会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • (AZA)INDOLIZINE DERIVATIVE AND PHARMACEUTICAL USE THEREOF
    • (AZA)吲哚衍生物及其药物用途
    • US20130217878A1
    • 2013-08-22
    • US13824147
    • 2011-09-28
    • Masato IizukaKazuo Shimizu
    • Masato IizukaKazuo Shimizu
    • C07D487/04C07D471/04
    • C07D487/04C07D471/04
    • (Aza)indolizine derivatives represented by Formula (I) having xanthine oxidase inhibitory activities and useful as agents for the prevention or treatment of a disease associated with abnormality of serum uric acid level, prodrugs thereof, salts thereof or the like. In Formula (I), 0 to 2 of X1, X2, X3 and X4 are a nitrogen atom and the others are CR1; one of T1 and T2 represents cyano and the other represents a group represented by Formula (A), with the proviso that when T1 is cyano, at least one of X1 to X4 is a nitrogen atom; R1 independently represents a hydrogen atom, a halogen atom, a hydroxy group, C1-6 alkyl, C1-6 alkoxy or the like; ring U represents a benzene ring or the like; m represents integral number from 0 to 2; R2 independently represents a fluorine atom, a hydroxy group or the like.
    • 具有黄嘌呤氧化酶抑制活性的式(I)表示的(Aza)中氮茚衍生物,可用作预防或治疗与血清尿酸水平异常相关的疾病,其前药,其盐等的药剂。 在式(I)中,X 1,X 2,X 3和X 4的0〜2为氮原子,其余为CR 1; T1和T2之一表示氰基,另一个表示由式(A)表示的基团,条件是当T1为氰基时,X 1至X 4中的至少一个为氮原子; R1独立地表示氢原子,卤素原子,羟基,C1-6烷基,C1-6烷氧基等; 环U表示苯环等; m表示0〜2的整数; R2独立地表示氟原子,羟基等。
    • 5. 发明申请
    • METHOD FOR SEPARATION AND RECOVERY OF NOBLE METALS
    • 用于分离和回收贵金属的方法
    • US20100224029A1
    • 2010-09-09
    • US12160852
    • 2007-01-12
    • Kazuhiro NiisawaKazuo ShimizuTadashi Nozaki
    • Kazuhiro NiisawaKazuo ShimizuTadashi Nozaki
    • C22B11/00
    • C22B11/04B01D15/1871B01D15/265B01D15/426B01J20/24B01J2220/4825C22B3/10C22B3/24C22B11/042C22B11/048C22B11/06Y02P10/214Y02P10/234
    • A method for separation and recovery of noble metals which makes it possible to isolate noble metal components efficiently by easy operation, that is, a method which comprises passing a solution of metals in hydrochloric acid prepared by treating a metal material with hydrochloric acid through the first cellulose column, eluting through development the noble metal component adsorbed on the cellulose with a hydrochloric acid/2-propanone mixture to obtain a fraction containing light platinum-group metals and a fraction containing heavy platinum-group metals and gold, separating the former fraction with the above mixture into fractions containing palladium, ruthenium and rhodium respectively, passing the fraction containing heavy platinum-group metals and gold through the second cellulose column to made them adsorbed on the cellulose, eluting them from the cellulose with a hydrochloric acid/1-butanol mixture to obtain fractions containing gold, osmium, iridium and platinum respectively, and recovering the noble metals from the fractions containing them respectively as simple substances.
    • 贵金属的分离回收方法,能够容易地使贵金属成分有效地分离,也就是将金属溶液中的金属在盐酸中的溶液通过第1次 纤维素柱,通过用盐酸/ 2-丙酮混合物显影吸附在纤维素上的贵金属组分,得到含有轻铂族金属的部分和含有重铂族金属和金的部分,将前一部分与 将上述混合物分别含有含有钯,钌和铑的级分,使含有重铂族金属和金的级分通过第二纤维素柱,使其吸附在纤维素上,用盐酸/ 1-丁醇从纤维素中洗脱出来 混合物以分别得到含有金,锇,铱和铂的级分,a 并从分别含有它们的级分中回收贵金属作为简单物质。
    • 8. 发明授权
    • Polishing apparatus
    • 抛光设备
    • US07021991B2
    • 2006-04-04
    • US10670499
    • 2003-09-26
    • Kazuo ShimizuShinro OhtaAkihiro Tsukada
    • Kazuo ShimizuShinro OhtaAkihiro Tsukada
    • B24B49/00
    • B24B37/013B23H5/08B24B37/046B24B49/12G01B11/0625
    • A polishing apparatus has a polishing table having a polishing surface, a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the polishing table, and a film thickness measuring device embedded in the polishing table. The film thickness measuring device includes a light source for applying light having a predetermined wavelength to a surface of the workpiece, a spectroscope for separating light reflected from the surface of the workpiece, and a charge coupled device array for capturing light separated by the spectroscope. The polishing apparatus also has a controller operable to analyze information captured by the charge coupled device array over the entire surface of the workpiece to obtain a film thickness at a desired point on the surface of the workpiece.
    • 抛光装置具有:具有研磨面的研磨台,用于保持待研磨的工件的顶环,并将工件压靠在研磨台上的研磨面上,以及嵌入在研磨台中的膜厚测量装置。 膜厚测量装置包括:用于将一个具有预定波长的光施加到工件的表面的光源,用于分离从工件表面反射的光的分光器和用于捕获由分光镜分离的光的电荷耦合器件阵列。 抛光装置还具有控制器,其可操作以分析由电荷耦合器件阵列在工件的整个表面上捕获的信息,以在工件表面上的期望点处获得膜厚度。