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1. 发明申请

US20090090001A1 METHOD FOR PRODUCING AN ELECTRIC COMPONENT-MOUNTED SUBSTRATE 有权
标题翻译：生产电气元件安装基板的方法
公开(公告)号：US20090090001A1
公开(公告)日：2009-04-09
申请号：US12239356
申请日：2008-09-26
申请人： Masaki Taniguchi , Kazutaka Furuta
发明人： Masaki Taniguchi , Kazutaka Furuta
IPC分类号： H05K13/04 , H05K7/10
CPC分类号： H05K1/141 , B30B5/02 , H01L24/75 , H01L25/16 , H01L25/162 , H01L2224/16 , H01L2224/75315 , H01L2224/75316 , H01L2224/7598 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/19105 , H05K1/181 , H05K1/183 , H05K3/3436 , H05K2201/10378 , H05K2201/2018 , H05K2203/1572 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/0401
摘要： A method of producing an electric component-mounted substrate having a cavity structure is provided. Because a supporting substrate and electric components and are connected together to a first face of a base substrate, the number of steps for the connection is reduced to shorten the producing time. When electric components are to be connected to a second face, the base substrate is supported by the supporting substrate, and the electric components and connected to the first face do not contact a processing table and therefore they undergo no damage. Thus, an electric component-mounted substrate having high reliability can be produced in a short time.
摘要翻译：提供一种制造具有空腔结构的电气部件安装基板的方法。由于支撑基板和电气部件并且连接在基底基板的第一面上，所以连接的台阶减少以缩短制造时间。当电气部件连接到第二面时，基底由支撑基板支撑，并且连接到第一面的电气部件不接触加工台，因此不会受到损坏。因此，可以在短时间内制造具有高可靠性的电气部件安装基板。

2. 发明申请

US20090261149A1 MOUNTING METHOD USING THERMOCOMPRESSION HEAD 有权
标题翻译：使用热电偶头的安装方法
公开(公告)号：US20090261149A1
公开(公告)日：2009-10-22
申请号：US12374240
申请日：2007-07-18
申请人： Kazutaka Furuta , Masaki Taniguchi
发明人： Kazutaka Furuta , Masaki Taniguchi
IPC分类号： B23K31/02
CPC分类号： H05K3/328 , B30B5/02 , B30B15/065 , H01L24/75 , H01L24/83 , H01L24/90 , H01L2224/16 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75304 , H01L2224/75315 , H01L2224/75316 , H01L2224/83101 , H01L2224/83192 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/305 , H05K2201/10674 , H05K2201/10977 , H05K2203/1189 , H01L2924/00
摘要： A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having an elastic pressure bonding member composed of an elastomer on a heatable metal head main body. In the method, after arranging an adhesive agent on a mounting region on the wiring board, an electric component is arranged on a mounting region, and the electric component is bonded on the wiring board by thermocompression by using the thermocompression head. At the time of performing thermocompression bonding, while pressing a top region of the electric component by a metal portion of the head main body, and adhesive in the vicinity of a side portion region of the electric component is pressed by a taper section of the elastic adhesive member.
摘要翻译：提供了一种使用热压头的安装方法，其可以在短时间内以高连接可靠性安装电气部件。该方法用于通过使用在可加热金属头主体上具有由弹性体构成的弹性压接构件的热压头将电气部件安装在布线板上。在该方法中，在布线基板的安装区域上配置粘合剂之后，在安装区域上配置电气部件，通过使用热压头通过热压接将电气部件接合在布线基板上。在进行热压接时，通过头主体的金属部分按压电气部件的顶部区域，并且电气部件的侧部区域附近的粘合剂被弹性部分的锥形部分挤压粘合剂。

3. 发明授权

US08402645B2 Method for producing an electric component-mounted substrate 有权
标题翻译：电气元件安装基板的制造方法
公开(公告)号：US08402645B2
公开(公告)日：2013-03-26
申请号：US12239356
申请日：2008-09-26
申请人： Masaki Taniguchi , Kazutaka Furuta
发明人： Masaki Taniguchi , Kazutaka Furuta
IPC分类号： H05K3/30
CPC分类号： H05K1/141 , B30B5/02 , H01L24/75 , H01L25/16 , H01L25/162 , H01L2224/16 , H01L2224/75315 , H01L2224/75316 , H01L2224/7598 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/19105 , H05K1/181 , H05K1/183 , H05K3/3436 , H05K2201/10378 , H05K2201/2018 , H05K2203/1572 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/0401
摘要： A method of producing an electric component-mounted substrate having a cavity structure is provided. Because a supporting substrate and electric components and are connected together to a first face of a base substrate, the number of steps for the connection is reduced to shorten the producing time. When electric components are to be connected to a second face, the base substrate is supported by the supporting substrate, and the electric components and connected to the first face do not contact a processing table and therefore they undergo no damage. Thus, an electric component-mounted substrate having high reliability can be produced in a short time.
摘要翻译：提供一种制造具有空腔结构的电气部件安装基板的方法。由于支撑基板和电气部件并且连接在基底基板的第一面上，所以连接的台阶减少以缩短制造时间。当电气部件连接到第二面时，基底由支撑基板支撑，并且连接到第一面的电气部件不接触加工台，因此不会受到损坏。因此，可以在短时间内制造具有高可靠性的电气部件安装基板。

