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1. 发明授权

US06372676B1 Ceramic substrate composition and ceramic circuit component 有权
标题翻译：陶瓷基板组成和陶瓷电路元件
公开(公告)号：US06372676B1
公开(公告)日：2002-04-16
申请号：US09317500
申请日：1999-05-24
申请人： Kazuo Kishida , Hirofumi Sunahara , Mitsuyoshi Nishide , Hiroshi Takagi
发明人： Kazuo Kishida , Hirofumi Sunahara , Mitsuyoshi Nishide , Hiroshi Takagi
IPC分类号： C03C1004
CPC分类号： C04B35/16 , C03C14/004 , H05K1/0306 , H05K3/4629
摘要： A ceramic substrate composition includes about 26 to 48% by weight of a CaO—Al2O3—B2O3—SiO2 type glass, about 35 to 68% by weight of at least one of alumina, mullite, cordierite and forsterite, and about 3 to 24% by weight of quartz, said glass being capable of being crystallized to wollastonite by firing of the composition at a temperature of about 800 to 1000° C. A ceramic circuit component contains a circuit formed on the ceramic substrate obtained by firing the composition.
摘要翻译：陶瓷基材组合物包含约26至48重量％的CaO-Al 2 O 3 -B 2 O 3 -SiO 2型玻璃，约35至68重量％的氧化铝，莫来石，堇青石和镁橄榄石中的至少一种，和约3至24重量％的石英，所述玻璃能够通过在约800〜1000℃的温度下焙烧组合物而结晶成硅灰石。陶瓷电路部件包含通过焙烧组合物而获得的陶瓷基板上形成的电路。

2. 发明授权

US06231986B1 Inorganic composition for low temperature firing 失效
标题翻译：无机组合物用于低温烧制
公开(公告)号：US06231986B1
公开(公告)日：2001-05-15
申请号：US08899281
申请日：1997-07-23
申请人： Yasutaka Sugimoto , Kazuo Kishida , Hirofumi Sunahara , Hiroshi Takagi
发明人： Yasutaka Sugimoto , Kazuo Kishida , Hirofumi Sunahara , Hiroshi Takagi
IPC分类号： B32B1706
CPC分类号： C03C14/004 , C03C8/14 , C03C2214/04 , C03C2214/20 , C03C2214/30 , H05K1/0306
摘要： An inorganic composition for low temperature firing comprising about 15 to 40 weight % of glass powder and about 60 to 85 weight % of cordierite, is disclosed. The glass powder is composed of about 20 to 60 weight % of SiO2, about 30 to 50 weight % of B2O3, about 5 to 30 weight % of MgO, 0 to about 15 weight % of Al2O3, and about 1 to 5 weight % of R2O (R is alkali metal). The inorganic composition is capable of being fired at a relative low temperature, and has a low thermal expansion coefficient and permittivity, as well as high mechanical strength.
摘要翻译：公开了一种用于低温烧制的无机组合物，其包含约15至40重量％的玻璃粉末和约60至85重量％的堇青石。该玻璃粉末由SiO 2 20-60重量％，B 2 O 3约30-50重量％，MgO约5-30重量％，Al 2 O 3重量％至约15重量％，Al 2 O 3重量％ R2O（R为碱金属）。无机组合物能够在相对低的温度下焙烧，并且具有低热膨胀系数和介电常数以及高的机械强度。

3. 发明授权

US06265090B1 Electrically conductive paste ceramic multi-layered substrate 有权
标题翻译：导电胶陶瓷多层基板
公开(公告)号：US06265090B1
公开(公告)日：2001-07-24
申请号：US09326496
申请日：1999-06-04
申请人： Mitsuyoshi Nishide , Kazuo Kishida
发明人： Mitsuyoshi Nishide , Kazuo Kishida
IPC分类号： B32B900
CPC分类号： H01L23/49883 , B22F1/02 , H01L2924/0002 , H01L2924/09701 , H01L2924/15192 , H05K1/092 , H05K3/4629 , Y10T428/2991 , H01L2924/00
摘要： Provided is an electrically conductive paste adapted to be sintered at the same time when a ceramic body is being sintered, wherein said paste has a contraction starting temperature that is higher than the contraction ending temperature of said ceramic body during the sintering treatment. Also provided is an electrically conductive paste comprising an electrically conductive component and an organic vehicle component, wherein said electrically conductive component comprises an electrically conductive powder mainly comprising silver, the particles of said electrically conductive powder being coated with a metal oxide having a melting point higher than that of silver.
摘要翻译：本发明提供一种适于在烧结陶瓷体的同时烧结的导电膏，其中所述糊料的收缩起始温度高于烧结处理期间所述陶瓷体的收缩结束温度。还提供了包含导电组分和有机载体组分的导电糊，其中所述导电组分包括主要包含银的导电粉末，所述导电粉末的颗粒被熔点高的金属氧化物涂覆比银。

