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1. 发明授权

US08118646B2 Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method 有权
标题翻译：双面抛光装置的载体，使用它的双面研磨装置和双面抛光方法
公开(公告)号：US08118646B2
公开(公告)日：2012-02-21
申请号：US13055302
申请日：2009-07-23
申请人： Kazuya Sato , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo
发明人： Kazuya Sato , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo
IPC分类号： B24B1/00
CPC分类号： B24B37/28
摘要： A carrier for a double-side polishing apparatus, including at least: a carrier base placed between upper and lower turn tables, the carrier base having a holding hole therein, the holding hole holds the wafer sandwiched between the upper and lower turn tables. A ring-shaped resin ring disposed along an inner circumference of the holding hole, the resin ring protecting a chamfered portion by making contact with the chamfered portion of the held wafer, wherein the resin ring has a concave groove on an inner circumference thereof, upper and lower tapered surfaces are formed in the concave groove. A double-side polishing apparatus using the carrier and a double-side polishing method that can reduce the generation of taper in a polished surface and improve the flatness while suppressing the generation of an outer peripheral sag of the wafer.
摘要翻译：一种用于双面抛光装置的载体，其至少包括：设置在上下匝台之间的载体基座，所述载体基座在其中具有保持孔，所述保持孔保持夹在所述上下转台之间的所述晶片。环形树脂环沿着保持孔的内周设置，树脂环通过与保持晶片的倒角部分接触来保护倒角部分，其中树脂环在其内周上具有凹槽，上部并且在凹槽中形成下锥形表面。使用该载体的双面研磨装置和能够减少抛光面的锥形的产生的双面研磨方法，能够在抑制晶片的外周凹陷的产生的同时提高平坦度。

2. 发明申请

US20110124271A1 CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING APPARATUS USING THE SAME, AND DOUBLE-SIDE POLISHING METHOD 有权
标题翻译：双面抛光装置的载体，使用该双面抛光装置的双面抛光装置和双面抛光方法
公开(公告)号：US20110124271A1
公开(公告)日：2011-05-26
申请号：US13055302
申请日：2009-07-23
申请人： Kazuya Sato , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo
发明人： Kazuya Sato , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo
IPC分类号： H01L21/304 , B24B37/04 , B24B1/00
CPC分类号： B24B37/28
摘要： A carrier for a double-side polishing apparatus, including at least: a carrier base placed between upper and lower turn tables, the carrier base having a holding hole therein, the holding hole holds the wafer sandwiched between the upper and lower turn tables. A ring-shaped resin ring disposed along an inner circumference of the holding hole, the resin ring protecting a chamfered portion by making contact with the chamfered portion of the held wafer, wherein the resin ring has a concave groove on an inner circumference thereof, upper and lower tapered surfaces are formed in the concave groove. A double-side polishing apparatus using the carrier and a double-side polishing method that can reduce the generation of taper in a polished surface and improve the flatness while suppressing the generation of an outer peripheral sag of the wafer.
摘要翻译：一种用于双面抛光装置的载体，其至少包括：设置在上下匝台之间的载体基座，所述载体基座在其中具有保持孔，所述保持孔保持夹在所述上下转台之间的所述晶片。环形树脂环沿着保持孔的内周设置，树脂环通过与保持晶片的倒角部分接触来保护倒角部分，其中树脂环在其内周上具有凹槽，上部并且在凹槽中形成下锥形表面。使用该载体的双面研磨装置和能够减少抛光面的锥形的产生的双面研磨方法，能够在抑制晶片的外周凹陷的产生的同时提高平坦度。

3. 发明授权

US08454410B2 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US08454410B2
公开(公告)日：2013-06-04
申请号：US12449400
申请日：2008-01-29
申请人： Koji Kitagawa , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo , Tadakazu Miyashita , Atsushi Kajikura , Yoshinobu Nishimoto
发明人： Koji Kitagawa , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo , Tadakazu Miyashita , Atsushi Kajikura , Yoshinobu Nishimoto
IPC分类号： B24B29/00
CPC分类号： B24B37/015 , B24B37/08 , B24B55/06
摘要： Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.
摘要翻译：本发明提供一种抛光装置，其包括下部凳子（12），用于驱动下部凳子的电动机（18a）和减速器（19a）以及用于至少覆盖下部工作部分的下部凳子的箱体（17）动作面。抛光装置通过迫使晶片接触下粪和旋转下粪来抛光晶片。箱体的内部由隔板（31a和31b）分隔成多个区域，并且用于驱动下部便器的电动机布置在除了包含下部凳子的区域以外的区域中。抛光装置可以制造具有稳定形状的晶片，而与运行开始所经过的时间和抛光装置的停止的存在/不存在无关。

