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1. 发明授权

US08519309B2 Wafer heating apparatus and semiconductor manufacturing apparatus 有权
标题翻译：晶圆加热装置及半导体制造装置
公开(公告)号：US08519309B2
公开(公告)日：2013-08-27
申请号：US12721388
申请日：2010-03-10
申请人： Keiji Iwata , Koichi Nagasaki , Tsunehiko Nakamura
发明人： Keiji Iwata , Koichi Nagasaki , Tsunehiko Nakamura
IPC分类号： H05B3/68
CPC分类号： H01L21/67109 , H05B3/143
摘要： A wafer heating apparatus which is capable of quickly cooling by improving the cooling rate of the heater section is provided. The wafer heating apparatus comprises a plate-shaped member having two opposing principal surfaces with one of the principal surfaces serving as a mounting surface to mount a wafer thereon and the other principal surface having a band-shaped resistive heating member formed thereon, power feeder terminals connected to the resistive heating member for supplying electric power to the resistive heating member, a casing provided to cover the power feeder terminals on the other surface of the plate-shaped member and a nozzle of which tip faces the other surface of the plate-shaped member for cooling the plate-shaped member, wherein the position of the tip of the nozzle as projected onto the other surface of the plate-shaped member is located between the bands of the resistive heating member.
摘要翻译：提供了能够通过提高加热器部的冷却速度来快速冷却的晶片加热装置。晶片加热装置包括具有两个相对的主表面的板状构件，其中一个主表面用作安装表面，并且其上形成有晶片电阻加热构件的另一个主表面，馈电端子连接到用于向电阻加热构件供电的电阻加热构件，设置成覆盖板状构件的另一个表面上的馈电端子的壳体和其顶端面对板状构件的另一表面的喷嘴用于冷却所述板状构件的构件，其中，所述喷嘴的尖端的突出到所述板状构件的另一个表面上的位置位于所述电阻加热构件的所述带之间。

2. 发明授权

US08071916B2 Wafer heating apparatus and semiconductor manufacturing apparatus 有权
标题翻译：晶圆加热装置及半导体制造装置
公开(公告)号：US08071916B2
公开(公告)日：2011-12-06
申请号：US11571352
申请日：2005-06-28
申请人： Keiji Iwata , Koichi Nagasaki , Tsunehiko Nakamura
发明人： Keiji Iwata , Koichi Nagasaki , Tsunehiko Nakamura
IPC分类号： F23D11/00 , C23C16/00
CPC分类号： H01L21/67109 , H05B3/143
摘要： A wafer heating apparatus which is capable of quickly cooling by improving the cooling rate of the heater section is provided.The wafer heating apparatus comprises a plate-shaped member having two opposing principal surfaces with one of the principal surfaces serving as a mounting surface to mount a wafer thereon and the other principal surface having a band-shaped resistive heating member formed thereon, power feeder terminals connected to the resistive heating member for supplying electric power to the resistive heating member, a casing provided to cover the power feeder terminals on the other surface of the plate-shaped member and a nozzle of which tip faces the other surface of the plate-shaped member for cooling the plate-shaped member, wherein the position of the tip of the nozzle as projected onto the other surface of the plate-shaped member is located between the bands of the resistive heating member.
摘要翻译：提供了能够通过提高加热器部的冷却速度来快速冷却的晶片加热装置。晶片加热装置包括具有两个相对的主表面的板状构件，其中一个主表面用作安装表面，并且其上形成有晶片电阻加热构件的另一个主表面，馈电端子连接到用于向电阻加热构件供电的电阻加热构件，设置成覆盖板状构件的另一个表面上的馈电端子的壳体和其顶端面对板状构件的另一表面的喷嘴用于冷却所述板状构件的构件，其中，所述喷嘴的尖端的突出到所述板状构件的另一个表面上的位置位于所述电阻加热构件的所述带之间。

