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    • 3. 发明授权
    • Semiconductor wafer and method of manufacturing the same, and
semiconductor device and test board of the same
    • 半导体晶片及其制造方法,以及半导体器件及其测试板
    • US6127694A
    • 2000-10-03
    • US77926
    • 1993-06-18
    • Michio Nakajima
    • Michio Nakajima
    • G01R31/26G01R31/28H01L21/326H01L21/66H01L21/822H01L27/04H01L23/58H01L29/00
    • G01R31/2856G01R31/2884
    • Regarding a semiconductor device, a burn-in board can be standardized in each package. An IC (100) includes a VCC terminal (2), a GND terminal (3), input terminals (4a, 4b), and output terminals (5), and it also includes a burn-in board setting terminal (14). Input signals applied to the input terminals (4a, 4b) are transmitted to gates 16a and 16b of switching circuit (15) and processed in a function block (7). Regardless of the signals applied to the input terminals (4a, 4b), simply applying a test signal to the burn-in board setting terminal (14), a specified logic is applied to the function block (7). Only if a pin arrangement of the VCC terminal (2), the GND terminal (3), and the burn-in board setting terminal (14) is standardized and determined, burn-in can be performed indifferent of another pin arrangement of the input terminals (4a, 4b).
    • 关于半导体器件,可以在每个封装中标准化老化板。 IC(100)包括VCC端子(2),GND端子(3),输入端子(4a,4b)和输出端子(5),并且还包括老化板设置端子(14)。 施加到输入端子(4a,4b)的输入信号被传送到开关电路(15)的门16a和16b,并在功能块(7)中进行处理。 无论施加到输入端子(4a,4b)的信号如何,只需将测试信号施加到老化板设置端子(14),就将功能块(7)施加指定的逻辑。 只有当VCC端子(2),GND端子(3)和老化板设置端子(14)的引脚布置被标准化和确定时,可以对输入的另一引脚布置无任何老化 端子(4a,4b)。
    • 6. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US5353253A
    • 1994-10-04
    • US126636
    • 1993-09-27
    • Michio Nakajima
    • Michio Nakajima
    • G11C29/00G11C29/04G11C7/00G11C11/40
    • G11C29/76
    • A smaller, high-speed, semiconductor memory device having redundancy is disclosed which attains an improved mass productivity. Where a main memory (20) includes a defective memory cell, a defective address designating circuit (21) stores the address of the defective memory cell. Defective address detecting circuits (22a to 22r) detect whether an address signal received at an address signal input terminal (4) coincides with an address signal from the defective address designating circuit (21). If a signal indicative of the coincidence is given to a redundancy memory circuit (23) from the defective address detecting circuits (22a to 22r), data is written in or read from defective address remedy latch circuit groups (23a to 23r) of the redundancy memory circuit (23) which correspond to the defective address detecting circuits (22a to 22r). A data selector (24) selectively outputs data received from the defective address remedy latch circuit groups (23a to 23r) or data received from the main memory (20). Thus, the redundancy memory circuit (23), which requires less space, quickly replaces the defective memory cell of the main memory (20).
    • 公开了具有冗余的较小的高速半导体存储器件,其具有提高的批量生产率。 在主存储器(20)包括缺陷存储单元的情况下,缺陷地址指定电路(21)存储有缺陷存储单元的地址。 检测地址检测电路(22a〜22r)是否检测到在地址信号输入端子(4)接收到的地址信号是否与来自缺陷地址指定电路(21)的地址信号一致。 如果从缺陷地址检测电路(22a〜22r)向冗余存储电路(23)发出了表示一致的信号,则将数据写入冗余存储电路(23)至缺陷地址补救锁存电路组(23a〜23r) 存储电路(23),其对应于缺陷地址检测电路(22a〜22r)。 数据选择器(24)选择性地输出从缺陷地址补救锁存电路组(23a至23r)接收的数据或从主存储器(20)接收的数据。 因此,需要较少空间的冗余存储器电路(23)快速地替换主存储器(20)的有缺陷的存储单元。
    • 8. 发明授权
    • Integrated circuit with efficient testing arrangement
    • 具有高效测试布置的集成电路
    • US06345005B2
    • 2002-02-05
    • US09734925
    • 2000-12-13
    • Aki UrakamiMichio Nakajima
    • Aki UrakamiMichio Nakajima
    • G11C700
    • G11C29/38
    • A read and write control circuit receives (m×n))-bit data output m-bit parallel from a D flip flop, and a q-bit data selection signal such that the output data from the D flip flop is written to memory circuits in units of integral multiples of (x+1) bits in a total of 2q operations, in accordance with a binary value indicated by the data selection signal, where m, n, x and q indicates positive integers (x+1)>m and n>2q, where m, n, x and 1 indicate positive integers and (x+1)>m and n>2q. The data written to the memory circuits is read out in units of integral multiples of (x+1) bits in a total of 2q operations.
