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1. 发明授权

US06652725B2 Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus 失效
标题翻译：用于制造电沉积铜箔的电沉积装置和由该装置制造的电沉积铜箔
公开(公告)号：US06652725B2
公开(公告)日：2003-11-25
申请号：US09838322
申请日：2001-04-20
申请人： Kazuko Taniguchi , Makoto Dobashi , Hisao Sakai , Yasuji Hara
发明人： Kazuko Taniguchi , Makoto Dobashi , Hisao Sakai , Yasuji Hara
IPC分类号： C25C112
CPC分类号： C25D1/04 , C25D3/38 , C25D21/06 , C25D21/14 , C25D21/18 , Y10T428/12431
摘要： An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method. The present invention further provides an electrodeposition apparatus including a path for circulating a copper sulfate solution, whereby in said path is provided a filtration means for removal of thiourea-decomposed products remaining in copper electrolyte.
摘要翻译：本发明的目的是提供一种连续生产电沉积铜箔的方法，同时通过活性炭处理除去留在铜电解液中的硫脲分解产物。另一个目的是提供通过该方法获得的高电阻率铜箔。本发明还提供了一种电沉积装置，其包括用于使硫酸铜溶液循环的路径，由此在所述路径中设置有用于除去残留在铜电解质中的硫脲分解产物的过滤装置。

2. 发明授权

US5958209A High tensile strength electrodeposited copper foil and process of electrodepositing thereof 失效
标题翻译：高抗拉强度电沉积铜箔及其电沉积工艺
公开(公告)号：US5958209A
公开(公告)日：1999-09-28
申请号：US855316
申请日：1997-05-13
申请人： Hisao Sakai , Toshiko Yokota , Tsutomu Asai , Susumu Takahashi , Mitsuo Suzuki , Makoto Dobashi , Yasuji Hara
发明人： Hisao Sakai , Toshiko Yokota , Tsutomu Asai , Susumu Takahashi , Mitsuo Suzuki , Makoto Dobashi , Yasuji Hara
IPC分类号： C25D1/04 , C25D3/38 , H05K1/09 , C25C1/12 , C25D3/58
CPC分类号： H05K1/09 , C25D1/04 , C25D3/38 , H05K2201/0355 , Y10T428/24917
摘要： A high tensile strength copper foil having a matte side roughness Rz of 2.5 .mu.m or less and a tensile strength of 40,000 Kgf/mm.sup.2 after heating one hour at 180.degree. C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominantly (111) orientation.
摘要翻译：在180℃下加热1小时后，具有2.5μm以下的无光泽粗糙度Rz和拉伸强度40,000Kgf / mm2的高拉伸强度铜箔是通过将铜从含有预定少量的聚醚二醇和锡和铁离子。氯离子含量保持在0.1重量％以下。 ppm。铜箔的特征在于具有主要为（111）取向的原子单元的铜晶体。

3. 发明授权

US06194056B1 High tensile strength electrodeposited copper foil 失效
标题翻译：高抗拉强度的电沉积铜箔
公开(公告)号：US06194056B1
公开(公告)日：2001-02-27
申请号：US09349601
申请日：1999-07-09
申请人： Hisao Sakai , Toshiko Yokota , Tsutomu Asai , Susumu Takahashi , Mitsuo Suzuki , Makoto Dobashi , Yasuji Hara
发明人： Hisao Sakai , Toshiko Yokota , Tsutomu Asai , Susumu Takahashi , Mitsuo Suzuki , Makoto Dobashi , Yasuji Hara
IPC分类号： B32B300
CPC分类号： H05K1/09 , C25D1/04 , C25D3/38 , H05K2201/0355 , Y10T428/24917
摘要： A high tensile strength copper foil having a matte side roughness Rz of 2.5 &mgr;m or less and a tensile strength of 40,000 Kgf/mm2 after heating one hour at 180° C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominently (111) orientation.
摘要翻译：在180℃下加热1小时后，具有2.5μm以下的无光泽粗糙度Rz为2.5μm以下且拉伸强度为40,000Kgf / mm2的高拉伸强度的铜箔是通过将铜从含有预定的少量的聚醚二醇和锡和铁离子。氯离子含量保持在0.1重量％以下。 ppm。铜箔的特征在于具有主要（111）取向的原子单元的铜晶体。

