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1. 发明授权

US5827413A Low hydrogen over voltage cathode and process for production thereof 失效
标题翻译：低氢过电压阴极及其生产方法
公开(公告)号：US5827413A
公开(公告)日：1998-10-27
申请号：US736083
申请日：1996-10-24
申请人： Kazuhisa Yamaguchi , Kanji Yoshimitsu , Satoshi Yoshida , Kazumasa Suetsugu , Takashi Sakaki
发明人： Kazuhisa Yamaguchi , Kanji Yoshimitsu , Satoshi Yoshida , Kazumasa Suetsugu , Takashi Sakaki
IPC分类号： C25B11/04 , C25B11/06
CPC分类号： C25B11/0478
摘要： A low hydrogen overvoltage cathode is provided which comprises an electroconductive base material coated with an alloy layer containing cobalt and tin at least at a content of tin ranging from 0.01 to 95% by weight. A process is also provided for producing the low hydrogen voltage cathode, wherein cobalt and tin at least are electrolytically co-deposited onto a surface of an electroconductive base material from a plating bath containing cobalt ions, tin ions, and a complexing agent.
摘要翻译：提供了一种低氢过电压阴极，其包括涂覆有含有钴和锡的合金层的导电基材，所述合金层至少含有0.01至95重量％的锡含量。还提供了一种用于生产低氢电压阴极的方法，其中钴和锡至少从含有钴离子，锡离子和络合剂的镀浴电解共沉积到导电基材的表面上。

2. 发明授权

US5944966A Low hydrogen overvoltage cathode and process for production thereof 失效
标题翻译：低氢过电压阴极及其生产方法
公开(公告)号：US5944966A
公开(公告)日：1999-08-31
申请号：US992457
申请日：1997-12-17
申请人： Kazumasa Suetsugu , Kazuhisa Yamaguchi , Kanji Yoshimitsu , Takashi Sakaki
发明人： Kazumasa Suetsugu , Kazuhisa Yamaguchi , Kanji Yoshimitsu , Takashi Sakaki
IPC分类号： C25B11/04 , C25B11/06 , C25B11/00
CPC分类号： C25B11/0442 , C25B11/0489
摘要： A novel cathode of low hydrogen overvoltage is provided which is useful for electrolysis of water and electrolysis of an aqueous alkali metal chloride such as sodium chloride. A process for producing the cathode is also provided. The low hydrogen overvoltage cathode comprises an electroconductive base material; and a coating layer containing at least one organic compound selected from the group consisting of amino acids, monocarboxylic acids, dicarboxylic acids, monoamines, diamines, triamines, and tetramines, and derivatives thereof at a content of from 0.5% to 18% by weight in terms of carbon, and a metal component selected from the group consisting of nickel, nickel-iron, nickel-cobalt, and nickel-indium at an indium content ranging from 1% to 90% by weight. The process for producing the low hydrogen overvoltage cathode comprises conducting electrodeposition to form a coating layer on a surface of an electroconductive base material in a plating bath containing at least nickel ions, nickel and iron ions, nickel and cobalt ions, or nickel and indium ions, and containing additionally at least one organic compound selected from the group consisting of amino acids, monocarboxylic acids, dicarboxylic acids, monoamines, diamines, triamines, and tetramines, and derivatives thereof.
摘要翻译：提供了一种低氢过电压的新型阴极，可用于电解水和电解碱金属氯化物如氯化钠水溶液。还提供了一种生产阴极的方法。低氢过电压阴极包括导电基材; 以及包含至少一种选自氨基酸，单羧酸，二羧酸，单胺，二胺，三胺和四胺的有机化合物及其衍生物的涂层，其含量为0.5重量％至18重量％碳含量和选自镍，镍 - 铁，镍 - 钴和镍 - 铟的金属成分，其铟含量为1重量％至90重量％。制造低氢过电压阴极的方法包括进行电沉积以在至少含有镍离子，镍和铁离子，镍和钴离子或镍和铟离子的电镀浴中的导电基材的表面上形成涂层，另外还含有选自氨基酸，一元羧酸，二羧酸，单胺，二胺，三胺和四胺中的至少一种有机化合物及其衍生物。

