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    • 4. 发明授权
    • Semiconductor electric power conversion device
    • 半导体电力转换装置
    • US06490187B2
    • 2002-12-03
    • US09946596
    • 2001-09-06
    • Kazuhisa MoriAsako KoyanagiSatoshi FukudaToshisuke MineTakao KishikawaTomoharu Sakoda
    • Kazuhisa MoriAsako KoyanagiSatoshi FukudaToshisuke MineTakao KishikawaTomoharu Sakoda
    • H02M100
    • H02M7/003H02M5/4585
    • A semiconductor electric power conversion device includes a converter unit and an inverter unit, each having a group of parallel capacitors and multiple switching elements. Subdivided positive conductive connections associated with the converter unit and divided positive conductive connections associated with the inverter unit are formed at a positive side conductor connected to capacitors; while divided negative conductive connections associated with the converter unit and divided negative-polarity conductive connections associated with the inverter unit are formed at a negative polarity side conductor, connected to capacitors. The positive and negative polarity conductors have a multilayer structure with a dielectric plate interposed therebetween. Converter positive and negative polarity conductors are formed into a multilayer structure with the dielectric plate sandwiched between them, and inverter positive and negative polarity conductors are formed into a multilayer structure with the dielectric plate sandwiched therebetween.
    • 半导体电力转换装置包括转换器单元和逆变器单元,每个具有一组并联电容器和多个开关元件。 与转换器单元相关联的分开的正导电连接和与逆变器单元相关联的分开的正导通连接形成在连接到电容器的正侧导体上; 而与转换器单元相关联的分开的负导电连接和与逆变器单元相关联的分开的负极性导电连接形成在连接到电容器的负极侧导体。 正极和负极导体具有介于其间的电介质板的多层结构。 转换器正极性和负极性导体形成为夹在它们之间的电介质层的多层结构,并且逆变器正极性和负极性导体形成为夹在介质板之间的多层结构。
    • 5. 发明申请
    • Overheat detecting circuit
    • 过热检测电路
    • US20060256494A1
    • 2006-11-16
    • US11413007
    • 2006-04-28
    • Kazuhisa Mori
    • Kazuhisa Mori
    • H02H5/04
    • H01L27/0248
    • An overheat detecting circuit according to an embodiment of the invention includes: a current source for generating a constant current; an overheat detecting element unit that operates with a first current generated in accordance with the constant current and generates a first voltage based on a semiconductor substrate temperature; and a detecting circuit unit that operates a second current generated in accordance with the constant current, and generates a second voltage corresponding to a predetermined semiconductor substrate temperature to detect overheating based on a voltage difference between the first voltage and a reference voltage and a voltage difference between the second voltage and the reference voltage.
    • 根据本发明实施例的过热检测电路包括:用于产生恒定电流的电流源; 过热检测元件单元,其以根据所述恒定电流生成的第一电流进行工作,并且基于半导体衬底温度产生第一电压; 以及检测电路单元,其操作根据恒定电流产生的第二电流,并且产生对应于预定半导体衬底温度的第二电压,以基于第一电压和参考电压之间的电压差和电压差来检测过热 在第二电压和参考电压之间。
    • 8. 发明授权
    • Overheat detecting circuit
    • 过热检测电路
    • US07417487B2
    • 2008-08-26
    • US11413007
    • 2006-04-28
    • Kazuhisa Mori
    • Kazuhisa Mori
    • G01K7/00
    • H01L27/0248
    • An overheat detecting circuit according to an embodiment of the invention includes: a current source for generating a constant current; an overheat detecting element unit that operates with a first current generated in accordance with the constant current and generates a first voltage based on a semiconductor substrate temperature; and a detecting circuit unit that operates a second current generated in accordance with the constant current, and generates a second voltage corresponding to a predetermined semiconductor substrate temperature to detect overheating based on a voltage difference between the first voltage and a reference voltage and a voltage difference between the second voltage and the reference voltage.
    • 根据本发明实施例的过热检测电路包括:用于产生恒定电流的电流源; 过热检测元件单元,其以根据所述恒定电流生成的第一电流进行工作,并且基于半导体衬底温度产生第一电压; 以及检测电路单元,其操作根据恒定电流产生的第二电流,并且产生对应于预定半导体衬底温度的第二电压,以基于第一电压和参考电压之间的电压差和电压差来检测过热 在第二电压和参考电压之间。
    • 10. 发明授权
    • Semiconductor support substrate potential fixing structure for SOI semiconductor device
    • 半导体支撑用于SOI半导体器件的衬底电位固定结构
    • US06429486B1
    • 2002-08-06
    • US09444374
    • 1999-11-22
    • Katsumi AbeKazuhisa Mori
    • Katsumi AbeKazuhisa Mori
    • H01L2701
    • H01L27/1203H01L21/76283H01L21/76286
    • A semiconductor device of a SOI (silicon on insulator) structure includes a P-type silicon support substrate, a first insulating layer formed on the semiconductor support substrate, and an SOI layer formed on the first insulating layer. A first hole is formed to penetrate through the semiconductor layer and the first insulating layer, and a P-type polysilicon layer is filled in the first hole so that the P-type polysilicon layer is electrically connected to the semiconductor support substrate. A second insulating layer is formed on the SOI layer. A second hole is formed to penetrate through the second insulating layer in alignment with the first hole, and an aluminum electrode is formed on the second insulating layer to fill the second hole, so that the aluminum electrode is electrically connected through the P-type polysilicon layer to the silicon support substrate. Thus, the potential of the silicon support substrate can be fixed through the aluminum electrode formed on the SOI layer side.
    • SOI(绝缘体上硅)结构的半导体器件包括P型硅支撑衬底,形成在半导体支撑衬底上的第一绝缘层和形成在第一绝缘层上的SOI层。 第一孔形成为穿透半导体层和第一绝缘层,并且P型多晶硅层填充在第一孔中,使得P型多晶硅层电连接到半导体支撑衬底。 在SOI层上形成第二绝缘层。 形成第二孔,以与第一孔对准地穿过第二绝缘层,并且在第二绝缘层上形成铝电极以填充第二孔,使得铝电极通过P型多晶硅电连接 层到硅支撑衬底。 因此,可以通过形成在SOI层侧的铝电极来固定硅支撑基板的电位。