    • 读/写控制电路接收(mxn)) - 从D触发器并行输出m位的位数据和q位数据选择信号,使得来自D触发器的输出数据以单位写入存储器电路 根据由数据选择信号表示的二进制值,在总共2q个运算中的(x + 1)位的整数倍的整数倍,其中m,n,x和q表示正整数(x + 1)> m和n > 2q,其中m,n,x和1表示正整数,(x + 1)> m且n> 2q。 写入存储器电路的数据以总共2q个操作的(x + 1)位的整数倍为单位读出。
    • 9. 发明授权
    • Semiconductor device test board and method for evaluating semiconductor
devices
    • 半导体器件测试板和半导体器件评估方法
    • US6114866A
    • 2000-09-05
    • US18445
    • 1998-02-04
    • Masaaki MatsuoTsuyoshi SaitohTakekazu YamashitaMichio NakajimaAkira KitaguchiHideki Toki
    • Masaaki MatsuoTsuyoshi SaitohTakekazu YamashitaMichio NakajimaAkira KitaguchiHideki Toki
    • G01R31/26G01R31/28H01L21/66G01R35/00G01R31/02
    • G01R31/2863H01L2924/0002
    • A semiconductor device test board solves a problem with conventional test boards in that test results obtained through a burn-in procedure could be identified only before the test board is taken out of a burn-in oven. Hence, conventional test boards required additional steps for checking the test results after removing the test boards from the burn-in oven. This extra step prevents the efficiency of the test from being improved. One embodiment of the present test board has indicator arms, each rotatably mounted on a pivot on the test board, for indicating, in response to a signal on a signal line, the test result of the semiconductor device associated with it. Each of the indicator arms maintains its rest position when no failure has occurred in the semiconductor device associated with it during the test. Each indicator arm changes its position if a failure has occurred in the semiconductor device during the test, and retains one of the two positions until after the test board is taken out of the burn-in oven. Thus, the test result can be determined after taking out the test board from the burn-in oven.
    • 半导体器件测试板解决了常规测试板的问题,因为只有在将测试板从老化炉中取出之前,才能识别通过烧录程序获得的测试结果。 因此,常规测试板需要额外的步骤,以便在从老化炉中取出测试板后检查测试结果。 这个额外的步骤可以防止测试的效率得到改善。 本测试板的一个实施例具有指示臂,每个指示臂可旋转地安装在测试板上的枢轴上,用于响应于信号线上的信号,指示与其相关联的半导体器件的测试结果。 当在测试期间与其相关联的半导体器件中没有发生故障时,每个指示器臂保持其静止位置。 如果在测试期间在半导体器件中发生故障,则每个指示臂改变其位置,并且保持两个位置中的一个,直到将测试板从老化炉中取出。 因此,可以在从老化炉中取出测试板之后确定测试结果。
    • 10. 发明授权
    • Digital filter system
    • 数字滤波系统
    • US5856934A
    • 1999-01-05
    • US827407
    • 1997-03-27
    • Michio NakajimaWeimin Sun
    • Michio NakajimaWeimin Sun
    • H03H17/02G06F17/10
    • H03H17/0294
    • Constants {P.sub.b00i, Q.sub.b00j, . . . , P.sub.ak2i, Q.sub.ak2j, P.sub.ci, Q.sub.cj, P.sub.di, and Q.sub.dj } for calculating each of filter coefficients {a.sub.k1, a.sub.k2, b.sub.00, b.sub.k1, b.sub.k2, c and d} for a digital filter 15 by using non-linear polynomials for pass band position data x and pass band width data y are stored in a memory 13. The constants {P.sub.b00i, Q.sub.b00j, . . . , P.sub.ak2i, Q.sub.ak2j, P.sub.ci, Q.sub.cj, P.sub.di, and Q.sub.dj } are determined by using the least square method so that the sum of the square of the errors between the filter coefficients calculated by using non-liner polynomials and the filter coefficients of digital filter having known characteristics becomes the least or the minimum. A CPU 11 calculates the filter coefficients non-linearly by using the constants stored in the memory 13, and sets the results to the digital filter 15 when new pass band position data x or pass band width data y is input at knobs SC and SW.
    • 常数{Pb00i,Qb00j,。 。 。 ,Pak2i,Qak2j,Pci,Qcj,Pdi和Qdj},用于通过使用用于通带位置的非线性多项式来计算数字滤波器15的滤波器系数{ak1,ak2,b00,bk1,bk2,c和d} 数据x和通带宽度数据y存储在存储器13中。常数{Pb00i,Qb00j,..., 。 。 ,Pak2i,Qak2j,Pci,Qcj,Pdi和Qdj}通过使用最小二乘法确定,使得通过使用非线性多项式计算的滤波器系数与数字滤波器的滤波器系数之间的误差的平方和之和 已知特征变得最小或最小。 CPU 11通过使用存储在存储器13中的常数非线性地计算滤波器系数,并且当在通过旋钮SC和SW处输入新的通带位置数据x或通带宽度数据y时,将结果设置为数字滤波器15。