3. 发明授权

US5948223A Low hydrogen overvoltage cathode and process for the production thereof 失效
标题翻译：低氢过电压阴极及其生产方法
公开(公告)号：US5948223A
公开(公告)日：1999-09-07
申请号：US733420
申请日：1996-10-18
申请人： Hideharu Horikoshi , Kazumasa Suetsugu , Takashi Sakaki , Kanji Yoshimitsu
发明人： Hideharu Horikoshi , Kazumasa Suetsugu , Takashi Sakaki , Kanji Yoshimitsu
IPC分类号： C25B11/04 , C25B11/06 , C25B11/00
CPC分类号： C25B11/0478 , Y10S420/90
摘要： A cathode of sufficiently low hydrogen overvoltage is provided which is useful in electrolysis of water or of an aqueous alkali metal chloride solution such as a sodium chloride solution. A process for producing the cathode is also provided. The low hydrogen overvoltage cathode has an electroconductive base material coated with an alloy layer containing nickel and molybdenum, the alloy layer containing the nickel at a content ranging from 35 to 90% by weight and the molybdenum at a content ranging from 10 to 65% by weight. The alloy laser has an X-ray diffraction (CuK.alpha. line) pattern with a main peak at an angle ranging from 42 to 45.degree. with a peak half width ranging from 0.4 to 7.degree.. One process for producing the low hydrogen overvoltage cathode of the present invention involves plating an electroconductive base material by an arc discharge type ion plating method. Another process for producing the low hydrogen overvoltage cathode of the present invention involves co-electrodepositing nickel and molybdenum onto an electroconductive base material in a plating bath.
摘要翻译：提供足够低的氢过电压的阴极，其可用于电解水或碱金属氯化物水溶液如氯化钠溶液。还提供了一种生产阴极的方法。低氢过电压阴极具有涂覆有含有镍和钼的合金层的导电基材，合金层含有含量范围为35-90％重量的镍，含量范围为10-65％的钼由重量。合金激光器具有X射线衍射（CuKα线）图案，主峰的角度范围为42至45°，峰半宽度范围为0.4至7°。制造本发明的低氢过电压阴极的一个方法包括通过电弧放电型离子镀法镀覆导电基材。制造本发明的低氢过电压阴极的另一种方法包括将镍和钼共同电沉积在镀浴中的导电基材上。

4. 发明授权

US5606263A Probe method for measuring part to be measured by use thereof and electrical circuit member 失效
标题翻译：用于测量使用的部件和电路部件的探针方法
公开(公告)号：US5606263A
公开(公告)日：1997-02-25
申请号：US620393
申请日：1996-03-22
申请人： Tetsuo Yoshizawa , Masaaki Imaizumi , Hideyuki Nishida , Hiroshi Kondo , Takashi Sakaki , Yasuteru Ichida , Masaki Konishi
发明人： Tetsuo Yoshizawa , Masaaki Imaizumi , Hideyuki Nishida , Hiroshi Kondo , Takashi Sakaki , Yasuteru Ichida , Masaki Konishi
IPC分类号： G01R1/073
CPC分类号： G01R1/07307
摘要： An electrical circuit member comprises an electrical connecting member, said electrical connecting member having a holding member comprising an electrically insulating material and a plurality of electroconductive members embedded at predetermined intervals within said holding member, each of said plurality of electroconductive members being insulated with said electrically insulating material and also having the ends of said electroconductive member exposed on both surfaces of said holding member; and an electrical circuit part, said electrical circuit part having connecting portions to be connected to said electroconductive member or said wiring pattern exposed on both surfaces of said holding member, and being connected to at least one surface of said holding member.
摘要翻译：电路构件包括电连接构件，所述电连接构件具有保持构件，所述保持构件包括电绝缘材料和在所述保持构件内以预定间隔嵌入的多个导电构件，所述多个导电构件中的每一个与所述电气绝缘材料绝缘绝缘材料，并且还使所述导电构件的端部暴露在所述保持构件的两个表面上; 和电路部分，所述电路部分具有连接到所述导电部件或暴露在所述保持部件的两个表面上的所述布线图形的连接部分，并连接到所述保持部件的至少一个表面。

