专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06552642B1 Electronic device having electric wires and method of producing same 有权
标题翻译：具有电线的电子装置及其制造方法
公开(公告)号：US06552642B1
公开(公告)日：2003-04-22
申请号：US09317665
申请日：1999-05-24
申请人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
发明人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
IPC分类号： H01F2729
CPC分类号： B23K20/023 , B23K2101/40 , H01F17/045 , H01F27/292 , H01F41/10 , H01L2924/0002 , H01L2924/00
摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag—Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.
摘要翻译：包括以高度可靠的方式牢固地连接到电极的电线的芯片线圈等电子装置被构造成以稳定可靠的方式安装在印刷电路板或基板上。在芯片线圈的芯的两端，设置有包括由Ag，Ag-Pd或类似材料制成的高导电层的多层结构的电极; 由Ni制成的阻焊层; 以及由Sn或焊料制成的易焊层。电线的端部埋设在易焊接层中，使得所得的电极结构具有基本平坦的表面。进行热压处理，使得电线的端部通过固体焊接与阻焊层连接，并通过钎焊与易焊接层连接。

2. 发明授权

US6119924A Electronic device having electric wires and method of producing same 有权
公开(公告)号：US6119924A
公开(公告)日：2000-09-19
申请号：US432979
申请日：1999-11-03
申请人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
发明人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
IPC分类号： B23K20/02 , B23K20/00
CPC分类号： B23K20/023 , B23K2201/40
摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

3. 发明授权

US06027008A Electronic device having electric wires and method of producing same 失效
公开(公告)号：US06027008A
公开(公告)日：2000-02-22
申请号：US076549
申请日：1998-05-12
申请人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
发明人： Takaomi Toi , Tetsuya Morinaga , Masahiro Bando , Tetsuo Hatakenaka , Kazuo Kasahara , Koki Sasaki , Takayuki Hirotsuji
IPC分类号： B23K20/02 , H01F17/04 , H01F27/29 , H01F41/10 , H05K3/34 , H01L21/603 , H01L21/607
CPC分类号： B23K20/023 , H01F27/292 , H01F41/10 , B23K2201/40 , H01F17/045 , H01L2924/0002
摘要： An electronic device such as a chip coil including an electric wire firmly connected to electrodes in a highly reliable fashion is constructed to be mounted on a printed circuit board or substrate in a stable and reliable manner. At both ends of a core of the chip coil, there are provided electrodes having a multilayer structure including a high-conductivity layer made of Ag, Ag--Pd, or a similar material; a solder barrier layer made of Ni; and an easy-soldering layer made of Sn or solder. End portions of the electric wire are embedded in the easy-soldering layer so that the resultant electrode structure has a substantially flat surface. A thermo-compression process is performed so that the end portions of the electric wire are connected to the solder barrier layer via solid welding and to the easy-soldering layer via brazing.

4. 发明授权

US06515566B1 Electronic component having wire 有权
标题翻译：具有电线的电子部件
公开(公告)号：US06515566B1
公开(公告)日：2003-02-04
申请号：US09676624
申请日：2000-10-02
申请人： Takaomi Toi , Tetsuya Morinaga
发明人： Takaomi Toi , Tetsuya Morinaga
IPC分类号： H01F2729
CPC分类号： H01F17/045 , H01F27/292
摘要： An electronic component is constructed to prevent Cu elution to a solder from a wire, and also prevents the wire from becoming thin and being broken. A chip coil includes electrodes provided at both ends of a core. The electrodes include an underlying metal layer (Ag), a Ni plated layer, and a Sn—Cu plated layer arranged in this sequence from the bottom thereof. Ends of a wire are embedded in the Sn—Cu plated layer of the electrodes by thermal compression bonding. When the chip coil is mounted on a land of a substrate by a reflow soldering, the Cu of the Sn—Cu plated layer is eluted into the reflow solder, and Cu elution from the wire is prevented
摘要翻译：构造电子部件，以防止铜从焊丝中溶解到焊料，并且还防止电线变薄并被破坏。芯片线圈包括设置在芯的两端的电极。电极包括从其底部按顺序排列的下层金属层（Ag），Ni镀层和Sn-Cu镀层。线的端部通过热压接而嵌入电极的Sn-Cu镀层中。当通过回流焊接将芯片线圈安装在基板的台面上时，Sn-Cu镀层的Cu被洗脱回流焊料中，并且防止了从电线中的Cu洗脱

