会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Wafer heating apparatus and semiconductor manufacturing apparatus
    • 晶圆加热装置及半导体制造装置
    • US08519309B2
    • 2013-08-27
    • US12721388
    • 2010-03-10
    • Keiji IwataKoichi NagasakiTsunehiko Nakamura
    • Keiji IwataKoichi NagasakiTsunehiko Nakamura
    • H05B3/68
    • H01L21/67109H05B3/143
    • A wafer heating apparatus which is capable of quickly cooling by improving the cooling rate of the heater section is provided. The wafer heating apparatus comprises a plate-shaped member having two opposing principal surfaces with one of the principal surfaces serving as a mounting surface to mount a wafer thereon and the other principal surface having a band-shaped resistive heating member formed thereon, power feeder terminals connected to the resistive heating member for supplying electric power to the resistive heating member, a casing provided to cover the power feeder terminals on the other surface of the plate-shaped member and a nozzle of which tip faces the other surface of the plate-shaped member for cooling the plate-shaped member, wherein the position of the tip of the nozzle as projected onto the other surface of the plate-shaped member is located between the bands of the resistive heating member.
    • 提供了能够通过提高加热器部的冷却速度来快速冷却的晶片加热装置。 晶片加热装置包括具有两个相对的主表面的板状构件,其中一个主表面用作安装表面,并且其上形成有晶片电阻加热构件的另一个主表面,馈电端子 连接到用于向电阻加热构件供电的电阻加热构件,设置成覆盖板状构件的另一个表面上的馈电端子的壳体和其顶端面对板状构件的另一表面的喷嘴 用于冷却所述板状构件的构件,其中,所述喷嘴的尖端的突出到所述板状构件的另一个表面上的位置位于所述电阻加热构件的所述带之间。
    • 2. 发明授权
    • Wafer heating apparatus and semiconductor manufacturing apparatus
    • 晶圆加热装置及半导体制造装置
    • US08071916B2
    • 2011-12-06
    • US11571352
    • 2005-06-28
    • Keiji IwataKoichi NagasakiTsunehiko Nakamura
    • Keiji IwataKoichi NagasakiTsunehiko Nakamura
    • F23D11/00C23C16/00
    • H01L21/67109H05B3/143
    • A wafer heating apparatus which is capable of quickly cooling by improving the cooling rate of the heater section is provided.The wafer heating apparatus comprises a plate-shaped member having two opposing principal surfaces with one of the principal surfaces serving as a mounting surface to mount a wafer thereon and the other principal surface having a band-shaped resistive heating member formed thereon, power feeder terminals connected to the resistive heating member for supplying electric power to the resistive heating member, a casing provided to cover the power feeder terminals on the other surface of the plate-shaped member and a nozzle of which tip faces the other surface of the plate-shaped member for cooling the plate-shaped member, wherein the position of the tip of the nozzle as projected onto the other surface of the plate-shaped member is located between the bands of the resistive heating member.
    • 提供了能够通过提高加热器部的冷却速度来快速冷却的晶片加热装置。 晶片加热装置包括具有两个相对的主表面的板状构件,其中一个主表面用作安装表面,并且其上形成有晶片电阻加热构件的另一个主表面,馈电端子 连接到用于向电阻加热构件供电的电阻加热构件,设置成覆盖板状构件的另一个表面上的馈电端子的壳体和其顶端面对板状构件的另一表面的喷嘴 用于冷却所述板状构件的构件,其中,所述喷嘴的尖端的突出到所述板状构件的另一个表面上的位置位于所述电阻加热构件的所述带之间。
    • 3. 发明申请
    • Wafer Heating Apparatus And Semiconductor Manufacturing Apparatus
    • 晶圆加热装置及半导体制造装置
    • US20080017627A1
    • 2008-01-24
    • US11571352
    • 2005-06-28
    • Keiji IwataKoichi NagasakiTsunehiko Nakamura
    • Keiji IwataKoichi NagasakiTsunehiko Nakamura
    • F23Q7/00
    • H01L21/67109H05B3/143
    • A wafer heating apparatus which is capable of quickly cooling by improving the cooling rate of the heater section is provided. The wafer heating apparatus comprises a plate-shaped member having two opposing principal surfaces with one of the principal surfaces serving as a mounting surface to mount a wafer thereon and the other principal surface having a band-shaped resistive heating member formed thereon, power feeder terminals connected to the resistive heating member for supplying electric power to the resistive heating member, a casing provided to cover the power feeder terminals on the other surface of the plate-shaped member and a nozzle of which tip faces the other surface of the plate-shaped member for cooling the plate-shaped member, wherein the position of the tip of the nozzle as projected onto the other surface of the plate-shaped member is located between the bands of the resistive heating member.