5. 发明授权

US5135606A Process for preparing electrical connecting member 失效
标题翻译：电连接件制备工艺
公开(公告)号：US5135606A
公开(公告)日：1992-08-04
申请号：US623521
申请日：1990-12-07
申请人： Tomoaki Kato , Tetsuo Yoshizawa , Toyohide Miyazaki , Hiroshi Kondo , Takashi Sakaki , Yoshimi Terayama , Yoichi Tamura , Takahiro Okabayashi , Kazuo Kondo , Yasuo Nakatsuka , Yuichi Ikegami
发明人： Tomoaki Kato , Tetsuo Yoshizawa , Toyohide Miyazaki , Hiroshi Kondo , Takashi Sakaki , Yoshimi Terayama , Yoichi Tamura , Takahiro Okabayashi , Kazuo Kondo , Yasuo Nakatsuka , Yuichi Ikegami
IPC分类号： B44C1/22 , H01L21/48
CPC分类号： H01L21/486 , H01R12/714 , H01L2224/11003 , H01L2224/1147 , H01L2924/01019 , H01L2924/01327 , H01L2924/10253 , Y10T29/49208
摘要： A process for preparing an electrical connecting member having a holding member with an electrically insulating material, and a plurality of electroconductive members. The electroconductive members are mutually insulated from each other and one end of each of the electroconductive members is exposed at one surface of the holding member and the other end is exposed at another surface of the holding member. A holding member is formed by forming a layer on a base member with the holding member having a photosensitive resin on the uppermost surface of the layer. The holding member is exposed and developed by forming a plurality of holes through the holding member, thereby exposing the uppermost surface of the layer. A part of the exposed layer is etched away and the holes on the holding member are filled with an electroconductive member. The remaining layer and base member are then removed.
摘要翻译：一种用于制备具有电绝缘材料的保持构件的电连接构件和多个导电构件的方法。导电构件彼此相互绝缘，并且每个导电构件的一端在保持构件的一个表面处露出，另一端暴露在保持构件的另一个表面。通过在基材的最上表面上形成具有感光性树脂的保持部件，在基材上形成层而形成保持部件。保持构件通过在保持构件上形成多个孔而露出和显影，从而露出该层的最上表面。蚀刻掉暴露层的一部分，并且保持构件上的孔填充有导电构件。然后除去剩余的层和基底。

6. 发明申请

US20130281726A1 METHOD FOR RECOVERING PRECIOUS METAL FROM SOLUTION CONTAINING PRECIOUS METAL IONS, EXTRACTING AGENT OR ADSORBENT USED THEREFOR, AND BACK-EXTRACTING AGENT OR DESORBENT 有权
标题翻译：用于从含有优质金属离子的溶液，萃取剂或其使用的吸附剂以及后处理剂或吸附剂中回收重金属的方法
公开(公告)号：US20130281726A1
公开(公告)日：2013-10-24
申请号：US13976591
申请日：2011-12-28
申请人： Yukinori Suso , Takashi Sakaki
发明人： Yukinori Suso , Takashi Sakaki
IPC分类号： C22B3/00 , C25C1/00
CPC分类号： C22B11/04 , B01J20/3204 , B01J20/3251 , B01J23/96 , B01J38/48 , C07C323/60 , C07D285/00 , C22B3/0005 , C22B3/24 , C25C1/00 , C25C1/20 , Y02P10/234 , Y02P20/584
摘要： To provide a method for recovering a precious metal from a solution containing precious metal ions, an extracting agent or adsorbent used therefor, and a back-extracting agent or desorbent.An extracting agent or adsorbent in which precious metal ions are extracted or adsorbed, is brought into contact with a back-extracting agent or desorbent containing a sulfur-containing amino acid derivative represented by the following formula (I): wherein R1 is a methyl group, an ethyl group, a vinyl group, a C3-8 linear, branched or cyclic hydrocarbon group, or a C6-14 aromatic hydrocarbon group, R2's are each independently a hydrogen atom, a methyl group, an ethyl group, a vinyl group, a C3-8 linear, branched or cyclic hydrocarbon group or a C6-14 aromatic hydrocarbon group, and n is 0 or 1, to obtain a solution containing the precious metal ions, which is subjected to a reduction treatment to obtain a precious metal.
摘要翻译：提供从含有贵金属离子的溶液中回收贵金属的方法，用于其的提取剂或吸附剂，以及反萃取剂或解吸剂。使提取或吸附贵金属离子的萃取剂或吸附剂与含有下式（I）表示的含硫氨基酸衍生物的反萃取剂或解吸剂接触：其中R1为甲基乙基，乙烯基，C 3-8直链，支链或环状烃基或C 6-14芳族烃基，R 2各自独立地为氢原子，甲基，乙基，乙烯基， C 3-8直链，支链或环状烃基或C 6-14芳族烃基，并且n为0或1，以获得含有贵金属离子的溶液，进行还原处理以获得贵金属。

