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    • 4. 发明申请
    • METHOD FOR MANUFACTURING SOI SUBSTRATE AND METHOD FOR MANUFACTURING SINGLE CRYSTAL SEMICONDUCTOR LAYER
    • 制造SOI衬底的方法及制造单晶半导体层的方法
    • US20100081254A1
    • 2010-04-01
    • US12564973
    • 2009-09-23
    • Akihisa SHIMOMURAFumito ISAKASho KATOTakashi HIROSE
    • Akihisa SHIMOMURAFumito ISAKASho KATOTakashi HIROSE
    • H01L21/762H01L21/20
    • H01L21/76254H01L21/02532H01L21/0262Y02E10/547
    • An object is to provide a single crystal semiconductor layer with extremely favorable characteristics without performing CMP treatment or heat treatment at high temperature. Further, an object is to provide a semiconductor substrate (or an SOI substrate) having the above single crystal semiconductor layer. A first single crystal semiconductor layer is formed by a vapor-phase epitaxial growth method on a surface of a second single crystal semiconductor layer over a substrate; the first single crystal semiconductor layer and a base substrate are bonded to each other with an insulating layer interposed therebetween; and the first single crystal semiconductor layer and the second single crystal semiconductor layer are separated from each other at an interface therebetween so as to provide the first single crystal semiconductor layer over the base substrate with the insulating layer interposed therebetween. Thus, an SOI substrate can be manufactured.
    • 本发明的目的是提供具有非常有利特性的单晶半导体层,而不需要在高温下进行CMP处理或热处理。 此外,目的在于提供具有上述单晶半导体层的半导体衬底(或SOI衬底)。 在衬底上的第二单晶半导体层的表面上,通过气相外延生长法形成第一单晶半导体层; 第一单晶半导体层和基底基板之间具有绝缘层彼此接合; 并且第一单晶半导体层和第二单晶半导体层在它们之间的界面处彼此分离,以便在绝缘层之间提供第一单晶半导体层,其中绝缘层位于基底衬底上。 因此,可以制造SOI衬底。
    • 6. 发明申请
    • PHOTOELECTRIC CONVERSION DEVICE AND MANUFACTURING METHOD THEREOF
    • 光电转换装置及其制造方法
    • US20100154874A1
    • 2010-06-24
    • US12565213
    • 2009-09-23
    • Takashi HIROSERiho KATAISHIAkihisa SHIMOMURA
    • Takashi HIROSERiho KATAISHIAkihisa SHIMOMURA
    • H01L31/18H01L31/00
    • H01L31/022425H01L21/76254Y02E10/50
    • The oxidation of a lower electrode by the reaction between a metal element in the lower electrode and oxygen in a bonding layer is suppressed. The contamination of a semiconductor layer that is a photoelectric conversion layer by the diffusion of the metal element in the lower electrode into the semiconductor layer is suppressed. The invention relates to a photoelectric conversion device including a backside electrode layer, a crystalline semiconductor layer having a semiconductor junction, and a light-receiving-side electrode layer over a substrate having an insulating surface, in which the backside electrode layer has a stacked structure including a first conductive layer formed with a metal nitride or a refractory metal, a second conductive layer including aluminum (Al) or silver (Ag) as its main component, and a third conductive layer having low resistivity with a semiconductor material, and also relates to a manufacturing method thereof
    • 通过下部电极中的金属元素与接合层中的氧之间的反应来抑制下部电极的氧化。 通过下部电极中的金属元素扩散到半导体层中,作为光电转换层的半导体层的污染被抑制。 本发明涉及一种光电转换装置,其包括背面电极层,具有半导体结的结晶半导体层和具有绝缘表面的基板上的受光侧电极层,其中背面电极层具有层叠结构 包括由金属氮化物或难熔金属形成的第一导电层,包含铝(Al)或银(Ag)作为其主要成分的第二导电层和具有半导体材料的低电阻率的第三导电层,并且还涉及 涉及其制造方法