3. 发明申请

US20080017627A1 Wafer Heating Apparatus And Semiconductor Manufacturing Apparatus 有权
标题翻译：晶圆加热装置及半导体制造装置
公开(公告)号：US20080017627A1
公开(公告)日：2008-01-24
申请号：US11571352
申请日：2005-06-28
申请人： Keiji Iwata , Koichi Nagasaki , Tsunehiko Nakamura
发明人： Keiji Iwata , Koichi Nagasaki , Tsunehiko Nakamura
IPC分类号： F23Q7/00
CPC分类号： H01L21/67109 , H05B3/143
摘要： A wafer heating apparatus which is capable of quickly cooling by improving the cooling rate of the heater section is provided. The wafer heating apparatus comprises a plate-shaped member having two opposing principal surfaces with one of the principal surfaces serving as a mounting surface to mount a wafer thereon and the other principal surface having a band-shaped resistive heating member formed thereon, power feeder terminals connected to the resistive heating member for supplying electric power to the resistive heating member, a casing provided to cover the power feeder terminals on the other surface of the plate-shaped member and a nozzle of which tip faces the other surface of the plate-shaped member for cooling the plate-shaped member, wherein the position of the tip of the nozzle as projected onto the other surface of the plate-shaped member is located between the bands of the resistive heating member.
摘要翻译：提供了能够通过提高加热器部的冷却速度来快速冷却的晶片加热装置。晶片加热装置包括具有两个相对的主表面的板状构件，其中一个主表面用作安装表面，并且其上形成有晶片电阻加热构件的另一个主表面，馈电端子连接到用于向电阻加热构件供电的电阻加热构件，设置成覆盖板状构件的另一个表面上的馈电端子的壳体和其顶端面对板状构件的另一表面的喷嘴用于冷却所述板状构件的构件，其中，所述喷嘴的尖端的突出到所述板状构件的另一个表面上的位置位于所述电阻加热构件的所述带之间。

4. 发明授权

US08734658B2 Method for manufacturing grain-oriented electrical steel sheet 有权
标题翻译：晶粒取向电工钢板的制造方法
公开(公告)号：US08734658B2
公开(公告)日：2014-05-27
申请号：US13805520
申请日：2011-06-03
申请人： Keiji Iwata , Yasuhiro Kikuchi
发明人： Keiji Iwata , Yasuhiro Kikuchi
IPC分类号： B44C1/22 , C21D8/12 , C23F1/02 , C23F1/14 , H01F1/147
CPC分类号： C21D8/1294 , C21D6/008 , C21D8/12 , C21D8/1255 , C21D9/46 , C21D2201/05 , C21D2221/00 , C22C1/02 , C22C38/00 , C22C38/001 , C22C38/02 , C22C38/04 , C22C38/06 , C23F1/00 , C23F1/02 , C23F1/14 , C25F3/06 , H01F1/14783 , H01F1/16
摘要： A resist film is formed on a cold-rolled steel sheet so as to fabricate a groove by etching. At this point, a steel sheet exposed portion where a portion of the steel sheet is exposed is formed in the resist film, and the steel sheet exposed portion has a first region oriented in a sheet width direction, and a plurality of second regions starting from the first region, widths of the first region and the second regions being 20 μm to 100 μm, and a distance from an end portion of one of the second regions to an end portion of another of the second regions adjacent thereto being 60 μm to 570 μm.
摘要翻译：在冷轧钢板上形成抗蚀剂膜，以通过蚀刻制造凹槽。此时，在抗蚀剂膜上形成钢板暴露部分，钢板露出部分具有沿纸张宽度方向取向的第一区域和从第一区域开始的多个第二区域所述第一区域，所述第一区域和所述第二区域的宽度为20μm至100μm，并且从所述第二区域中的一个的端部到与所述第二区域的另一个的另一个的端部的距离为60μm至570 μm。

5. 发明授权

US06205659B1 Method for forming push rod for switch 失效
标题翻译：用于形成开关用推杆的方法
公开(公告)号：US06205659B1
公开(公告)日：2001-03-27
申请号：US09109083
申请日：1998-07-02
申请人： Keiji Iwata
发明人： Keiji Iwata
IPC分类号： H01R4300
CPC分类号： H01H11/06 , H01H13/12 , Y10T29/49204 , Y10T29/4922 , Y10T29/49224
摘要： A band-like raw material which becomes a contact plate is supplied to a position between an upper mold and a lower mold as these molds are closed, a convex part for the contact with the lower mold is engaged with a concave part for contact with the upper mold, by which, simultaneously punching out the contact part onto a part of the band-like raw material, the band-like raw material is cut to a predetermined length between edge parts to form the contact plate. At this time, a tip of a press pin on which the concave part is formed is brought into direct contact with a central part of the band-like raw material. A resin is injected into the mold cavities to form a push rod integrally with the contact plate, and the central part of the contact plate is deformed in the concave part to provide a stopgap.
摘要翻译：当这些模具闭合时，成为接触板的带状原料被供给到上模具和下模具之间的位置，用于与下模具接触的凸部与凹部接合，上模具，同时将接触部分冲压到带状原料的一部分上，将带状原料在边缘部分之间切割成预定长度以形成接触板。此时，形成有凹部的压针的前端与带状原料的中心部直接接触。将树脂注入到模腔中以与接触板一体形成推杆，并且接触板的中心部分在凹部中变形以提供止挡。