5. 发明申请

US20050115628A1 Coil-winding method and coil unit formed by the method 有权
标题翻译：通过该方法形成的线圈绕组方法和线圈单元
公开(公告)号：US20050115628A1
公开(公告)日：2005-06-02
申请号：US10935114
申请日：2004-09-08
申请人： Koki Sasaki , Takaomi Toi
发明人： Koki Sasaki , Takaomi Toi
IPC分类号： H01F41/06 , B21F3/00
CPC分类号： H01F41/066 , H01F41/082
摘要： A coil-winding method for forming a coil unit includes the steps of winding first and second wires substantially parallel to each other simultaneously around a first layer position of a core to form a first turn, winding the first and second wires simultaneously to form a second turn while the second wire is disposed directly around the core, the first wire of the second turn adjacent to the first turn being disposed between the first and second wires of the first turn in the first layer so as to form a second layer, and winding the first and second wires simultaneously to form a third turn while the second wire is disposed directly around the core, the first wire of the third turn being disposed in the second layer and wound between the second wire of the first turn and the second wire of the second turn in the first layer.
摘要翻译：一种用于形成线圈单元的线圈绕组方法包括以下步骤：绕着芯的第一层位置同时缠绕基本上彼此平行的第一和第二电线，以形成第一匝，同时缠绕第一和第二电线以形成第二线在第二线直接设置在芯周围的情况下转动，与第一匝相邻的第二匝的第一线被设置在第一匝的第一匝的第一和第二线之间，以形成第二层，并且绕组所述第一和第二线同时形成第三匝，而所述第二线直接设置在所述芯周围，所述第三匝的所述第一线设置在所述第二层中并缠绕在所述第一匝的第二线和所述第二匝的第二线之间第二回合第一层。

6. 发明授权

US06480083B1 Coil device and method for manufacturing the same 有权
标题翻译：线圈装置及其制造方法
公开(公告)号：US06480083B1
公开(公告)日：2002-11-12
申请号：US09648168
申请日：2000-08-25
申请人： Takaomi Toi , Koki Sasaki
发明人： Takaomi Toi , Koki Sasaki
IPC分类号： H01F2729
CPC分类号： H01F27/292 , H01F17/045 , Y10T29/4902 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155
摘要： A coil device includes terminal electrodes each including a bottom-surface electrode provided on a bottom surface of a flange, side-surface electrodes provided on side surfaces of the flange, and an end-surface electrode provided on an end surface of the flange at the lower part of the end surface. The end-surface electrode is arranged on the end surface of the flange so that the upper edge of the end-surface electrode is disposed at a first level that is substantially the same as that of the upper edges of the side-surface electrodes in the vicinity of boundaries between the end surface and each side surface of the flange and is disposed at a second level lower than the first level at an approximate central portion of the end surface of the flange.
摘要翻译：线圈装置包括端子电极，每个端子电极包括设置在凸缘的底表面上的底表面电极，设置在凸缘的侧表面上的侧表面电极以及设置在凸缘的端面上的端面电极端面的下部。端面电极布置在凸缘的端面上，使得端面电极的上边缘设置在与第一侧面电极的侧边电极的上边缘基本相同的第一水平处在凸缘的端表面和每个侧表面之间的边界附近，并且在法兰的端面的大致中央部处设置在比第一高度低的第二水平处。

7. 发明授权

US07051770B2 Coil-winding method and coil unit formed by the method 有权
标题翻译：通过该方法形成的线圈绕组方法和线圈单元
公开(公告)号：US07051770B2
公开(公告)日：2006-05-30
申请号：US10935114
申请日：2004-09-08
申请人： Koki Sasaki , Takaomi Toi
发明人： Koki Sasaki , Takaomi Toi
IPC分类号： B21F3/00 , B21C47/14 , B21C47/02 , H01F41/06
CPC分类号： H01F41/066 , H01F41/082
摘要： A coil-winding method for forming a coil unit includes the steps of winding first and second wires substantially parallel to each other simultaneously around a first layer position of a core to form a first turn, winding the first and second wires simultaneously to form a second turn while the second wire is disposed directly around the core, the first wire of the second turn adjacent to the first turn being disposed between the first and second wires of the first turn in the first layer so as to form a second layer, and winding the first and second wires simultaneously to form a third turn while the second wire is disposed directly around the core, the first wire of the third turn being disposed in the second layer and wound between the second wire of the first turn and the second wire of the second turn in the first layer.
摘要翻译：一种用于形成线圈单元的线圈绕组方法包括以下步骤：绕着芯的第一层位置同时缠绕基本上彼此平行的第一和第二电线，以形成第一匝，同时缠绕第一和第二电线以形成第二线在第二线直接设置在芯周围的情况下转动，与第一匝相邻的第二匝的第一线被设置在第一匝的第一匝的第一和第二线之间，以形成第二层，并且绕组所述第一和第二线同时形成第三匝，而所述第二线直接设置在所述芯周围，所述第三匝的所述第一线设置在所述第二层中并缠绕在所述第一匝的第二线和所述第二匝的第二线之间第二回合第一层。