4. 发明授权

US08114243B2 Mounting method using thermocompression head 有权
标题翻译：使用热压头的安装方法
公开(公告)号：US08114243B2
公开(公告)日：2012-02-14
申请号：US12374240
申请日：2007-07-18
申请人： Kazutaka Furuta , Masaki Taniguchi
发明人： Kazutaka Furuta , Masaki Taniguchi
IPC分类号： C09J5/00 , B32B37/00
CPC分类号： H05K3/328 , B30B5/02 , B30B15/065 , H01L24/75 , H01L24/83 , H01L24/90 , H01L2224/16 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75303 , H01L2224/75304 , H01L2224/75315 , H01L2224/75316 , H01L2224/83101 , H01L2224/83192 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/305 , H05K2201/10674 , H05K2201/10977 , H05K2203/1189 , H01L2924/00
摘要： A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having an elastic pressure bonding member composed of an elastomer on a heatable metal head main body. In the method, after arranging an adhesive agent on a mounting region on the wiring board, an electric component is arranged on a mounting region, and the electric component is bonded on the wiring board by thermocompression by using the thermocompression head. At the time of performing thermocompression bonding, while pressing a top region of the electric component by a metal portion of the head main body, and adhesive in the vicinity of a side portion region of the electric component is pressed by a taper section of the elastic adhesive member.
摘要翻译：提供了一种使用热压头的安装方法，其可以在短时间内以高连接可靠性安装电气部件。该方法用于通过使用在可加热金属头主体上具有由弹性体构成的弹性压接构件的热压头将电气部件安装在布线板上。在该方法中，在布线基板的安装区域上配置粘合剂之后，在安装区域上配置电气部件，通过使用热压头通过热压接将电气部件接合在布线基板上。在进行热压接时，通过头主体的金属部分按压电气部件的顶部区域，并且电气部件的侧部区域附近的粘合剂被弹性部分的锥形部分挤压粘合剂。

5. 发明申请

US20090126877A1 THERMOCOMPRESSION BONDING HEAD AND MOUNTING DEVICE USING THE SAME 审中-公开
标题翻译：热塑性接头和安装装置
公开(公告)号：US20090126877A1
公开(公告)日：2009-05-21
申请号：US12303019
申请日：2007-05-22
申请人： Kazutaka Furuta , Masaki Taniguchi
发明人： Kazutaka Furuta , Masaki Taniguchi
IPC分类号： B30B15/34
CPC分类号： B30B5/02 , B30B15/024 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75282 , H01L2224/75303 , H01L2224/75315 , H01L2224/81903 , H01L2224/83203 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00
摘要： The present invention provides a thermocompression bonding head capable of mounting an electric component on a wiring board in a short time with high connection reliability, and provides a mounting device using the same. A thermocompression bonding head 3 includes a heatable metal head body 5 having an elastic pressure-bonding member 7 made of elastomer and a metal pressing member 5b. The metal pressing member 5b, corresponding to an electric component 20 as a target to be bonded with pressure, is provided as a united body with the head body 5, and the elastic pressure-bonding member 7 is attached to the head body 5 such that a pressing surface 50 of the metal pressing member 5b is exposed in a recessed state on the periphery of the metal pressing member 5b. The head body 5 is made of a frame-shaped member having a concave portion 5a, and the metal pressing member 5b is integrally formed in the concave portion 5a of the head body 5. Further, the elastic pressure-bonding member 7 is housed and attached in the concave portion 5a.
摘要翻译：本发明提供一种能够在短时间内以高连接可靠性将电气部件安装在配线基板上的热压接头，提供使用该热压接头的安装装置。热压接头3包括具有由弹性体制成的弹性压接构件7和金属按压构件5b的可加热金属头本体5。作为与压头接合的对象的电气部件20对应的金属按压部件5b与头部体5一体地设置，弹性压接部件7安装在头部主体5上，使得金属按压部件5b的按压面50以凹状的状态露出在金属按压部件5b的周围。头本体5由具有凹部5a的框状构件构成，金属按压构件5b一体形成在头本体5的凹部5a中。此外，容纳弹性压接构件7，附接在凹部5a中。