6. 发明申请

US20130092652A1 METHOD FOR MANUFACTURING GRAIN-ORIENTED ELECTRICAL STEEL SHEET 有权
标题翻译：制造面向导电电工钢板的方法
公开(公告)号：US20130092652A1
公开(公告)日：2013-04-18
申请号：US13805520
申请日：2011-06-06
申请人： Keiji Iwata , Yasuhiro Kikuchi
发明人： Keiji Iwata , Yasuhiro Kikuchi
IPC分类号： C23F1/00
CPC分类号： C21D8/1294 , C21D6/008 , C21D8/12 , C21D8/1255 , C21D9/46 , C21D2201/05 , C21D2221/00 , C22C1/02 , C22C38/00 , C22C38/001 , C22C38/02 , C22C38/04 , C22C38/06 , C23F1/00 , C23F1/02 , C23F1/14 , C25F3/06 , H01F1/14783 , H01F1/16
摘要： A resist film is formed on a cold-rolled steel sheet so as to fabricate a groove by etching. At this point, a steel sheet exposed portion where a portion of the steel sheet is exposed is formed in the resist film, and the steel sheet exposed portion has a first region oriented in a sheet width direction, and a plurality of second regions starting from the first region, widths of the first region and the second regions being 20 μm to 100 μm, and a distance from an end portion of one of the second regions to an end portion of another of the second regions adjacent thereto being 60 μm to 570 μm.
摘要翻译：在冷轧钢板上形成抗蚀剂膜，以通过蚀刻制造凹槽。此时，在抗蚀剂膜上形成钢板暴露部分，钢板露出部分具有沿纸张宽度方向取向的第一区域和从第一区域开始的多个第二区域所述第一区域，所述第一区域和所述第二区域的宽度为20μm至100μm，并且从所述第二区域中的一个的端部到与所述第二区域相邻的所述第二区域中的另一个的端部的距离为60μm至570μm 妈妈

7. 发明申请

US20090272464A1 Grain-Oriented Electrical Sheet Superior in Watt Loss 审中-公开
标题翻译：以瓦特损耗为特征的面向电路板
公开(公告)号：US20090272464A1
公开(公告)日：2009-11-05
申请号：US12311756
申请日：2007-10-16
申请人： Hideyuki Hamamura , Keiji Iwata , Tatsuhiko Sakai
发明人： Hideyuki Hamamura , Keiji Iwata , Tatsuhiko Sakai
IPC分类号： C22C38/22
CPC分类号： C21D8/12 , C21D8/1277 , C21D8/1294 , C21D9/46 , C21D10/005 , H01F1/14716
摘要： The present invention provides grain-oriented electrical sheet more superior in watt loss compared with the past by dividing the watt loss of grain-oriented electrical sheet introducing strain by firing of a laser beam etc. into hysteresis loss and eddy current loss and, in particular from the viewpoint of the eddy current loss, quantitatively suitably controlling the distribution of the strain and residual stress in the sheet thickness direction, that is, grain-oriented electrical sheet obtained by firing a laser beam etc. to introduce lines of strain substantially perpendicular to the rolling direction uniformly in a sheet width direction and cyclically in the rolling direction for magnetic domain control, characterized in that in the two-dimensional distribution of a rolling direction compressive residual stress occurring near one location of the introduction of strain in a cross-section perpendicular to the sheet width direction, the value of the rolling direction compressive residual stress integrated in the region of the cross-section where there is compressive residual stress is within a predetermined range.
摘要翻译：本发明通过将通过激光束的烧制将晶粒取向电工片引入应变的瓦特损耗除以磁滞损耗和涡流损耗，提供了与过去相比更优于瓦特损耗的晶粒取向电工片，特别是从涡电流损耗的观点出发，定量地适当地控制片材厚度方向上的应变分布和残余应力，即通过烧制激光束等而获得的晶粒取向电工片，以将基本上垂直于轧制方向在板宽度方向上均匀地并且在轧制方向上循环地进行磁畴控制，其特征在于，在横截面中在应变应变的一个位置附近出现的轧制方向的压缩残余应力的二维分布垂直于纸张宽度方向，滚动方向的值压缩集成在具有压缩残余应力的横截面区域中的应力在预定范围内。

