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1. 发明授权

US4555314A Tin-lead alloy plating bath 失效
标题翻译：锡铅合金电镀浴
公开(公告)号：US4555314A
公开(公告)日：1985-11-26
申请号：US649107
申请日：1984-09-10
申请人： Keigo Obata , Nobuyasu Dohi , Yoshiaki Okuhama , Seishi Masaki , Yukiyoshi Okada , Tadashi Yoshida
发明人： Keigo Obata , Nobuyasu Dohi , Yoshiaki Okuhama , Seishi Masaki , Yukiyoshi Okada , Tadashi Yoshida
IPC分类号： C25D3/56 , C25D3/60
CPC分类号： C25D3/56 , C25D3/60
摘要： A tin-lead alloy plating bath based on a principal plating bath comprising an alkanesulfonic or alkanolsulfonic acid and both bivalent tin and lead salts thereof is characterized by the addition of a guanamine compound having the general formula ##STR1## wherein R.sub.1 and R.sub.2, which may be the same or different, represent each a hydrogen atom, C.sub.1-18 straight- or branched-chain alkyl radical, C.sub.1-18 straight- or branched-chain alkoxy-lower alkyl radical, or a C.sub.3-7 cycloalkyl radical, or R.sub.1 and R.sub.2 may combine to form a carbon cycle or hetero cycle, and A represents a lower alkylene radical.
摘要翻译：基于包含烷烃磺酸或链烷醇磺酸的二次锡和铅盐的主镀液的锡铅合金电镀浴的特征在于加入通式为“IMAGE”的胍胺化合物，其中R 1和R 2可以相同或不同，表示氢原子，C1-18直链或支链烷基，C1-18直链或支链烷氧基 - 低级烷基或C3-7环烷基，或R1和 R2可以结合形成碳循环或杂环，A代表低级亚烷基。

2. 发明授权

US4673470A Tin, lead, or tin-lead alloy plating bath 失效
标题翻译：锡，铅或锡铅合金电镀浴
公开(公告)号：US4673470A
公开(公告)日：1987-06-16
申请号：US831762
申请日：1986-02-21
申请人： Keigo Obata , Nobuyasu Dohi , Yoshiaki Okuhama , Seishi Masaki , Yukiyoshi Okada , Masakazu Yoshimoto
发明人： Keigo Obata , Nobuyasu Dohi , Yoshiaki Okuhama , Seishi Masaki , Yukiyoshi Okada , Masakazu Yoshimoto
IPC分类号： C25D3/32 , C25D3/36 , C25D3/60 , C25D3/56
CPC分类号： C25D3/60 , C25D3/32 , C25D3/36
摘要： A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula ##STR1## wherein R is a C.sub.1-4 hydrocarbon radical, M.sub.1 is a hydrogen atom or alkali metal atom, M.sub.2 is an alkali metal atom, and X.sub.1 and X.sub.2 are each a hydrogen atom, OH, COON, or SO.sub.3 N (where N represents a hydrogen atom or alkali metal atom).
摘要翻译：一种锡，铅或锡铅合金电镀浴，其包含作为必要成分的碱金属盐和可溶性二价锡化合物或/和铅化合物，所有的通式为“IMAGE”的脂族或芳族磺基羧酸 >其中R是C1-4烃基，M1是氢原子或碱金属原子，M2是碱金属原子，X1和X2各自是氢原子，OH，COON或SO3N（其中N表示氢原子或碱金属原子）。

3. 发明授权

US4459185A Tin, lead, and tin-lead alloy plating baths 失效
标题翻译：锡，铅和锡铅合金电镀浴
公开(公告)号：US4459185A
公开(公告)日：1984-07-10
申请号：US532934
申请日：1983-09-16
申请人： Keigo Obata , Nobuyasu Dohi , Yoshiaki Okuhama , Seishi Masaki , Yukiyoshi Okada , Masakazu Yoshimoto
发明人： Keigo Obata , Nobuyasu Dohi , Yoshiaki Okuhama , Seishi Masaki , Yukiyoshi Okada , Masakazu Yoshimoto
IPC分类号： C25D3/30 , C25D3/32 , C25D3/34 , C25D3/36 , C25D3/56 , C25D3/60
CPC分类号： C25D3/32 , C25D3/36 , C25D3/56 , C25D3/60
摘要： A tin, lead or tin-lead alloy plating bath, which comprises(A) a principal plating bath containing an alkanesulfonic or alkanolsulfonic acid, and either a divalent tin salt or a divalent lead salt thereof or both;(B) at least one of surfactants comprising(a) a cationic surfactant selected from the group consisting of quarternary ammonium salts, alkyl pyridinium salts, alkyl imidazolinium salts and higher alkyl amine salts,(b) an amphoteric surfactant selected from betaines, or(c) a nonionic surfactant selected from the group consisting of condensation products of ethylene oxide and/or propylene oxide with a styrenated phenol, a higher alcohol, an alkylphenol, an alkylnaphthol, a fatty acid amide, a sorbitan or a phosphate; and(C) at least one of levelling agents selected from the group consisting of alkylidene sulfamic acids, quinolinol derivatives, benzotriazole derivatives, dialkylidene o-phenylene diamines, benzaldehyde derivatives, triazine derivatives, salicylic acid derivatives and nitriles.
摘要翻译：锡，铅或锡铅合金电镀浴，其包含（A）含有烷烃磺酸或链烷醇磺酸的主要电镀液，以及二价锡盐或其二价铅盐或两者; （B）至少一种表面活性剂，其包含（a）选自季铵盐，烷基吡啶鎓盐，烷基咪唑啉鎓盐和高级烷基胺盐的阳离子表面活性剂，（b）选自甜菜碱的两性表面活性剂或（ c）选自环氧乙烷和/或环氧丙烷与苯乙烯化酚，高级醇，烷基酚，烷基萘酚，脂肪酸酰胺，脱水山梨糖醇或磷酸酯的缩合产物的非离子表面活性剂; 和（C）选自亚烷基氨基磺酸，羟基喹啉衍生物，苯并三唑衍生物，二烷基亚苯基二胺，苯甲醛衍生物，三嗪衍生物，水杨酸衍生物和腈的至少一种流平剂。

4. 发明授权

US4132610A Method of bright electroplating of tin-lead alloy 失效
标题翻译：锡铅合金的电镀方法
公开(公告)号：US4132610A
公开(公告)日：1979-01-02
申请号：US687582
申请日：1976-05-18
申请人： Nobuyasu Dohi , Keigo Obata
发明人： Nobuyasu Dohi , Keigo Obata
IPC分类号： C25D3/00 , C25D3/60
CPC分类号： C25D3/60 , C25D3/02
摘要： A method of electroplating of tin-lead alloys, which comprises using a solution containing hydroxyalkyl sulfonic acid and its divalent tin salts and lead salts, said solution being mixed with reaction products of acetaldehyde with O-toluidine as additives for brightening.
摘要翻译：一种锡铅合金的电镀方法，其包括使用含有羟烷基磺酸及其二价锡盐和铅盐的溶液，所述溶液与乙醛与邻甲苯胺的反应产物混合，作为增亮剂。

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