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1. 发明授权

US5621649A Method for analyzing electromagnetic field 失效
标题翻译：电磁场分析方法
公开(公告)号：US5621649A
公开(公告)日：1997-04-15
申请号：US93538
申请日：1993-07-19
申请人： Keiji Iwata , Hosei Hirano , Takatsugu Ueyama , Kenji Umetsu
发明人： Keiji Iwata , Hosei Hirano , Takatsugu Ueyama , Kenji Umetsu
IPC分类号： G01R29/08
CPC分类号： G01R29/0892
摘要： Analysis of an electromagnetic field in a region including an electric conductor having an arbitrary shape is efficiently and accurately performed with a computer. A value of electric potential at a predetermined portion of the electric conductor or a value of the normal component of an electric current density vector to the cross section of a predetermined portion of the electric conductor is used as an initial condition. The distribution of exciting current density vectors in the electric conductor is obtained form the initial condition so as to meet the condition of continuity of electric current. The electromagnetic field of the region is analyzed by using the obtained distribution of exciting current density vectors.
摘要翻译：利用计算机有效且准确地执行包括具有任意形状的导电体的区域中的电磁场的分析。电导体的预定部分处的电位值或电导率的电流密度矢量的正常分量的值被用作电导体的预定部分的横截面作为初始条件。从初始状态获得激励电流密度矢量在电导体中的分布，以满足电流连续性条件。通过使用获得的励磁电流密度矢量分布来分析该区域的电磁场。

2. 发明授权

US5640315A Switching regulator 失效
标题翻译：开关稳压器
公开(公告)号：US5640315A
公开(公告)日：1997-06-17
申请号：US405989
申请日：1995-03-17
申请人： Hosei Hirano , Tetsuro Tanaka
发明人： Hosei Hirano , Tetsuro Tanaka
IPC分类号： H02M3/335 , H02M7/12
CPC分类号： H02M3/33507
摘要： A switching regulator including: a switching element connected to an input DC signal and operating for turning-on and -off the input DC signal to produce an AC signal such as a rectangular wave signal; a rectifier for rectifying the AC signal thereby generating an output voltage; a circuit for producing a frequency-variable triangular wave signal having a constant amplitude; a comparator for comparing the triangular wave signal with the output voltage of the rectifier thereby obtaining a pulse-width modulated signal used for controlling the operation of the switching element; a modulation signal generator for generating a modulation signal having an amplitude variable in asynchronism with the frequency of the triangular wave signal; a sampling and holding circuit for sampling the modulation signal at a timing in synchronism with the frequency of the triangular wave signal or preferably at the timing of a maximum or minimum value of the triangular wave signal and holding the sampled modulation signal; and a circuit for modulating the frequency of the triangular wave signal preferably within a range of about 0.8 to 1.2 times of a predetermined center frequency based on the voltage value of the modulation signal as sampled and held.
摘要翻译：一种开关调节器，包括：开关元件，其连接到输入DC信号，并且用于接通和断开输入DC信号以产生诸如矩形波信号的AC信号; 整流器，用于对AC信号进行整流，从而产生输出电压; 用于产生具有恒定振幅的频率可变三角波信号的电路; 比较器，用于将三角波信号与整流器的输出电压进行比较，从而获得用于控制开关元件的操作的脉宽调制信号; 调制信号发生器，用于产生具有与三角波信号的频率不同步的振幅变化的调制信号; 采样和保持电路，用于在与三角波信号的频率同步的定时采样调制信号，或优选地在三角波信号的最大或最小值的定时处并保持采样的调制信号; 以及用于基于采样和保持的调制信号的电压值，优选在预定中心频率的大约0.8到1.2倍的范围内调制三角波信号的频率的电路。

3. 发明申请

US20120305945A1 POWER SEMICONDUCTOR DEVICE 有权
标题翻译：功率半导体器件
公开(公告)号：US20120305945A1
公开(公告)日：2012-12-06
申请号：US13578842
申请日：2011-02-18
申请人： Hosei Hirano
发明人： Hosei Hirano
IPC分类号： H01L29/02 , H01L29/16
CPC分类号： H01L24/48 , H01L24/05 , H01L24/33 , H01L24/45 , H01L24/83 , H01L24/85 , H01L2224/04042 , H01L2224/29111 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45184 , H01L2224/45565 , H01L2224/45647 , H01L2224/4847 , H01L2224/48491 , H01L2224/48599 , H01L2224/48699 , H01L2224/73265 , H01L2224/83205 , H01L2224/85205 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/12032 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13063 , H01L2924/13091 , H01L2924/20751 , H01L2924/351 , H01L2224/05556 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2224/45147 , H01L2924/00012 , H01L2924/2075
摘要： Provided is a power semiconductor device comprising a bonding joint that, even under a temperature environment of 150° C. or greater enabling operation of a wide bandgap semiconductor, reduces cracking-destruction occurring owing to thermal cycle while conductively connecting an electrode, connection terminal, and semiconductor device substrate.It is a power semiconductor device capable of operating under a temperature of 150° C. or greater having an electrode laminated on a wide bandgap semiconductor substrate and a connection terminal joined to the electrode for connection to external wiring, which power semiconductor device is characterized in that difference among the three coefficients of linear expansion of the electrode, a core of the connection terminal, and the semiconductor device substrate is 5.2×10−6/K at maximum, and that it comprises a joint that directly joins the connection terminal and the electrode.
摘要翻译：提供一种功率半导体器件，其包括接合接头，即使在150℃以上的温度环境下，能够进行宽带隙半导体的操作也能够减少由于热循环而产生的破坏破坏，同时导电连接电极，连接端子，和半导体器件衬底。它是能够在150℃或更高的温度下操作的功率半导体器件，其具有层叠在宽带隙半导体衬底上的电极和连接到用于连接到外部布线的电极的连接端子，该功率半导体器件的特征在于电极，连接端子的芯和半导体器件基板的三个线膨胀系数之间的差异最大为5.2×10-6 / K，并且包括直接连接连接端子和电极。

