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1. 发明申请

US20080286785A1 Method to predict or monitor the response of a patient to an erbb receptor drug 审中-公开
标题翻译：预测或监测患者对erbb受体药物反应的方法
公开(公告)号：US20080286785A1
公开(公告)日：2008-11-20
申请号：US12080959
申请日：2008-04-07
申请人： Kazuto Nishio , Hideharu Kimura , Kazuo Kasahara
发明人： Kazuto Nishio , Hideharu Kimura , Kazuo Kasahara
IPC分类号： C12Q1/68
CPC分类号： C12Q1/6886 , C12Q2600/106 , C12Q2600/156
摘要： The invention provides a method of detecting ErbB receptor mutations comprising the steps of providing a bio-fluid sample from a patient; extracting DNA from said sample; and screening said DNA for the presence of one or more mutations that alter tyrosine kinase activity in the receptor.
摘要翻译：本发明提供了一种检测ErbB受体突变的方法，其包括从患者提供生物流体样品的步骤; 从所述样品中提取DNA; 并筛选出所述DNA存在一种或多种改变受体中酪氨酸激酶活性的突变。

2. 发明授权

US06687028B1 Image exposure apparatus 失效
标题翻译：图像曝光装置
公开(公告)号：US06687028B1
公开(公告)日：2004-02-03
申请号：US09559859
申请日：2000-04-27
申请人： Kazuo Kasahara , Eiji Ito , Atsushi Suzuki
发明人： Kazuo Kasahara , Eiji Ito , Atsushi Suzuki
IPC分类号： H04N146
CPC分类号： H04N1/02409 , B41J2/45 , B41J2/525 , H04N1/047 , H04N1/12 , H04N1/193 , H04N2201/04 , H04N2201/04712 , H04N2201/04732 , H04N2201/04744 , H04N2201/04755
摘要： An image exposing apparatus for exposing an image onto a light sensitive material, is provided with a plurality of light beam emitting element arrays, each light beam emitting element array emitting aligned-light beams which are aligned in at least a single line; a light mixing device for mixing a plurality of aligned-light beams emitted from the plurality of light beam emitting element arrays and for emitting mixed-aligned-light beams which are aligned in the same line; a light receiving device located so as to receive the mixed-aligned-light beams at a position where the light sensitive material is exposed; and an adjusting device for adjusting a position of each of the plurality of light beam emitting element arrays based on a light receiving result by the light receiving means.
摘要翻译：用于将图像曝光到感光材料上的图像曝光装置设置有多个光束发射元件阵列，每个光束发射元件阵列发射排列在至少一条直线上的对准光束; 光混合装置，用于混合从所述多个光束发射元件阵列发射的多个对准光束，并用于发射在同一直线上排列的混合对准光束; 光接收装置，其被定位成在所述感光材料被曝光的位置处接收所述混合对准光束; 以及调节装置，用于基于光接收装置的光接收结果调整多个光束发射元件阵列中的每一个的位置。

3. 发明授权

US06552642B1 Electronic device having electric wires and method of producing same 有权
标题翻译：具有电线的电子装置及其制造方法
公开(公告)号：US06552642B1
公开(公告)日：2003-04-22
申请号：US09317665
申请日：1999-05-24
申请人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
发明人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
IPC分类号： H01F2729
CPC分类号： B23K20/023 , B23K2101/40 , H01F17/045 , H01F27/292 , H01F41/10 , H01L2924/0002 , H01L2924/00
摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag—Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.
摘要翻译：包括以高度可靠的方式牢固地连接到电极的电线的芯片线圈等电子装置被构造成以稳定可靠的方式安装在印刷电路板或基板上。在芯片线圈的芯的两端，设置有包括由Ag，Ag-Pd或类似材料制成的高导电层的多层结构的电极; 由Ni制成的阻焊层; 以及由Sn或焊料制成的易焊层。电线的端部埋设在易焊接层中，使得所得的电极结构具有基本平坦的表面。进行热压处理，使得电线的端部通过固体焊接与阻焊层连接，并通过钎焊与易焊接层连接。

4. 发明授权

US06522230B2 Chip-type common mode choke coil 有权
公开(公告)号：US06522230B2
公开(公告)日：2003-02-18
申请号：US09906250
申请日：2001-07-16
申请人： Yoshio Hanato , Kazuo Kasahara
发明人： Yoshio Hanato , Kazuo Kasahara
IPC分类号： H01F500
CPC分类号： H01F27/292 , H01F17/045 , H01F27/027 , H01F2017/0093
摘要： A chip-type common mode choke coil having protrusions extending in an axial direction of a winding core portion and being formed in areas between a plurality of electrodes (four electrodes), at the inside surfaces of two flanges, that is, at opposing surfaces of the two flanges, one being disposed on each end of the winding core portion, in order to increase the stroke distances between the corresponding electrodes. In the choke coil, the protrusions separate the corresponding electrodes in order to prevent the occurrence of a short circuit caused by two wires also coming into contact with the electrodes adjacent to the electrodes to which they are primarily to be connected. For the protrusions, protrusions having at least one of a triangular shape, a square shape, a rectangular shape, a trapezoidal shape, and a substantially semicircular shape in plan view are disposed. Accordingly, the chip-type common mode choke coil makes it possible to prevent the occurrence of a short circuit caused by the wires coming into contact with the corresponding adjacent electrodes, the occurrence of reduced withstand pressure, and the occurrence of insufficient insulation. In addition, it can have high mechanical strength as a result of increased cross-sectional areas of the legs, and be highly reliable.

5. 发明授权

US6119924A Electronic device having electric wires and method of producing same 有权
公开(公告)号：US6119924A
公开(公告)日：2000-09-19
申请号：US432979
申请日：1999-11-03
申请人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
发明人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
IPC分类号： B23K20/02 , B23K20/00
CPC分类号： B23K20/023 , B23K2201/40
摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

6. 发明授权

US06027008A Electronic device having electric wires and method of producing same 失效
公开(公告)号：US06027008A
公开(公告)日：2000-02-22
申请号：US076549
申请日：1998-05-12
申请人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
发明人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
IPC分类号： B23K20/02 , H01F17/04 , H01F27/29 , H01F41/10 , H05K3/34 , H01L21/603 , H01L21/607
CPC分类号： B23K20/023 , H01F27/292 , H01F41/10 , B23K2201/40 , H01F17/045 , H01L2924/0002
摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

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