7. 发明授权

US08173542B2 Method of forming conductive layer and semiconductor device 有权
标题翻译：形成导电层和半导体器件的方法
公开(公告)号：US08173542B2
公开(公告)日：2012-05-08
申请号：US12634619
申请日：2009-12-09
申请人： Takashi Sakaki
发明人： Takashi Sakaki
IPC分类号： H01L23/52
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/12044 , H01L2924/00012 , H01L2924/00
摘要： Provided are a method of forming a conductive layer on an inner portion of a through-electrode in which uniform adhesion property of plating in the inner portion of a through-hole is enhanced and a tact time is short, and a semiconductor device. The method of forming a conductive layer includes: a first plating step of forming a first plating layer on the inner portion of the through-hole; a plating suppression layer forming step of forming a plating suppression layer including a material different from a material of the first plating layer in an opening portion of the through-hole after the first plating step; and a second plating step of forming a second plating layer by plating on the inner portion of the through-hole after the plating suppression layer forming step.
摘要翻译：提供一种在贯通电极的内部形成导电层的方法，其中贯通电极的内部部分中的镀层的均匀粘合性能增强并且节拍时间短，并且半导体器件。形成导电层的方法包括：在通孔的内部形成第一镀层的第一镀层步骤; 电镀抑制层形成步骤，在第一电镀步骤之后，在所述通孔的开口部分中形成包括与所述第一镀层的材料不同的材料的镀覆抑制层; 以及第二电镀步骤，在镀覆抑制层形成步骤之后通过电镀在通孔的内部上形成第二镀层。

8. 发明授权

US5860818A Electrical connecting member 失效
标题翻译：电气连接件
公开(公告)号：US5860818A
公开(公告)日：1999-01-19
申请号：US221970
申请日：1994-04-04
申请人： Takashi Sakaki , Tetsuo Yoshizawa , Toyohide Miyazaki , Hiroshi Kondo , Yoshimi Terayama , Yuichi Ikegami , Takahiro Okabayashi , Kazuo Kondo , Yoichi Tamura , Yasuo Nakatsuka
发明人： Takashi Sakaki , Tetsuo Yoshizawa , Toyohide Miyazaki , Hiroshi Kondo , Yoshimi Terayama , Yuichi Ikegami , Takahiro Okabayashi , Kazuo Kondo , Yoichi Tamura , Yasuo Nakatsuka
IPC分类号： H01L21/48 , H01L23/498 , H01R12/51 , H01R9/09
CPC分类号： H01L21/486 , H01L23/49827 , H01L2924/0002 , H01L2924/09701
摘要： An electrical connecting member is provided with a holding member made of an electric insulating material and a plurality of conductive members held by the holding member in a state of being insulated with each other. One end of each of the conductive members is exposed on one surface of the holding member and the other end of each of the conductive members is exposed on the other surface of the holding member. The conductive members have portions exposed from the holding member, the length of which is longer than the thickness of the holding member. These exposed portions are easily deformed by the pressure force exerted at the time of connecting electric circuit components to reduce the coupling load even when there is irregularity in the heights thereof or unevenness in the junctions of the objects connection, hence enabling high density connections between the electric circuit components. The exposed portions can also be formed to have empty holes 1B, to be porous or, in the alternative, annealed to soften the exposed portions.
摘要翻译：电连接构件设置有由电绝缘材料制成的保持构件和由保持构件彼此绝缘的状态保持的多个导电构件。每个导电构件的一端暴露在保持构件的一个表面上，并且每个导电构件的另一端在保持构件的另一个表面上露出。导电构件具有从保持构件露出的部分，其长度比保持构件的厚度长。这些暴露部分在连接电路部件时施加的压力容易变形，即使当其高度不均匀或物体连接处的连接处的不均匀性也降低耦合负载时，因此能够实现高密度连接电路元件。暴露部分也可以形成为具有多孔的空孔1B，或者替代地，退火以软化暴露部分。