4. 发明授权

US06448195B2 Composition for ceramic substrate and ceramic circuit component 有权
标题翻译：陶瓷基板和陶瓷电路元件的组成
公开(公告)号：US06448195B2
公开(公告)日：2002-09-10
申请号：US09930010
申请日：2001-08-15
申请人： Kazuo Kishida , Akira Shiratori , Osamu Yokokura , Hiroshi Takagi
发明人： Kazuo Kishida , Akira Shiratori , Osamu Yokokura , Hiroshi Takagi
IPC分类号： C03C100
CPC分类号： C04B35/111 , C03C8/14 , C03C14/004 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , Y10S428/901 , Y10T428/24917 , Y10T428/24926 , H01L2924/00
摘要： There is disclosed a composition for a ceramic substrate comprising a mixture of: powdered borosilicate-based glass comprising about 5% to 17.5% by weight of B2O3, about 28% to 44% by weight of SiO2, 0% to about 20% by weight of Al2O3, and about 36% to 50% by weight of MO (where MO is at least one selected from the group consisting of CaO, MgO, and BaO), and a powdered ceramic; in which the amount of the powdered borosilicate-based glass is about 40% to 49% by weight based on the total amount of the composition for a ceramic substrate, and the amount of the powdered ceramic is about 60% to 51% by weight based on the total amount of the composition for a ceramic substrate.
摘要翻译：公开了一种用于陶瓷基材的组合物，其包含以下混合物：粉末状硼硅酸盐玻璃，其包含约5％至17.5％重量的B 2 O 3，约28％至44％重量的SiO 2，0重量％至约20重量％的Al 2 O 3和约36〜50重量％的MO（其中MO是选自CaO，MgO和BaO中的至少一种）和陶瓷粉末; 其中基于陶瓷基材的组合物的总量，硼硅酸玻璃粉末的量为约40重量％至49重量％，并且粉末状陶瓷的量为约60重量％至51重量％关于陶瓷基材的组合物的总量。

5. 发明授权

US06376055B1 Composition for ceramic substrate and ceramic circuit component 有权
公开(公告)号：US06376055B1
公开(公告)日：2002-04-23
申请号：US09550826
申请日：2000-04-18
申请人： Kazuo Kishida , Akira Shiratori , Osamu Yokokura , Hiroshi Takagi
发明人： Kazuo Kishida , Akira Shiratori , Osamu Yokokura , Hiroshi Takagi
IPC分类号： B32B300
CPC分类号： C04B35/111 , C03C8/14 , C03C14/004 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , Y10S428/901 , Y10T428/24917 , Y10T428/24926 , H01L2924/00
摘要： There is disclosed a composition for a ceramic substrate comprising a mixture of: powdered borosilicate-based glass comprising about 5% to 17.5% by weight of B2O3, about 28% to 44% by weight of SiO2, 0% to about 20% by weight of Al2O3, and about 36% to 50% by weight of MO (where MO is at least one selected from the group consisting of CaO, MgO, and BaO), and a powdered ceramic; in which the amount of the powdered borosilicate-based glass is about 40% to 49% by weight based on the total amount of the composition for a ceramic substrate, and the amount of the powdered ceramic is about 60% to 51% by weight based on the total amount of the composition for a ceramic substrate.

6. 发明授权

US5055529A Processing aid for thermoplastic resin, and thermoplastic resin composition comprising same 失效
标题翻译：用于热塑性树脂的加工助剂和包含其的热塑性树脂组合物
公开(公告)号：US5055529A
公开(公告)日：1991-10-08
申请号：US329872
申请日：1989-03-28
申请人： Kazuo Kishida , Kiyokazu Kitai , Masahiro Kaneda , Kenji Okano
发明人： Kazuo Kishida , Kiyokazu Kitai , Masahiro Kaneda , Kenji Okano
IPC分类号： C08F2/24 , C08F2/44 , C08F220/00 , C08F220/14 , C08F220/18 , C08F265/06 , C08L27/06 , C08L33/10 , C08L51/00 , C08L101/00
CPC分类号： C08L27/06 , C08F265/06 , C08L101/00 , C08L51/003
摘要： A processing aid for a thermoplastic resin is disclosed, which is a two-stage polymer obtained by polymerizing (B) 5 to 50 parts by weight of a monomer or monomer mixture composed mainly of methyl methacrylate in the presence of (A) 50 to 95 parts by weight of a polymer comprising 100 to 50% by weight of units of a methacrylic acid ester other than methyl methacrylate and 0 to 50% by weight of units of other monomer copolymerizable with the methacrylic acid ester and having a reduced viscosity .eta.sp/C not larger than 2.0 dl/g, so that the total amount of the components (A) and (B) is 100 parts by weight and the reduced viscosity .eta.sp of the final polymer is not larger than 2.0 dl/g. A thermoplastic resin having the processing aid incorporated therein has an improved shaping processability, and a shaped article mode therefrom has good surface characteristics.