4. 发明申请

US20100144249A1 POLISHING APPARATUS 有权
标题翻译：抛光装置
公开(公告)号：US20100144249A1
公开(公告)日：2010-06-10
申请号：US12449400
申请日：2008-01-29
申请人： Koji Kitagawa , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo , Tadakazu Miyashita , Atsushi Kajikura , Yoshinobu Nishimoto
发明人： Koji Kitagawa , Junichi Ueno , Syuichi Kobayashi , Hideo Kudo , Tadakazu Miyashita , Atsushi Kajikura , Yoshinobu Nishimoto
IPC分类号： B24B7/17 , B24B7/20 , B24B41/06 , B24B55/00 , B24B47/00
CPC分类号： B24B37/015 , B24B37/08 , B24B55/06
摘要： Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.
摘要翻译：本发明提供一种抛光装置，其包括下部凳子（12），用于驱动下部凳子的电动机（18a）和减速器（19a）以及用于至少覆盖下部工作部分的下部凳子的箱体（17）动作面。抛光装置通过迫使晶片接触下粪和旋转下粪来抛光晶片。箱体的内部由隔板（31a和31b）分隔成多个区域，并且用于驱动下部便器的电动机布置在除了包含下部凳子的区域以外的区域中。抛光装置可以制造具有稳定形状的晶片，而与运行开始所经过的时间和抛光装置的停止的存在/不存在无关。

5. 发明授权

US09327382B2 Carrier for a double-side polishing apparatus, double-side polishing apparatus using this carrier, and double-side polishing method 有权
标题翻译：用于双面抛光装置的载体，使用该载体的双面抛光装置和双面抛光方法
公开(公告)号：US09327382B2
公开(公告)日：2016-05-03
申请号：US12863674
申请日：2009-02-16
申请人： Junichi Ueno , Kazuya Sato , Syuichi Kobayashi
发明人： Junichi Ueno , Kazuya Sato , Syuichi Kobayashi
IPC分类号： B24B37/04 , B24B37/08 , B24B37/28 , B24B37/32
CPC分类号： B24B37/28 , B24B37/042 , B24B37/08
摘要： A carrier for a double-side polishing apparatus comprising at least: a metallic carrier base that is arranged between upper and lower turn tables having polishing pads attached thereto and has a holding hole formed therein to hold a wafer sandwiched between the upper and lower turn tables at the time of polishing; and a ring-like resin insert that is arranged along an inner peripheral portion of the holding hole of the carrier base and is in contact with a peripheral portion of the held wafer, wherein an inner peripheral end portion of the holding hole of the carrier base has an upwardly opening tapered surface, an outer peripheral portion of the ring-like insert has a reverse tapered surface with respect to the tapered surface of the holding hole of the carrier base, and the resin insert is fitted in the holding hole of the carrier base through the tapered surface.
摘要翻译：一种用于双面抛光装置的载体，至少包括：金属载体基座，其布置在上下转台之间，具有安装在其上的抛光垫，并具有形成在其中的保持孔，以夹持夹在上下转台之间的晶片抛光时; 以及环状树脂插入件，其沿着所述承载基座的保持孔的内周部配置并与所述保持晶片的周边部分接触，其中，所述承载器基座的所述保持孔的内周端部具有向上开口的锥形表面，环形插入件的外周部分相对于承载器基座的保持孔的锥形表面具有倒锥形表面，并且树脂插入件装配在载体的保持孔中基部通过锥形表面。

6. 发明授权

US08834234B2 Double-side polishing apparatus 有权
标题翻译：双面抛光装置
公开(公告)号：US08834234B2
公开(公告)日：2014-09-16
申请号：US13509696
申请日：2010-11-16
申请人： Junichi Ueno , Kazuya Sato , Syuichi Kobayashi
发明人： Junichi Ueno , Kazuya Sato , Syuichi Kobayashi
IPC分类号： B24B37/013 , B24B37/08
CPC分类号： B24B37/013 , B24B37/08
摘要： A double-side polishing apparatus including at least: upper and lower turn tables each having a polishing pad attached thereto; a carrier having a holding hole formed therein for holding a wafer between the upper and lower turn tables; a sensor for detecting a thickness of the wafer during polishing, the sensor being disposed in a through-hole provided at the upper turn table in a direction of an upper-turn-table rotation axis; and a sensor holder for holding the sensor, wherein a material of the sensor holder is quartz. As a result, there is provided a double-side polishing apparatus that can polish a wafer while the difference from the target wafer thickness is reduced by surely inhibiting deformation of the sensor holder due to the influence of heat generated during the polishing of the wafer.
摘要翻译：一种双面抛光装置，其至少包括：上下转台，每个具有附着在其上的抛光垫; 具有形成在其中用于将晶片保持在上下转台之间的保持孔的载体; 用于在抛光期间检测晶片的厚度的传感器，所述传感器设置在设置在所述上转台上的通孔中，所述通孔沿上转盘旋转轴线的方向; 以及用于保持传感器的传感器保持器，其中传感器保持器的材料是石英。结果，提供了一种双面抛光装置，其可以通过可靠地抑制由于在晶片的抛光期间产生的热的影响而可靠地抑制传感器保持器的变形，从而可以减少与目标晶片厚度之间的差异。