4. 发明授权

US08901569B2 Power semiconductor device 有权
标题翻译：功率半导体器件
公开(公告)号：US08901569B2
公开(公告)日：2014-12-02
申请号：US13578842
申请日：2011-02-18
申请人： Hosei Hirano
发明人： Hosei Hirano
IPC分类号： H01L29/15 , H01L23/00
CPC分类号： H01L24/48 , H01L24/05 , H01L24/33 , H01L24/45 , H01L24/83 , H01L24/85 , H01L2224/04042 , H01L2224/29111 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45184 , H01L2224/45565 , H01L2224/45647 , H01L2224/4847 , H01L2224/48491 , H01L2224/48599 , H01L2224/48699 , H01L2224/73265 , H01L2224/83205 , H01L2224/85205 , H01L2924/0001 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/12032 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13063 , H01L2924/13091 , H01L2924/20751 , H01L2924/351 , H01L2224/05556 , H01L2924/3512 , H01L2924/00 , H01L2224/29099 , H01L2224/45147 , H01L2924/00012 , H01L2924/2075
摘要： Provided is a power semiconductor device comprising a bonding joint that, even under a temperature environment of 150° C. or greater enabling operation of a wide bandgap semiconductor, reduces cracking-destruction occurring owing to thermal cycle while conductively connecting an electrode, connection terminal, and semiconductor device substrate.It is a power semiconductor device capable of operating under a temperature of 150° C. or greater having an electrode laminated on a wide bandgap semiconductor substrate and a connection terminal joined to the electrode for connection to external wiring, which power semiconductor device is characterized in that difference among the three coefficients of linear expansion of the electrode, a core of the connection terminal, and the semiconductor device substrate is 5.2×10−6/K at maximum, and that it comprises a joint that directly joins the connection terminal and the electrode.
摘要翻译：提供一种功率半导体器件，其包括接合接头，即使在150℃以上的温度环境下，能够进行宽带隙半导体的操作也能够减少由于热循环而产生的破坏破坏，同时导电连接电极，连接端子，和半导体器件衬底。它是能够在150℃或更高的温度下操作的功率半导体器件，其具有层叠在宽带隙半导体衬底上的电极和连接到用于连接到外部布线的电极的连接端子，该功率半导体器件的特征在于电极，连接端子的芯和半导体器件基板的三个线膨胀系数之间的差异最大为5.2×10-6 / K，并且包括直接连接连接端子和电极。

5. 发明授权

US5621636A Thin DC-DC converter arrangement 失效
标题翻译：薄型DC-DC转换器布置
公开(公告)号：US5621636A
公开(公告)日：1997-04-15
申请号：US341923
申请日：1994-11-16
申请人： Kenichi Tanigawa , Hosei Hirano , Shingo Katayama , Nobuyoshi Tanaka , Sueyuki Yahagi
发明人： Kenichi Tanigawa , Hosei Hirano , Shingo Katayama , Nobuyoshi Tanaka , Sueyuki Yahagi
IPC分类号： H01F19/04 , H02M3/00 , H05K7/20 , G05F3/16
CPC分类号： H02M3/00 , H01F19/04 , H05K7/209
摘要： A thin DC-DC converter arrangement which includes an inductor including a thin ring-shaped coil having a hole in its center and a thin ferrite core for providing a closed magnetic path passing through the central hole of the coil and interlinking the ring-shaped coil, a thin circuit board formed on its one surface with an electric circuit of the DC-DC converter, and a radiator having at least one flat part, wherein the inductor, the circuit board and the radiator are integrally assembled.
摘要翻译：一种薄型DC-DC转换器装置，其包括电感器，其包括在其中心具有孔的薄环形线圈和用于提供穿过线圈的中心孔的闭合磁路的薄铁氧体磁芯，并将环形线圈在其一个表面上形成有DC-DC转换器的电路的薄电路板和具有至少一个平坦部分的散热器，其中电感器，电路板和散热器被整体组装。

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