7. 发明授权

US5008313A Impact modifier for thermoplastic resin having good heat discoloration resistance and heat deterioration resistance, and thermoplastic resin composition comprising this impact modifier 失效
标题翻译：具有良好耐热变色性和耐热劣化性的热塑性树脂的抗冲改性剂和包含该抗冲改性剂的热塑性树脂组合物
公开(公告)号：US5008313A
公开(公告)日：1991-04-16
申请号：US329256
申请日：1989-03-27
申请人： Kazuo Kishida , Kiyokazu Kitai , Masaaki Mohri
发明人： Kazuo Kishida , Kiyokazu Kitai , Masaaki Mohri
IPC分类号： C08L51/04 , C08J3/22 , C08K5/00
CPC分类号： C08J3/226 , C08K5/005 , C08J2451/00
摘要： An impact modifier for a thermoplastic resin is disclosed, which comprises (I) 100 parts by weight of a graft copolymer formed by graft-polymerizing (B) a monomer having a vinyl group in the molecule onto (A) a butadiene polymer and, incorporated therein, (II) 0.01 to 5 parts by weight of a thioether type heat stabilizer, (III) 0.01 to 5 parts by weight of a phosphite type heat stabilizer and (IV) 0.01 to 5 parts by weight of a phenol type heat stabilizer having a molecular eight of at least 500. A thermoplastic resin composition having this impact modifier incorporated therein exhibits a good heat discoloration resistance and heat deterioration resistance under high-temperature conditions, as well as an improved impact resistance.

8. 发明授权

US4720516A Composite material with improved properties 失效
标题翻译：具有改善性能的复合材料
公开(公告)号：US4720516A
公开(公告)日：1988-01-19
申请号：US450378
申请日：1982-12-16
申请人： Kazuo Kishida , Isao Sasaki , Hiroshi Mori , Yasuaki Ii
发明人： Kazuo Kishida , Isao Sasaki , Hiroshi Mori , Yasuaki Ii
IPC分类号： C08L23/26 , C08G18/62 , C08K3/00 , C08K5/17 , C08K5/29 , C08K7/00 , C08K7/02 , C08L7/00 , C08L21/00 , C08L23/00 , C08L51/00 , C08L51/02 , C08L51/06 , C08L77/00 , C08L77/10 , C08L101/00 , C08K7/06 , C08K7/22
CPC分类号： C08G18/6204 , C08L51/06
摘要： A polyolefin resin composition comprising a polyolefin modified with an unsaturated carboxylic acid, at least one member selected from the group consisting of polyepoxides, polyisocyanates, and polyamines, and a reinforcement.
摘要翻译：一种聚烯烃树脂组合物，其包含用不饱和羧酸改性的聚烯烃，选自聚环氧化物，多异氰酸酯和多胺中的至少一种，以及增强剂。

