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    • 10. 发明申请
    • Method for Fine Processing of Substrate, Method for Fabrication of Substrate, and Light Emitting Device
    • 基板精加工方法,基板加工方法及发光装置
    • US20090114944A1
    • 2009-05-07
    • US12294963
    • 2007-03-30
    • Yoshinobu OnoKenji KasaharaKazumasa Ueda
    • Yoshinobu OnoKenji KasaharaKazumasa Ueda
    • H01L33/00B44C1/22H01L21/306
    • H01L21/30608H01L21/308H01L33/20H01L33/22H01L33/24H01L2933/0083Y10S977/856
    • The present invention provides a method for fine processing of a substrate, a method for fabrication of a substrate, and a light emitting device. In the method for fine processing of a substrate, after removing a single particle layer from the substrate having the single particle layer, a hole having an inner diameter smaller than a diameter of a particle and centering on a position on the substrate where each particle constructing the single particle layer has been placed is formed by etching. The method for fabrication of a substrateincludesthefollowingsteps (I) to (V) inthisorder: (I) forming the single particle layer by arranging the particles on the substrate; (II) reducing the diameter of each of the particles by etching the obtained substrate; (III) forming a thin film composed of a mask material on the obtained substrate; (IV) removing the particle from the substrate and forming a mask having a hole with an inner diameter equivalent to the diameter of the particle at the position where the individual particle has existed; and (V) forming a hole with a diameter equivalent to the inner diameter of the hole of the mask on the substrate below the hole of the mask by etching the substrate using the mask. The light emitting device is made of a nitride semiconductor and is formed with a fine hole on an entire surface or a partial region of a light extraction surface and/or an opposing surface.
    • 本发明提供了一种基板的精细加工方法,基板的制造方法以及发光装置。 在基板精细加工方法中,在从具有单一颗粒层的基板除去单个颗粒层之后,具有内径小于颗粒直径的孔并且以基体上的每个颗粒构成的位置为中心 已经放置的单个颗粒层通过蚀刻形成。 本发明的制造方法包括以下步骤(I)至(V):(I)通过将颗粒布置在基材上形成单个颗粒层; (II)通过蚀刻所获得的基板来减小每个颗粒的直径; (III)在所得基板上形成由掩模材料构成的薄膜; (IV)从基板上除去粒子,形成具有与粒子的存在直径相当的粒径的孔的掩模, 以及(V)通过使用掩模蚀刻基板,在掩模的孔下面的基板上形成具有与掩模的孔的内径相当的直径的孔。 发光器件由氮化物半导体制成,并且在光提取表面和/或相对表面的整个表面或部分区域上形成有细孔。