酰亚胺和纤维增强剂的聚酰亚胺基树脂组合物, 用于制备树脂组合物的树脂组合物的注塑制品,通过将上述可溶性和热塑性聚酰亚胺与纤维增强剂组合成型而获得的聚酰亚胺类复合材料和具有用上述聚酰亚胺改性的表面的纤维增强剂。 聚酰亚胺包含必需的结构单元,其具有一个或多个下式的重复结构单元:其中m和n分别为0或1的整数,R为本发明的聚酰亚胺基本上为 与常规已知的聚酰亚胺相比,在降低的温度下的熔体流动稳定性优异并且具有极大的改进的加工性。 通过使用新颖的芳族二氨基化合物作为单体获得的本发明的聚酰亚胺可以通过侧链而不是聚酰亚胺的主链来控制各种性能如熔体流动性和在溶剂中的溶解度。 因此,在保持由本发明的二氨基化合物的二苯甲酮结构得到的高耐热性和粘合性的同时,可以获得优异的熔体流动性和溶剂中的溶解性。
    • 5. 发明授权
    • Polyimide
    • 聚酰亚胺
    • US5470943A
    • 1995-11-28
    • US360584
    • 1994-12-21
    • Yoshihiro SakataWataru YamashitaYuichi OkawaShoji TamaiTsutomu IshidaMitsunori MatsuoKeizaburo YamaguchiAkihiro Yamaguchi
    • Yoshihiro SakataWataru YamashitaYuichi OkawaShoji TamaiTsutomu IshidaMitsunori MatsuoKeizaburo YamaguchiAkihiro Yamaguchi
    • C08G73/10C08G77/10C07D213/69C08G69/26
    • C08G73/1039C08G73/1085
    • This invention relates to a novel fluorine-containing polyimide or polyimide copolymer being colorless and having transparency and very low dielectric characteristics, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member, a trifluoromethyl radical is situated at the 3- or the 4-position on a pyridine nucleus, and an imide nitrogen atom is connected at the 3- or the 4-position to an ether bond.The polyimide or polyimide copolymer has excellent heat resistance, outstanding melt-flow stability and greatly improved processability, and also is colorless and has high transparency and very low dielectric coefficient, and can be expected to be used as raw materials for electric.cndot.electronic appliances and optical instruments due to the above characteristics.
    • 本发明涉及一种新颖的含氟聚酰亚胺或聚酰亚胺共聚物,其具有透明性和非常低的介电特性,并且具有用于聚酰亚胺的新型芳族二氨基化合物及其制备方法,该聚酰亚胺系树脂组合物含有聚酰亚胺 或聚酰亚胺共聚物和纤维增强剂,树脂组合物的制备方法,树脂组合物的注塑制品。 聚酰亚胺包含具有一个或多个下式的重复结构单元的必需结构单元:其中Ar是具有6至27个碳原子的四价基团,并且选自单芳族基团,缩合多芳族基团 具有芳族基团的自由基和非缩合多芳族基团彼此直接键合或桥接成员,三氟甲基位于吡啶核上的3-或4-位,酰亚胺氮原子连接在3 - 或4-位到醚键。 聚酰亚胺或聚酰亚胺共聚物具有优异的耐热性,优异的熔体流动稳定性和极好的加工性,并且是无色的,具有高透明度和非常低的介电系数,并且可以预期用作电气电子设备的原料 光学仪器由于上述特点。
    • 7. 发明授权
    • Polyimide
    • 聚酰亚胺
    • US5508377A
    • 1996-04-16
    • US357193
    • 1994-12-13
    • Wataru YamashitaYuichi OkawaShoji TamaiAkihiro Yamaguchi
    • Wataru YamashitaYuichi OkawaShoji TamaiAkihiro Yamaguchi
    • C08G73/10C08L79/08C08G69/26
    • C08G73/1085C08G73/10C08G73/1039C08G73/105C08G73/1053C08G73/1071C08L79/08
    • This invention relates to a novel polyimide or polyimide copolymer having excellent heat resistance and greatly improved processability, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein L is an oxygen atom, carbonyl, isopropylidene or hexafluoroisopropylidene, and X is ##STR2## and Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member.The polyimide or polyimide copolymer is outstanding in melt-flow stability, and has greatly improved processability and excellent heat resistance. Consequently, the polyimide or polyimide copolymer can be applied to structural materials, and electic.cndot.electronic appliances.
    • 本发明涉及耐热性优异且加工性极佳的新型聚酰亚胺或聚酰亚胺共聚物,具有用于聚酰亚胺的新型芳族二氨基化合物及其制备方法,包含聚酰亚胺或聚酰亚胺共聚物的聚酰亚胺系树脂组合物和 纤维增强材料,树脂组合物的制备方法,树脂组合物的注塑制品。 聚酰亚胺包括具有一个或多个下式的重复结构单元的必需结构单元:其中L是氧原子,羰基,异亚丙基或六氟异亚丙基,X是(5)和Ar 是具有6至27个碳原子的四价基团,并且选自具有芳族基团的单芳族基团,缩合多芳族基团和具有直接键合或桥连构件彼此连接的非缩合多芳族基团。 聚酰亚胺或聚酰亚胺共聚物在熔体流动稳定性方面是突出的,并且具有极大的改进的加工性和优异的耐热性。 因此,聚酰亚胺或聚酰亚胺共聚物可以应用于结构材料和电子电器。