4. 发明授权

US06444112B1 Manufacturing method of electrodeposited copper foil 有权
标题翻译：电沉积铜箔的制造方法
公开(公告)号：US06444112B1
公开(公告)日：2002-09-03
申请号：US09590528
申请日：2000-06-08
申请人： Nobuyuki Imada , Yutaka Hirasawa , Yasuji Hara , Naoya Matsushita
发明人： Nobuyuki Imada , Yutaka Hirasawa , Yasuji Hara , Naoya Matsushita
IPC分类号： C25D304
CPC分类号： C25D1/04 , C25D3/38 , C25D21/12 , H05K1/09
摘要： A process for producing an electrodeposited copper foil, comprising electrodepositing a copper foil from an electrolyte containing copper sulfate dissolved therein, in which said electrolyte contains a small amount of lead (Pb) ions, which comprises adding a salt of a metal of Group IIA of the periodic table to the electrolyte in an amount of 10 to 150 mols per mol of lead (Pb) ions contained in the electrolyte so that the lead (Pb) ions contained in the electrolyte react with the metal of Group IIA of the periodic table to thereby form an insoluble composite substance to precipitate, the insoluble composite substance followed by removing it from the electrolyte and forming an electrodeposited copper foil in the electrolyte having the lead (Pb) ions removed therefrom.
摘要翻译：一种电沉积铜箔的制造方法，其特征在于，将含有硫酸铜的电解质溶解于其中的电解铜箔，其中所述电解质含有少量铅（Pb）离子，其中包括将IIA族金属的盐以电解液中含有的每摩尔铅（Pb）离子计10至150摩尔量的电解质的周期表，使得包含在电解质中的铅（Pb）离子与周期表IIA族的金属反应，从而形成不溶性复合物质，使不溶性复合物质从电解质中除去，并在其中除去铅（Pb）离子的电解质中形成电解铜箔。

5. 发明授权

US06984456B2 Flexible printed wiring board for chip-on flexibles 失效
标题翻译：柔性印刷线路板，用于芯片柔性
公开(公告)号：US06984456B2
公开(公告)日：2006-01-10
申请号：US10483678
申请日：2003-05-12
申请人： Kazuyuki Okada , Yasuji Hara , Akira Uchiyama , Masaru Takahashi
发明人： Kazuyuki Okada , Yasuji Hara , Akira Uchiyama , Masaru Takahashi
IPC分类号： B21D39/00
CPC分类号： C23C28/321 , C23C26/00 , C23C28/00 , C23C28/3455 , C23C30/00 , C25D1/04 , C25D3/562 , C25D5/48 , H05K1/0393 , H05K3/384 , H05K3/389 , H05K2201/0355 , H05K2203/0723 , Y10T428/12472 , Y10T428/12514 , Y10T428/12535 , Y10T428/12569 , Y10T428/12792 , Y10T428/12903 , Y10T428/12993 , Y10T428/2804 , Y10T428/2843
摘要： There is provided a flexible printed wiring board including an insulating layer having a high optical transmittance, a high adhesion strength and a high migration resistance, and suitable for a chip on film (hereafter referred to as COF). In a flexible printed wiring board for COF, having an insulating layer on which a conductive layer of an electrodeposited copper foil is laminated, and an optical transmittance of 50% or more of the insulating layer in the etched region when a circuit is formed by etching said conductive layer, electrodeposited copper foil was made to have a rust-proofing layer of a nickel-zinc alloy on the adhering surface to be adhered to the insulating layer; the surface roughness (Rz) of the adhering surface was made to be 0.05 to 1.5 μm, and the specular gloss was made to be 250 or more when the incident angle is 60°.
摘要翻译：提供了一种柔性印刷布线板，其包括具有高透光率，高粘合强度和高耐迁移性的绝缘层，并且适用于膜上芯片（以下称为COF）。在用于COF的柔性印刷线路板中，具有绝缘层，其上层叠有电沉积铜箔的导电层，并且当通过蚀刻形成电路时在蚀刻区域中的绝缘层的50％以上的光透射率所述导电层，电沉积铜箔在粘合表面上具有镍 - 锌合金防锈层以粘附到绝缘层; 粘合面的表面粗糙度（Rz）为0.05〜1.5μm，入射角为60°时，镜面光泽度为250以上。

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