9. 发明授权

US4665125A Thermoplastic resin composition of a polycarbonate and vinyl aromatic-vinyl cyanide comonomers/diene rubber graft copolymer 失效
标题翻译：聚碳酸酯和乙烯基芳族乙烯基氰化物共聚单体/二烯橡胶接枝共聚物的热塑性树脂组合物
公开(公告)号：US4665125A
公开(公告)日：1987-05-12
申请号：US798431
申请日：1985-11-15
申请人： Kazuo Kishida , Hiroshi Kawasaki , Hideyuki Shigemitsu
发明人： Kazuo Kishida , Hiroshi Kawasaki , Hideyuki Shigemitsu
IPC分类号： C08L25/12 , C08L51/00 , C08L69/00
CPC分类号： C08L51/00 , C08L25/12 , C08L69/00
摘要： A thermoplastic resin composition having excellent heat resistance, impact resistance, moldability and platability, which comprises:(i) from 10 to 90% by weight of a thermoplastic polycarbonate;(ii) from 10 to 90% by weight of a graft copolymer obtained by firstly polymerizing a monomer mixture comprising more than 30 and not more than 50% by weight of acrylonitrile and at least 50 and less than 70% by weight of styrene, as monomers for the first stage of graft polymerization, in the presence of a rubber-like polymer, and then polymerizing a monomer mixture comprising from 15 to 40% by weight of acrylonitrile and from 60 to 85% by weight of .alpha.-methylstyrene, as monomers for the second stage of graft polymerization, in the presence of the polymer obtained in the first stage; and(iii) from 0 to 60% by weight of a copolymer obtained by co-polymerizing from 50 to 80% by weight of an aromatic vinyl monomer and from 20 to 50% by weight of a vinyl cyanide monomer;the total amount of components (i), (ii) and (iii) being 100% by weight. The composition is useful for making molded products having excellent heat resistance, impact resistance and platability.
摘要翻译：具有优异的耐热性，耐冲击性，成型性和可镀性的热塑性树脂组合物，其包含：（i）10〜90重量％的热塑性聚碳酸酯; （ii）10至90重量％的接枝共聚物，其通过首先将包含大于30重量％至50重量％的丙烯腈和至少50重量％且小于70重量％的苯乙烯的单体混合物聚合而获得，其为在第一阶段接枝聚合的单体中，在橡胶状聚合物的存在下，然后将包含15-40％（重量）丙烯腈和60-85％（重量）α-甲基苯乙烯的单体混合物聚合成单体在第一阶段获得的聚合物存在下进行接枝聚合的第二阶段; 和（iii）0至60重量％的通过共聚合50-80重量％的芳族乙烯基单体和20至50重量％的乙烯基氰单体得到的共聚物; 组分（i），（ii）和（iii）的总量为100重量％。该组合物可用于制备具有优异的耐热性，耐冲击性和可镀性的成型产品。

10. 发明授权

US4663382A Non-rigid vinyl chloride polymer resin composition 失效
标题翻译：非刚性氯乙烯聚合物树脂组合物
公开(公告)号：US4663382A
公开(公告)日：1987-05-05
申请号：US795518
申请日：1985-11-06
申请人： Kazuo Kishida , Kazuo Ueda , Kiyokazu Kitai , Tsuruyoshi Matsumoto
发明人： Kazuo Kishida , Kazuo Ueda , Kiyokazu Kitai , Tsuruyoshi Matsumoto
IPC分类号： C08K5/00 , C08L1/00 , C08L7/00 , C08L21/00 , C08L23/00 , C08L27/00 , C08L27/06 , C08L33/00 , C08L33/02 , C08L51/00 , C08L51/02 , C08L51/06 , C08L67/00 , C08L101/00 , C08L13/00 , C08L51/04
CPC分类号： C08K5/0016 , C08L27/06 , C08L51/003
摘要： Disclosed is a non-rigid vinyl chloride polymer composition comprising 100 weight parts of a vinyl chloride polymer resin, 5-50 weight parts of a graft copolymer modifier and 10-300 weight parts of a plasticizer. The graft copolymer modifier is obtained by graft-polymerizing 25-150 weight parts of an alkyl ester of methacrylic acid having 1 to 4 carbon atoms in the alkyl group or a monomer mixture composed of at least more than 50% by weight of said alkyl ester of methacrylic acid onto 100 weight parts of an acrylic elastomer having a swelling degree of 5 to 25 so that the grafting ratio is not larger than 50%. The acrylic elastomer is obtained by polymerizing a mixture comprising an alkyl ester of acrylic acid having 2 to 10 carbon atoms in the alkyl group or a monomer mixture composed of at least 50% by weight of said alkyl ester of acrylic acid, and a polyfunctional crosslinking agent. The non-rigid vinyl chloride polymer composition has excellent weatherability and impact resistance, and exhibits a good molding processability.
摘要翻译：公开了一种非刚性氯乙烯聚合物组合物，其包含100重量份的氯乙烯聚合物树脂，5-50重量份的接枝共聚物改性剂和10-300重量份的增塑剂。接枝共聚物改性剂通过在烷基中接枝聚合25-150重量份的具有1至4个碳原子的甲基丙烯酸的烷基酯或由至少大于50重量％的所述烷基酯组成的单体混合物的甲基丙烯酸加入到100重量份的溶胀度为5〜25的丙烯酸类弹性体中，使得接枝率不大于50％。丙烯酸弹性体是通过在烷基中聚合含有2-10个碳原子的丙烯酸烷基酯的混合物或由至少50重量％的所述丙烯酸烷基酯组成的单体混合物和多官能交联代理商非刚性氯乙烯聚合物组合物具有优异的耐候性和耐冲击性，并且表现出良好的成型加工性。

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