8. 发明授权

US5621649A Method for analyzing electromagnetic field 失效
标题翻译：电磁场分析方法
公开(公告)号：US5621649A
公开(公告)日：1997-04-15
申请号：US93538
申请日：1993-07-19
申请人： Keiji Iwata , Hosei Hirano , Takatsugu Ueyama , Kenji Umetsu
发明人： Keiji Iwata , Hosei Hirano , Takatsugu Ueyama , Kenji Umetsu
IPC分类号： G01R29/08
CPC分类号： G01R29/0892
摘要： Analysis of an electromagnetic field in a region including an electric conductor having an arbitrary shape is efficiently and accurately performed with a computer. A value of electric potential at a predetermined portion of the electric conductor or a value of the normal component of an electric current density vector to the cross section of a predetermined portion of the electric conductor is used as an initial condition. The distribution of exciting current density vectors in the electric conductor is obtained form the initial condition so as to meet the condition of continuity of electric current. The electromagnetic field of the region is analyzed by using the obtained distribution of exciting current density vectors.
摘要翻译：利用计算机有效且准确地执行包括具有任意形状的导电体的区域中的电磁场的分析。电导体的预定部分处的电位值或电导率的电流密度矢量的正常分量的值被用作电导体的预定部分的横截面作为初始条件。从初始状态获得激励电流密度矢量在电导体中的分布，以满足电流连续性条件。通过使用获得的励磁电流密度矢量分布来分析该区域的电磁场。

9. 发明授权

US08034196B2 Low core loss grain-oriented electrical steel plate and method of manufacturing the same 有权
标题翻译：低磁芯损耗晶粒取向电工钢板及其制造方法
公开(公告)号：US08034196B2
公开(公告)日：2011-10-11
申请号：US12808354
申请日：2009-02-13
申请人： Keiji Iwata , Hideyuki Hamamura
发明人： Keiji Iwata , Hideyuki Hamamura
IPC分类号： H01F1/16
CPC分类号： H01F1/16 , C21D1/38 , C21D8/1205 , C21D8/1216 , C21D8/1294 , C21D2201/05 , C21D2221/00 , C22C38/02 , H01F41/024 , Y10T428/12389
摘要： A grain-oriented electrical steel plate is characterized in that grooves having a width of 10 μm to 200 μm and a depth of 10 μm to 30 μm exist in at least one of a front surface and a rear surface of a steel plate at intervals of 1 mm to 10 mm, an angle between a direction in which the grooves extend and a rolling direction of the steel plate is 60 degrees to 120 degrees, and tensile stresses having a maximum value of 20 MPa to 300 MPa act in the rolling direction within ranges of 10 μm to 300 μm from side surfaces of the grooves.
摘要翻译：一种晶粒取向电工钢板的特征在于，在钢板的前表面和后表面中的至少一个中以间隔的间隔存在宽度为10μm至200μm，深度为10μm至30μm的槽 1mm〜10mm，槽延伸方向与钢板的轧制方向之间的角度为60度〜120度，最大值为20MPa〜300MPa的拉伸应力在轧制方向内从槽的侧面开始为10μm〜300μm的范围。

10. 发明申请

US20100279141A1 LOW CORE LOSS GRAIN-ORIENTED ELECTRICAL STEEL PLATE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：低核心电磁钢板及其制造方法
公开(公告)号：US20100279141A1
公开(公告)日：2010-11-04
申请号：US12808354
申请日：2009-02-13
申请人： Keiji Iwata , Hideyuki Hamamura
发明人： Keiji Iwata , Hideyuki Hamamura
IPC分类号： B32B3/30 , B23K26/00
CPC分类号： H01F1/16 , C21D1/38 , C21D8/1205 , C21D8/1216 , C21D8/1294 , C21D2201/05 , C21D2221/00 , C22C38/02 , H01F41/024 , Y10T428/12389
摘要： A grain-oriented electrical steel plate is characterized in that grooves having a width of 10 μm to 200 μm and a depth of 10 μm to 30 μm exist in at least one of a front surface and a rear surface of a steel plate at intervals of 1 mm to 10 mm, an angle between a direction in which the grooves extend and a rolling direction of the steel plate is 60 degrees to 120 degrees, and tensile stresses having a maximum value of 20 MPa to 300 MPa act in the rolling direction within ranges of 10 μm to 300 μm from side surfaces of the grooves.
摘要翻译：一种晶粒取向电工钢板的特征在于，在钢板的前表面和后表面中的至少一个中以间隔的间隔存在宽度为10μm至200μm，深度为10μm至30μm的槽 1mm〜10mm，槽延伸方向与钢板的轧制方向之间的角度为60度〜120度，最大值为20MPa〜300MPa的拉伸应力在轧制方向内从槽的侧面开始为10μm〜300μm的范围。

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