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    • 5. 发明申请
    • Resist patterning process and manufacturing photo mask
    • 抗蚀剂图案化工艺和制造光罩
    • US20100009271A1
    • 2010-01-14
    • US12457544
    • 2009-06-15
    • Takanobu TakedaSatoshi WatanabeTamotsu WatanabeAkinobu TanakaKeiichi MasunagaRyuji Koitabashi
    • Takanobu TakedaSatoshi WatanabeTamotsu WatanabeAkinobu TanakaKeiichi MasunagaRyuji Koitabashi
    • G03F1/00G03F7/20
    • G03F7/0392
    • There is disclosed a resist patterning process with a minimum line width of 65 nanometers or less may be formed by using a resist composition containing a polymer, as a base polymer of a chemically-amplified resist composition, composed of a styrene unit whose hydroxyl group is protected by an acid labile group, and an indene unit, and/or an acenaphthalene unit, wherein the polymer has the weight-average molecular weight of 4,000 to 7,000, and in particular, 4,500 to 5,500. One of the currently existing problems to be solved is the line edge roughness. To solve this problem by an acid-generator and a basic compound, there is a problem of the trade-off relationship with a resolution power. There can be provided a resist composition having a high resolution containing a base polymer such as hydroxystyrene that is protected by an acid labile group, a resist patterning process with a pattern rule of 65 nanometers or less having a reduced line edge roughness.
    • 公开了通过使用包含聚合物的抗蚀剂组合物形成最小线宽度为65纳米或更小的抗蚀剂图案化工艺,所述抗蚀剂组合物作为化学增强抗蚀剂组合物的基础聚合物,其由羟基为 由酸不稳定基团和茚单元和/或苊单元保护,其中聚合物的重均分子量为4,000-7,000,特别是4,500-5,500。 目前存在的问题之一是线边缘粗糙度。 为了通过酸发生剂和碱性化合物来解决这个问题,存在与分辨能力的权衡关系的问题。 可以提供具有高分辨率的抗蚀剂组合物,其含有由酸不稳定基团保护的羟基苯乙烯的基础聚合物,具有减少的线边缘粗糙度的图案规则为65纳米或更小的抗蚀剂图案化工艺。
    • 9. 发明授权
    • Resist patterning process and manufacturing photo mask
    • 抗蚀剂图案化工艺和制造光罩
    • US08110335B2
    • 2012-02-07
    • US12457544
    • 2009-06-15
    • Takanobu TakedaSatoshi WatanabeTamotsu WatanabeAkinobu TanakaKeiichi MasunagaRyuji Koitabashi
    • Takanobu TakedaSatoshi WatanabeTamotsu WatanabeAkinobu TanakaKeiichi MasunagaRyuji Koitabashi
    • G03F7/00G03F7/004G03F7/26G03F7/40
    • G03F7/0392
    • There is disclosed a resist patterning process with a minimum line width of 65 nanometers or less may be formed by using a resist composition containing a polymer, as a base polymer of a chemically-amplified resist composition, composed of a styrene unit whose hydroxyl group is protected by an acid labile group, and an indene unit, and/or an acenaphthalene unit, wherein the polymer has the weight-average molecular weight of 4,000 to 7,000, and in particular, 4,500 to 5,500. One of the currently existing problems to be solved is the line edge roughness. To solve this problem by an acid-generator and a basic compound, there is a problem of the trade-off relationship with a resolution power. There can be provided a resist composition having a high resolution containing a base polymer such as hydroxystyrene that is protected by an acid labile group, a resist patterning process with a pattern rule of 65 nanometers or less having a reduced line edge roughness.
    • 公开了通过使用包含聚合物的抗蚀剂组合物形成最小线宽度为65纳米或更小的抗蚀剂图案化工艺,所述抗蚀剂组合物作为化学增强抗蚀剂组合物的基础聚合物,其由羟基为 由酸不稳定基团和茚单元和/或苊单元保护,其中聚合物的重均分子量为4,000-7,000,特别是4,500-5,500。 目前存在的问题之一是线边缘粗糙度。 为了通过酸发生剂和碱性化合物来解决这个问题,存在与分辨能力的权衡关系的问题。 可以提供具有高分辨率的抗蚀剂组合物,其含有由酸不稳定基团保护的羟基苯乙烯的基础聚合物,具有减少的线边缘粗糙度的图案规则为65纳米或更小的抗蚀剂图案化工艺。