    • 提供了能够通过提高加热器部的冷却速度来快速冷却的晶片加热装置。 晶片加热装置包括具有两个相对的主表面的板状构件,其中一个主表面用作安装表面,并且其上形成有晶片电阻加热构件的另一个主表面,馈电端子 连接到用于向电阻加热构件供电的电阻加热构件,设置成覆盖板状构件的另一个表面上的馈电端子的壳体和其顶端面对板状构件的另一表面的喷嘴 用于冷却所述板状构件的构件,其中,所述喷嘴的尖端的突出到所述板状构件的另一个表面上的位置位于所述电阻加热构件的所述带之间。
    • 5. 发明授权
    • Method for forming push rod for switch
    • 用于形成开关用推杆的方法
    • US06205659B1
    • 2001-03-27
    • US09109083
    • 1998-07-02
    • Keiji Iwata
    • Keiji Iwata
    • H01R4300
    • H01H11/06H01H13/12Y10T29/49204Y10T29/4922Y10T29/49224
    • A band-like raw material which becomes a contact plate is supplied to a position between an upper mold and a lower mold as these molds are closed, a convex part for the contact with the lower mold is engaged with a concave part for contact with the upper mold, by which, simultaneously punching out the contact part onto a part of the band-like raw material, the band-like raw material is cut to a predetermined length between edge parts to form the contact plate. At this time, a tip of a press pin on which the concave part is formed is brought into direct contact with a central part of the band-like raw material. A resin is injected into the mold cavities to form a push rod integrally with the contact plate, and the central part of the contact plate is deformed in the concave part to provide a stopgap.
    • 当这些模具闭合时,成为接触板的带状原料被供给到上模具和下模具之间的位置,用于与下模具接触的凸部与凹部接合, 上模具,同时将接触部分冲压到带状原料的一部分上,将带状原料在边缘部分之间切割成预定长度以形成接触板。 此时,形成有凹部的压针的前端与带状原料的中心部直接接触。 将树脂注入到模腔中以与接触板一体形成推杆,并且接触板的中心部分在凹部中变形以提供止挡。
    • 7. 发明申请
    • Grain-Oriented Electrical Sheet Superior in Watt Loss
    • 以瓦特损耗为特征的面向电路板
    • US20090272464A1
    • 2009-11-05
    • US12311756
    • 2007-10-16
    • Hideyuki HamamuraKeiji IwataTatsuhiko Sakai
    • Hideyuki HamamuraKeiji IwataTatsuhiko Sakai
    • C22C38/22
    • C21D8/12C21D8/1277C21D8/1294C21D9/46C21D10/005H01F1/14716
    • The present invention provides grain-oriented electrical sheet more superior in watt loss compared with the past by dividing the watt loss of grain-oriented electrical sheet introducing strain by firing of a laser beam etc. into hysteresis loss and eddy current loss and, in particular from the viewpoint of the eddy current loss, quantitatively suitably controlling the distribution of the strain and residual stress in the sheet thickness direction, that is, grain-oriented electrical sheet obtained by firing a laser beam etc. to introduce lines of strain substantially perpendicular to the rolling direction uniformly in a sheet width direction and cyclically in the rolling direction for magnetic domain control, characterized in that in the two-dimensional distribution of a rolling direction compressive residual stress occurring near one location of the introduction of strain in a cross-section perpendicular to the sheet width direction, the value of the rolling direction compressive residual stress integrated in the region of the cross-section where there is compressive residual stress is within a predetermined range.
    • 本发明通过将通过激光束的烧制将晶粒取向电工片引入应变的瓦特损耗除以磁滞损耗和涡流损耗,提供了与过去相比更优于瓦特损耗的晶粒取向电工片,特别是 从涡电流损耗的观点出发,定量地适当地控制片材厚度方向上的应变分布和残余应力,即通过烧制激光束等而获得的晶粒取向电工片,以将基本上垂直于 轧制方向在板宽度方向上均匀地并且在轧制方向上循环地进行磁畴控制,其特征在于,在横截面中在应变应变的一个位置附近出现的轧制方向的压缩残余应力的二维分布 垂直于纸张宽度方向,滚动方向的值压缩 集成在具有压缩残余应力的横截面区域中的应力在预定范围内。