6. 发明申请

US20090039291A1 Mounting method, electric part-mounted substrate and an electric device 审中-公开
标题翻译：安装方法，电气部件安装基板和电气设备
公开(公告)号：US20090039291A1
公开(公告)日：2009-02-12
申请号：US12230741
申请日：2008-09-04
申请人： Kazutaka Furuta , Shiyuki Kanisawa , Masaki Taniguchi
发明人： Kazutaka Furuta , Shiyuki Kanisawa , Masaki Taniguchi
IPC分类号： G02B27/64
CPC分类号： H05K3/323 , H01L24/29 , H01L24/31 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/7598 , H01L2224/83192 , H01L2224/83851 , H01L2224/83859 , H01L2224/83862 , H01L2224/83871 , H01L2224/83874 , H01L2224/83885 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/19043 , H05K3/305 , H05K2201/10674 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要： An electric device having high reliability is to be produced. An adhesive layer includes a thermosetting resin and a radiation-curable resin, and a portion of the adhesive layer is protruded outwardly from an edge of the electric part. Radiation rays do not pass through the electric part, and the radiation-curable resin is cured in the protruding portion, while the radiation-curable resin in that portion of the adhesive layer which is positioned right behind the electric part is not polymerized. Since the electric part is fixed with the polymerized radiation-curable type resin, the electric part is not misaligned when the electric part is pressed under heating.
摘要翻译：制造出具有高可靠性的电气装置。粘合剂层包括热固性树脂和可辐射固化树脂，并且粘合剂层的一部分从电气部件的边缘向外突出。辐射线不通过电气部分，并且辐射固化树脂在突出部分中固化，而位于电气部件正后方的粘合剂层部分中的辐射固化树脂不聚合。由于电子部件用聚合的可辐射固化型树脂固定，所以当加热时电部件被按压时，电气部件不会发生错位。

7. 发明申请

US20050189546A1 Semiconductor photodetector device 有权
标题翻译：半导体光电探测器
公开(公告)号：US20050189546A1
公开(公告)日：2005-09-01
申请号：US11059500
申请日：2005-02-17
申请人： Hisatada Yasukawa , Ryouichi Ito , Takaki Iwai , Masaki Taniguchi , Yasushi Jin
发明人： Hisatada Yasukawa , Ryouichi Ito , Takaki Iwai , Masaki Taniguchi , Yasushi Jin
IPC分类号： H01L27/144 , H01L27/15 , H01L31/0288 , H01L31/103
CPC分类号： H01L27/1443 , H01L31/0288 , H01L31/103 , Y02E10/50
摘要： A semiconductor photodetector device includes: a first semiconductor layer of a first conductivity type; and a second semiconductor layer of a second conductivity type formed on the first semiconductor layer and having a light-receiving region. The first semiconductor layer includes a first region containing an impurity of the first conductivity type at a high concentration and a second region formed on the first region and containing an impurity of the first conductivity type at a concentration lower than that of the first region. The second semiconductor layer includes a third region containing an impurity of the second conductivity type at a concentration higher than that of the second region and a fourth region formed on the third region and containing an impurity of the second conductivity type at a concentration higher than that of the third region.
摘要翻译：一种半导体光检测器件包括：第一导电类型的第一半导体层; 以及形成在第一半导体层上并具有光接收区域的第二导电类型的第二半导体层。第一半导体层包括含有高浓度的第一导电类型的杂质的第一区域和形成在第一区域上并且含有浓度低于第一区域的浓度的第一导电类型杂质的第二区域。第二半导体层包括含有浓度高于第二区域的第二导电类型的杂质的第三区域和形成在第三区域上的第四区域，并且含有浓度高于第二区域的浓度的第二导电类型的杂质。的第三个地区。

