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    • 3. 发明授权
    • Avalanche photo diode
    • 雪崩光电二极管
    • US4383266A
    • 1983-05-10
    • US187744
    • 1980-09-16
    • Kazuo SakaiYuichi MatsushimaShigeyuki AkibaTakaya Yamamoto
    • Kazuo SakaiYuichi MatsushimaShigeyuki AkibaTakaya Yamamoto
    • H01L31/107H01L29/90
    • H01L31/1075
    • An avalanche photo diode provided with a guard ring around a photo detecting region having a pn junction, in which semiconductor layers of the photo detecting region having a pn junction, different in conductivity type from a semiconductor of the guard ring, are composed of a second semiconductor layer formed in contact with a first semiconductor layer forming the pn junction of the photo detecting region and of the same conductivity type as the semiconductor of the guard ring, and a third semiconductor layer formed in contact with the second semiconductor layer and having a larger band gap than the second semiconductor layer, and in which the tip end of the guard ring is formed to extend down into the third semiconductor layer. An avalanche photo diode can be formed to be provided with a uniformly thick, first semiconductor layer forming a photo detecting region and a second semiconductor layer forming a first pn junction between it and the first semiconductor layer, in which third and fourth semiconductor layers of the same composition as each other, respectively having larger band gaps than those of the first and second semiconductor layers, are provided to form therebetween a second pn junction which extends from the first pn junction to surround the peripheral portion of the first semiconductor layer.
    • 一种雪崩光电二极管,其在具有pn结的光检测区域周围设置有保护环,其中具有pn结的光检测区域的半导体层与导电类型不同于保护环的半导体,由第二 形成为与形成光检测区域的pn结并且具有与保护环的半导体相同的导电类型的第一半导体层形成的半导体层,以及形成为与第二半导体层接触并具有较大的第三半导体层的第三半导体层 带隙比第二半导体层,并且其中保护环的尖端形成为向下延伸到第三半导体层。 可以形成雪崩光电二极管,以形成均匀厚的形成光检测区域的第一半导体层和在其与第一半导体层之间形成第一pn结的第二半导体层,其中第三半导体层 提供分别具有比第一和第二半导体层的带隙大的带隙的彼此相同的组成,以形成从第一pn结延伸到围绕第一半导体层的周边部分的第二pn结。
    • 6. 发明授权
    • Multi-layered semi-conductor photodetector
    • 多层半导体光电探测器
    • US4682196A
    • 1987-07-21
    • US806746
    • 1985-12-09
    • Kazuo SakaiYuichi MatsushimaShigeyuki AkibaKatsuyuki Utaka
    • Kazuo SakaiYuichi MatsushimaShigeyuki AkibaKatsuyuki Utaka
    • H01L29/205H01L31/0352H01L31/11H01L27/14H01L29/12
    • H01L29/205H01L31/035281H01L31/11Y02E10/50
    • A semiconductor device, which is formed by a sequential lamination of a first semiconductor layer having a carrier concentration more than 10.sup.17 cm.sup.-3, a second semiconductor layer having a carrier concentration less than 10.sup.16 cm.sup.-3, a third semiconductor layer having a carrier concentration more than 10.sup.17 cm.sup.-3 and a thickness less than 300 .ANG., a fourth semiconductor layer having a carrier concentration less than 10.sup.16 cm.sup.-3, and a fifth semiconductor layer having a carrier concentration more than 10.sup.17 cm.sup.-3 and, in which the first and fifth semiconductor layers are the same in conductivity type and the third semiconductor layer is different in conductivity type from the fifth semiconductor layer. In accordance with the present invention, the energy gap of the third semiconductor layer is larger than the energy gaps of the second and fourth semiconductor layers. An annular region of a semi-insulating material or of the same conductivity type as that of the third semiconductor layer may be formed around an active region to extend from the fifth semiconductor layer to the second semiconductor layer.
    • 一种半导体器件,其通过顺次层叠具有载流子浓度大于1017cm -3的第一半导体层,载流子浓度小于1016cm-3的第二半导体层,具有载流子浓度的第三半导体层 大于1017cm-3,厚度小于300,载流子浓度小于1016cm-3的第四半导体层和载流子浓度大于1017cm-3的第五半导体层,其中第一 并且第五半导体层的导电类型相同,并且第三半导体层的导电类型与第五半导体层不同。 根据本发明,第三半导体层的能隙大于第二和第四半导体层的能隙。 可以在有源区周围形成半绝缘材料或与第三半导体层相同的导电类型的环形区域,以从第五半导体层延伸到第二半导体层。
    • 7. 发明授权
    • Method for manufacturing diffraction grating
    • 衍射光栅的制造方法
    • US4660934A
    • 1987-04-28
    • US710984
    • 1985-03-12
    • Shigeyuki AkibaKatsuyuki UtakaKazuo SakaiYuichi Matsushima
    • Shigeyuki AkibaKatsuyuki UtakaKazuo SakaiYuichi Matsushima
    • G02B5/18G03F7/00G03F7/095
    • G03F7/095G02B5/1857G03F7/001Y10S359/90
    • A method for manufacturing diffraction grating, in which after forming, on a substrate, one of a negative type photoresist film (an N film) and a positive type photoresist film (a P film) to cover a first region A and the other of the negative type photoresist film and the positive type photoresist film, or the latter film on the former one to cover a second region B, the first region and the second region are subjected to two-beam interference exposure, thereby forming a diffraction grating in which corrugations in the first region and the second region are reverse in phase to each other, through utilization of characteristics of the negative type photoresist film and the positive type photoresist film. Another feature of the present invention resides in that after forming, on a substrate, a structure in which a negative type photoresist film (an N film) is formed to cover only a first region A and the negative type photoresist film is formed on a positive type photoresist film (a P film) to cover a second region B, the first region and the second region of the substrate are subjected to two-beam interference exposure, thereby forming a diffraction grating in which corrugations in the first region and the second region are reverse in phase to each other, through utilization of characteristics of the negative type photoresist film and the positive type photoresist film.
    • 制造衍射光栅的方法,其中在基板上形成负型光致抗蚀剂膜(N膜)和正型光致抗蚀剂膜(P膜)之一以覆盖第一区域A和另一个 负型光致抗蚀剂膜和正型光致抗蚀剂膜,或者在前者的后者膜覆盖第二区域B,第一区域和第二区域受到双光束干涉曝光,从而形成衍射光栅,其中波纹 通过利用负型光致抗蚀剂膜和正型光致抗蚀剂膜的特性,在第一区域和第二区域中的相位彼此相反。 本发明的另一个特征在于,在基板上形成后,形成负型光致抗蚀剂膜(N膜)仅覆盖第一区域A并且负型光致抗蚀剂膜形成为阳性的结构 (P膜)覆盖第二区域B,对基板的第一区域和第二区域进行双光束干涉曝光,从而形成衍射光栅,其中第一区域和第二区域中的波纹 通过利用负型光致抗蚀剂膜和正型光致抗蚀剂膜的特性,彼此相反。