8. 发明授权

US06804882B2 Method for manufacturing a coil device 有权
标题翻译：线圈装置的制造方法
公开(公告)号：US06804882B2
公开(公告)日：2004-10-19
申请号：US10197855
申请日：2002-07-19
申请人： Takaomi Toi , Koki Sasaki
发明人： Takaomi Toi , Koki Sasaki
IPC分类号： H05K330
CPC分类号： H01F27/292 , H01F17/045 , Y10T29/4902 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155
摘要： A coil device includes terminal electrodes each including a bottom-surface electrode provided on a bottom surface of a flange, side-surface electrodes provided on side surfaces of the flange, and an end-surface electrode provided on an end surface of the flange at the lower part of the end surface. The end-surface electrode is arranged on the end surface of the flange so that the upper edge of the end-surface electrode is disposed at a first level that is substantially the same as that of the upper edges of the side-surface electrodes in the vicinity of boundaries between the end surface and each side surface of the flange and is disposed at a second level lower than the first level at an approximate central portion of the end surface of the flange.
摘要翻译：线圈装置包括端子电极，每个端子电极包括设置在凸缘的底表面上的底表面电极，设置在凸缘的侧表面上的侧表面电极以及设置在凸缘的端面上的端面电极端面的下部。端面电极布置在凸缘的端面上，使得端面电极的上边缘设置在与第一侧面电极的侧边电极的上边缘基本相同的第一水平处在凸缘的端表面和每个侧表面之间的边界附近，并且在法兰的端面的大致中央部处设置在比第一高度低的第二水平处。

9. 发明授权

US07633366B2 Wire-wound coil 有权
标题翻译：绕线线圈
公开(公告)号：US07633366B2
公开(公告)日：2009-12-15
申请号：US12124314
申请日：2008-05-21
申请人： Shinya Hirai , Takaomi Toi
发明人： Shinya Hirai , Takaomi Toi
IPC分类号： H01F27/02
CPC分类号： H01F17/045 , H01F3/12 , H01F27/263
摘要： A wire-wound coil includes a ferrite core having a winding core portion and flange portions, a wire wound around the winding core portion, electrodes connected to the wire on lower surfaces of the flange portions, and a ferrite plate attached to upper surfaces of both of the end flange portions so as to extend over the winding core portion. The flange portions and the ferrite plate are provided with corresponding recessed and projecting portions and, and the flange portions and the ferrite plate are integrated through the recessed and projecting portions. Joint sections between the flange portions and the ferrite plate include contact sections that are in direct contact with each other, and adhesion sections arranged to receive an adhesive.
摘要翻译：线绕线圈包括具有绕组芯部分和凸缘部分的铁氧体磁芯，缠绕在绕组芯部分上的电线，连接到凸缘部分的下表面上的电线的电极和连接到两个的上表面的铁氧体板的端部凸缘部分，以便在绕组芯部分上延伸。凸缘部分和铁氧体板设置有相应的凹凸部分，并且凸缘部分和铁氧体板通过凹入和突出部分一体化。凸缘部和铁氧体板之间的接合部分包括彼此直接接触的接触部分和布置成接收粘合剂的粘合部分。

10. 发明申请

US20060033603A1 Wire-wound type chip coil and method of adjusting a characteristic thereof 有权
标题翻译：线绕型芯片线圈及其特性的调整方法
公开(公告)号：US20060033603A1
公开(公告)日：2006-02-16
申请号：US11232802
申请日：2005-09-21
申请人： Shinya Hirai , Takaomi Toi , Katsuhiko Tsubana , Hiroyuki Yasuzawa
发明人： Shinya Hirai , Takaomi Toi , Katsuhiko Tsubana , Hiroyuki Yasuzawa
IPC分类号： H01F5/00
CPC分类号： H01F27/292 , H01F17/045 , Y10T29/4902 , Y10T29/49071 , Y10T29/49073 , Y10T29/49076
摘要： A wire-wound type chip coil can take various inductance values while maintaining its outer dimension at a specific fixed value. A chip coil is formed by winding at least two conductive wires regularly in a single layer around a core made of a magnetic material and firmly connecting both ends of each conductive wire to terminal electrodes disposed on respective flanges of the core. This makes it possible to obtain a great current capacity. Furthermore, the inductance decreases because of an increase in the magnetic path length. A great number of different inductance values can be easily obtained by properly selecting parameters including the number of substantially parallel conductive wires, the diameter of each conductive wire, and the number of turns.
摘要翻译：线绕型芯片线圈可以采用各种电感值，同时保持其外部尺寸在特定的固定值。通过在由磁性材料制成的芯周围的单层中规则地缠绕至少两根导线并将每根导线的两端牢固地连接到设置在芯的相应凸缘上的端子电极而形成芯片线圈。这使得可以获得大的电流容量。此外，由于磁路长度的增加，电感减小。通过适当地选择包括基本平行的导线的数量，每个导线的直径和匝数的参数，可以容易地获得大量不同的电感值。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式