7. 发明申请

US20120329373A1 DOUBLE-SIDE POLISHING APPARATUS 有权
标题翻译：双面抛光装置
公开(公告)号：US20120329373A1
公开(公告)日：2012-12-27
申请号：US13509696
申请日：2010-11-16
申请人： Junichi Ueno , Kazuya Sato , Syuichi Kobayashi
发明人： Junichi Ueno , Kazuya Sato , Syuichi Kobayashi
IPC分类号： B24B49/00 , B24B7/00
CPC分类号： B24B37/013 , B24B37/08
摘要： A double-side polishing apparatus including at least: upper and lower turn tables each having a polishing pad attached thereto; a carrier having a holding hole formed therein for holding a wafer between the upper and lower turn tables; a sensor for detecting a thickness of the wafer during polishing, the sensor being disposed in a through-hole provided at the upper turn table in a direction of an upper-turn-table rotation axis; and a sensor holder for holding the sensor, wherein a material of the sensor holder is quartz. As a result, there is provided a double-side polishing apparatus that can polish a wafer while the difference from the target wafer thickness is reduced by surely inhibiting deformation of the sensor holder due to the influence of heat generated during the polishing of the wafer.
摘要翻译：一种双面抛光装置，其至少包括：上下转台，每个具有附着在其上的抛光垫; 具有形成在其中用于将晶片保持在上下转台之间的保持孔的载体; 用于在抛光期间检测晶片的厚度的传感器，所述传感器设置在设置在所述上转台上的通孔中，所述通孔沿上转盘旋转轴线的方向; 以及用于保持传感器的传感器保持器，其中传感器保持器的材料是石英。结果，提供了一种双面抛光装置，其可以通过可靠地抑制由于在晶片抛光期间产生的热的影响而可靠地抑制传感器保持器的变形，从而可以减少与目标晶片厚度的差异，从而抛光晶片。

8. 发明申请

US20110104995A1 CARRIER FOR A DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING APPARATUS USING THIS CARRIER, AND DOUBLE-SIDE POLISHING METHOD 有权
标题翻译：双面抛光装置的承载器，使用该载体的双面抛光装置和双面抛光方法
公开(公告)号：US20110104995A1
公开(公告)日：2011-05-05
申请号：US12863674
申请日：2009-02-16
申请人： Junichi Ueno , Kazuya Sato , Syuichi Kobayashi
发明人： Junichi Ueno , Kazuya Sato , Syuichi Kobayashi
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B37/28 , B24B37/042 , B24B37/08
摘要： A carrier for a double-side polishing apparatus comprising at least: a metallic carrier base that is arranged between upper and lower turn tables having polishing pads attached thereto and has a holding hole formed therein to hold a wafer sandwiched between the upper and lower turn tables at the time of polishing; and a ring-like resin insert that is arranged along an inner peripheral portion of the holding hole of the carrier base and is in contact with a peripheral portion of the held wafer, wherein an inner peripheral end portion of the holding hole of the carrier base has an upwardly opening tapered surface, an outer peripheral portion of the ring-like insert has a reverse tapered surface with respect to the tapered surface of the holding hole of the carrier base, and the resin insert is fitted in the holding hole of the carrier base through the tapered surface.
摘要翻译：一种用于双面抛光装置的载体，至少包括：金属载体基座，其布置在上下转台之间，具有安装在其上的抛光垫，并具有形成在其中的保持孔，以夹持夹在上下转台之间的晶片抛光时; 以及环状树脂插入件，其沿着所述承载基座的保持孔的内周部配置并与所述保持晶片的周边部分接触，其中，所述承载器基座的所述保持孔的内周端部具有向上开口的锥形表面，环形插入件的外周部分相对于承载器基座的保持孔的锥形表面具有倒锥形表面，并且树脂插入件装配在载体的保持孔中基部通过锥形表面。

