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    • 10. 发明申请
    • Non-volatile semiconductor memory device and method for producing same
    • 非易失性半导体存储器件及其制造方法
    • US20050230766A1
    • 2005-10-20
    • US11131865
    • 2005-05-18
    • Kazumasa NomotoHiroshi AozasaIchiro FujiwaraShinji Tanaka
    • Kazumasa NomotoHiroshi AozasaIchiro FujiwaraShinji Tanaka
    • H01L21/8247H01L21/28H01L21/318H01L21/762H01L27/115H01L27/12H01L29/788H01L29/792H01L21/336
    • H01L29/792H01L21/28282H01L21/7624
    • The memory device has a plurality of dielectric films including charge storage layers CS having a charge holding capability therein and stacked on an active region of a semiconductor SUB and electrodes G on the plurality of dielectric films. Each charge storage layer CS includes a first nitride film CS1 made of silicon nitride or silicon oxynitride and a second nitride film CS2 made of silicon nitride or silicon oxynitride and having a higher charge trap density than the first nitride film CS1. The first nitride film CS1 is formed by chemical vapor deposition using a first gas which contains a first silicon-containing gas containing chlorine with a predetermined percent composition and a nitrogen-containing gas as starting materials. The second nitride film CS2 is formed by chemical vapor deposition using a second gas which contains a second silicon-containing gas having a lower chlorine percent composition than the above predetermined percent composition and a nitrogen-containing gas as starting materials.
    • 存储器件具有多个电介质膜,其包括其中具有电荷保持能力的电荷存储层CS,并且堆叠在半导体SUB的有源区和多个介电膜上的电极G. 每个电荷存储层CS包括由氮化硅或氮氧化硅制成的第一氮化物膜CS 1和由氮化硅或氮氧化硅制成并且具有比第一氮化物膜CS 1更高的电荷陷阱密度的第二氮化物膜CS 2。 第一氮化物膜CS1通过化学气相沉积形成,该第一气体含有含有预定百分比组成的含氯的第一含硅气体和含氮气体作为原料。 第二氮化物膜CS2通过使用包含比上述预定百分比组成低的氯百分含量的第二含硅气体和含氮气体作为起始材料的第二气体进行化学气相沉积而形成。