9. 发明授权

US06978534B2 Device for pressure bonding an integrated circuit to a printed circuit board 失效
标题翻译：用于将集成电路压接到印刷电路板的装置
公开(公告)号：US06978534B2
公开(公告)日：2005-12-27
申请号：US10345484
申请日：2003-01-17
申请人： Takashi Sakaki
发明人： Takashi Sakaki
IPC分类号： H05K3/34 , H01L21/00 , H01L21/60 , B23P19/00
CPC分类号： H01L21/67144 , H01L24/75 , H01L2924/14 , H01L2924/15787 , H01L2924/3511 , Y10T29/49144 , Y10T29/53178 , Y10T29/53183 , H01L2924/00
摘要： A pressure device for pressure bonding an IC chip on a circuit board includes an IC pressurizing member having a groove extending in a predetermined direction, and formed on a surface opposite to a surface abutting the IC chip. A columnar member is provided overlapped on the IC pressurizing member so as to bring an external surface thereof into contact within the groove of the IC pressurizing member. A pressure receiving member has a groove extending in a predetermined direction and overlapped on the IC pressurizing member so as to bring an external surface of the columnar member into contact within the groove thereof. An adjusting member adjusts parallelism between the IC pressurizing member and the pressure receiving member, and a fixing member fixes a relative position between the IC pressurizing member and the pressure receiving member.
摘要翻译：用于将IC芯片压接在电路板上的压力装置包括具有沿预定方向延伸的槽的IC加压构件，并形成在与所述IC芯片邻接的表面相对的表面上。在IC加压部件上重叠设置柱状部件，使其外表面与IC加压部件的槽内接触。受压部件具有沿预定方向延伸的凹槽，并且重叠在IC加压部件上，以使柱状部件的外表面在其槽内接触。调节构件调整IC加压构件和受压构件之间的平行度，并且固定构件固定IC加压构件和受压构件之间的相对位置。

10. 发明授权

US5216807A Method of producing electrical connection members 失效
标题翻译：电连接件的制造方法
公开(公告)号：US5216807A
公开(公告)日：1993-06-08
申请号：US832653
申请日：1992-02-11
申请人： Tetsuo Yoshizawa , Yoshimi Terayama , Hiroshi Kondo , Takashi Sakaki , Shunichi Haga , Yasuteru Ichida , Masaki Konishi
发明人： Tetsuo Yoshizawa , Yoshimi Terayama , Hiroshi Kondo , Takashi Sakaki , Shunichi Haga , Yasuteru Ichida , Masaki Konishi
IPC分类号： H01L21/48 , H01L23/498
CPC分类号： H01L23/49827 , H01L21/486 , H01L2224/16 , H01L2924/01004 , H01L2924/01014 , H01L2924/0102 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/3025 , Y10T29/49208
摘要： A method of producing an electrical connection member includes the steps of applying a carrier containing a light-sensitive resin onto a substrate member, forming holes in portions of the carrier to form a pattern and expose the substrate member in the holes, filling each hole in the carrier with an electrically conductive member, and removing the substrate member from the carrier. With this method, it is possible to easily produce electrical connection members in which high density electrical connecting portions can be provided and in which the reliability and security of electrical connections can be improved.
摘要翻译：制造电连接部件的方法包括以下步骤：将含有感光树脂的载体施加到基板部件上，在载体的一部分上形成孔以形成图案，并将基板部件暴露在孔中，所述载体具有导电构件，并且从所述载体移除所述基底构件。利用这种方法，可以容易地制造可以提供高密度电连接部分并且可以提高电连接的可靠性和安全性的电连接构件。

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