8. 发明授权

US5552595A Narrow band high sensitivity photodetector for inverse photoemission spectroscopy 失效
标题翻译：窄带高灵敏度光电探测器用于逆光电子能谱
公开(公告)号：US5552595A
公开(公告)日：1996-09-03
申请号：US404553
申请日：1995-03-15
申请人： Hirofumi Namatame , Masaki Taniguchi
发明人： Hirofumi Namatame , Masaki Taniguchi
IPC分类号： G01N23/227 , G01J1/02 , G01J1/04 , G01J1/42 , G01N21/62 , H01J43/10 , G01N21/00 , G02F1/01 , H01L31/10
CPC分类号： G01J1/429 , H01J43/10
摘要： A narrow band high sensitivity photo-detector for inverse photoemission spectroscopy, in which an electron beam from an electron gun is applied onto a sample and a light reflected therefrom is converged into a photo-electron detector, so as to effect photo-electron detection in a photo-electron multiplier, wherein said photo-electron detector comprises a CaF.sub.2 monocrystal window provided with a KCl thin film in the front of said photo-electron detector, a first dynode deposited with a KCl thin film on a surface thereof, wherein an output of the photo-electron multiplier is applied with a pulse counter circuit through an amplifier, so as to measure light absorption properties, window transmissibility and detection sensitivity as a band pass filter.
摘要翻译：一种用于逆光电子发射光谱的窄带高灵敏度光检测器，其中将来自电子枪的电子束施加到样品上，并将从其反射的光会聚在光电子检测器中，以便实现光电子检测光电子倍增器，其中所述光电子检测器包括在所述光电子检测器的前面设置有KCl薄膜的CaF 2单晶窗口，在其表面上沉积有KCl薄膜的第一倍增电极，其中输出通过放大器施加脉冲计数器电路，以便测量作为带通滤波器的光吸收特性，窗口传输率和检测灵敏度。

9. 发明授权

US5340976A Bandpass photon detector for inverse photoemission spectroscopy 失效
标题翻译：用于逆光子发射光谱的带通光子检测器
公开(公告)号：US5340976A
公开(公告)日：1994-08-23
申请号：US33327
申请日：1993-03-18
申请人： Masaki Taniguchi , Toshiaki Ohta
发明人： Masaki Taniguchi , Toshiaki Ohta
IPC分类号： G01N23/227 , G01J1/42 , G01N21/62 , G01T1/28 , H01J43/08 , G01N23/22
CPC分类号： G01T1/28 , G01J1/429
摘要： A bandpass photon detector for inverse photoemission spectroscopy comprises a sample chamber and an analyzer chamber connected to a vacuum exhaust system, respectively; a photon detector connected to the analyzer chamber; the sample chamber and the analyzer chamber are switchably connected through a gate valve and provided with a sample transfer system for transferring a sample held at a center axial line of the sample chamber to a center portion of the analyzer chamber, the analyzer chamber is provided with an electron gun opposed to a sample positioned at a center where the sample is transferred and a photomultiplier comprising a low cut filter consisting of Cu-BeO at the opposite side of the electron gun, wherein a potassium chloride is deposited in a thickness of 500-1000 .ANG. on a first diode of said photomultiplier, thereby high inverse photoemission spectroscopy can be measured so as to analysis and estimation of semiconductors and magnetic material.
摘要翻译：用于逆光电子发射光谱的带通光子检测器分别包括连接到真空排气系统的样品室和分析器室; 连接到分析器室的光子检测器; 样品室和分析器室通过闸阀可切换地连接并设置有用于将保持在样品室的中心轴线处的样品转移到分析器室的中心部分的样品转移系统，分析器室设置有与位于样品转移中心的样品相对的电子枪和包含由电子枪相反侧的Cu-BeO构成的低切滤光片的光电倍增管，其中以500nm的厚度沉积氯化钾，可以测量所述光电倍增管的第一个二极管上的1000个ANGSTROM，从而可以测量高反射光电子能谱，以便分析和估计半导体和磁性材料。

10. 发明申请

US20090032896A1 OPTICAL SEMICONDUCTOR DEVICE 失效
标题翻译：光学半导体器件
公开(公告)号：US20090032896A1
公开(公告)日：2009-02-05
申请号：US12173429
申请日：2008-07-15
申请人： Masaki Taniguchi , Hisatada Yasukawa , Takaki Iwai
发明人： Masaki Taniguchi , Hisatada Yasukawa , Takaki Iwai
IPC分类号： H01L31/11
CPC分类号： H01L31/1105 , G11B7/13
摘要： An optical semiconductor device includes a phototransistor for receiving incident light. The phototransistor includes a collector layer of a first conductivity type formed on a semiconductor substrate, a base layer of a second conductivity type formed on the collector layer, and an emitter layer of a first conductivity type formed on the base layer. A thickness of the emitter layer is equal to or less than an absorption length of the incident light in the semiconductor substrate.
摘要翻译：光学半导体器件包括用于接收入射光的光电晶体管。光电晶体管包括形成在半导体衬底上的第一导电类型的集电极层，形成在集电极层上的第二导电类型的基极层和形成在基极层上的第一导电类型的发射极层。发射极层的厚度等于或小于半导体衬底中的入射光的吸收长度。

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