9. 发明授权

US08545291B2 Polishing pad, manufacturing method thereof and polishing method 有权
标题翻译：抛光垫，其制造方法和抛光方法
公开(公告)号：US08545291B2
公开(公告)日：2013-10-01
申请号：US13379588
申请日：2010-06-22
申请人： Kohki Itoyama , Daisuke Takahashi , Junichi Ueno , Syuichi Kobayashi
发明人： Kohki Itoyama , Daisuke Takahashi , Junichi Ueno , Syuichi Kobayashi
IPC分类号： B24B37/04
CPC分类号： B24B37/24 , B24D3/32 , H01L21/02024
摘要： A polishing pad capable of improving an affinity to polishing liquid and stabilizing polishing performance is provided. A polishing pad 10 is equipped with a urethane sheet 2. The urethane sheet 2 has a polishing surface P for polishing an object to be polished. The urethane sheet 2 is formed by a dry molding method and is formed by slicing a polyurethane foamed body which is obtained by reacting and curing mixed liquid in which an isocyanate-group containing compound, water, a foam control agent and a polyamine compound are mixed. Foams 3 are dispersed approximately uniformly inside the urethane sheet 2. Opened pores 4 which are opened parts of the foams 3 are formed at the polishing surface P. Inside the urethane sheet 2, the foams 3 formed adjacently to each other are communicated by communication holes 9, and the communication holes 9 are formed at a ratio of 800 holes/cm2 or more when observed from a side of the polishing surface P. Polishing liquid moves via the communication holes 9 and the foams 3.
摘要翻译：提供了能够提高对抛光液的亲和性和稳定研磨性能的抛光垫。抛光垫10配备有聚氨酯片2.聚氨酯片2具有用于抛光待抛光物体的抛光面P. 氨基甲酸酯片2通过干式成型法形成，通过将通过使含有异氰酸酯基的化合物，水，泡沫调节剂和多胺化合物混合的混合液反应固化而得到的聚氨酯发泡体切片而形成。泡沫3大致均匀地分散在聚氨酯片材2内。在研磨面P上形成作为泡沫体3的开口部的开口孔4.在氨基甲酸酯片材2的内部，相邻形成的泡沫体3通过连通孔如图9所示，并且当从抛光表面P的侧面观察时，连通孔9以800个孔/ cm 2以上的比例形成。抛光液体经由连通孔9和泡沫3移动。

10. 发明申请

US20120100783A1 POLISHING PAD, MANUFACTURING METHOD THEREOF AND POLISHING METHOD 有权
标题翻译：抛光垫及其制造方法及抛光方法
公开(公告)号：US20120100783A1
公开(公告)日：2012-04-26
申请号：US13379588
申请日：2010-06-22
申请人： Kohki Itoyama , Daisuke Takahashi , Junichi Ueno , Syuichi Kobayashi
发明人： Kohki Itoyama , Daisuke Takahashi , Junichi Ueno , Syuichi Kobayashi
IPC分类号： B24B1/00 , B24D18/00 , B24D11/00
CPC分类号： B24B37/24 , B24D3/32 , H01L21/02024
摘要： A polishing pad capable of improving an affinity to polishing liquid and stabilizing polishing performance is provided. A polishing pad 10 is equipped with a urethane sheet 2. The urethane sheet 2 has a polishing surface P for polishing an object to be polished. The urethane sheet 2 is formed by a dry molding method and is formed by slicing a polyurethane foamed body which is obtained by reacting and curing mixed liquid in which an isocyanate-group containing compound, water, a foam control agent and a polyamine compound are mixed. Foams 3 are dispersed approximately uniformly inside the urethane sheet 2. Opened pores 4 which are opened parts of the foams 3 are formed at the polishing surface P. Inside the urethane sheet 2, the foams 3 formed adjacently to each other are communicated by communication holes 9, and the communication holes 9 are formed at a ratio of 800 holes/cm2 or more when observed from a side of the polishing surface P. Polishing liquid moves via the communication holes 9 and the foams 3.
摘要翻译：提供了能够提高对抛光液的亲和性和稳定研磨性能的抛光垫。抛光垫10配备有聚氨酯片2.聚氨酯片2具有用于抛光待抛光物体的抛光面P. 氨基甲酸酯片2通过干式成型法形成，通过将通过使含有异氰酸酯基的化合物，水，泡沫调节剂和多胺化合物混合的混合液反应固化而得到的聚氨酯发泡体切片而形成。泡沫3大致均匀地分散在聚氨酯片材2内。在研磨面P上形成作为泡沫体3的开口部的开口孔4.在氨基甲酸酯片材2的内部，相邻形成的泡沫体3通过连通孔如图9所示，并且当从抛光表面P的侧面观察时，连通孔9以800个孔/ cm 2以上的比例形成。抛光液体经由连通孔9和泡沫3移动。

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