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1. 发明授权

US07776452B2 Heat sink member and method of manufacturing the same 失效
标题翻译：散热片及其制造方法
公开(公告)号：US07776452B2
公开(公告)日：2010-08-17
申请号：US10566721
申请日：2005-07-27
申请人： Kazuhiro Shiomi , Masaaki Ishio , Tsuyoshi Hasegawa
发明人： Kazuhiro Shiomi , Masaaki Ishio , Tsuyoshi Hasegawa
IPC分类号： H01L23/373 , B32B15/20
CPC分类号： H01L23/3735 , H01L2224/32 , H01L2224/83101 , Y10T428/12826 , Y10T428/12903
摘要： A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn—Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.
摘要翻译：获得能够抑制制造中的裂纹和裂纹的发展，抑制热膨胀系数的扩大和抑制导热性的降低的散热构件。该散热构件包括主要由Cu构成的层构件（1），主要由Mo构成的基板（2）和由Sn-Cu合金（Sn：1质量％〜13质量％）构成的钎焊层（4）布置在所述帘布层构件和所述基底之间，用于将所述帘布层构件和所述衬底彼此粘合。

2. 发明申请

US20060244125A1 Heat sink member and method of manufacturing the same 失效
标题翻译：散热片及其制造方法
公开(公告)号：US20060244125A1
公开(公告)日：2006-11-02
申请号：US10566721
申请日：2005-07-27
申请人： Kazuhiro Shiomi , Masaaki Ishio , Tsuyoshi Hasegawa
发明人： Kazuhiro Shiomi , Masaaki Ishio , Tsuyoshi Hasegawa
IPC分类号： H01L23/34
CPC分类号： H01L23/3735 , H01L2224/32 , H01L2224/83101 , Y10T428/12826 , Y10T428/12903
摘要： A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn—Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.
摘要翻译：获得能够抑制制造中的裂纹和裂纹的发展，抑制热膨胀系数的扩大和抑制导热性的降低的散热构件。该散热构件包括主要由Cu构成的层构件（1），主要由Mo构成的基板（2）和由Sn-Cu合金（Sn：1质量％〜13质量％）构成的钎焊层（4）布置在所述帘布层构件和所述基底之间，用于将所述帘布层构件和所述衬底彼此粘合。

3. 发明申请

US20090045506A1 Cu-Mo SUBSTRATE AND METHOD FOR PRODUCING SAME 失效
标题翻译： Cu-Mo基板及其制造方法
公开(公告)号：US20090045506A1
公开(公告)日：2009-02-19
申请号：US11915201
申请日：2006-05-23
申请人： Masayuki Yokota , Kazuhiro Shiomi , Fumiaki Kikui , Masaaki Ishio
发明人： Masayuki Yokota , Kazuhiro Shiomi , Fumiaki Kikui , Masaaki Ishio
IPC分类号： H01L23/36 , B32B15/20 , B32B37/00
CPC分类号： H01L23/3735 , H01L23/142 , H01L23/3736 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/01019 , H01L2924/01079 , H01L2924/1305 , H01L2924/13055 , Y10T156/10 , Y10T428/12778 , H01L2924/00014 , H01L2924/00
摘要： A Cu—Mo substrate 10 according to the present invention includes: a Cu base 1 containing Cu as a main component; an Mo base having opposing first and second principal faces 2a, 2b and containing Mo as a main component, the second principal face 2b of the Mo base 2 being positioned on at least a portion of a principal face 1a of the Cu base 1; and a first Sn—Cu-type alloy layer 3 covering the first principal face 2a and side faces 2c and 2d of the Mo base 2, the first Sn—Cu-type alloy layer 3 containing no less than 1 mass % and no more than 13 mass % of Sn.
摘要翻译：根据本发明的Cu-Mo基板10包括：以Cu为主要成分的Cu基1; Mo基底具有相对的第一和第二主面2a，2b并且包含Mo作为主要成分，Mo基底2的第二主面2b位于Cu基底1的主面1a的至少一部分上; 以及覆盖Mo基2的第一主面2a和侧面2c，2d的第一Sn-Cu系合金层3，含有1质量％以上且不大于1质量％的第一Sn-Cu系合金层3 13质量％的Sn。

4. 发明申请

US20080169020A1 Electrode Wire For Solar Cell 有权
标题翻译：太阳能电池用电极线
公开(公告)号：US20080169020A1
公开(公告)日：2008-07-17
申请号：US11569450
申请日：2005-05-18
申请人： Kazuhiro Shiomi , Masaaki Ishio , Toshiaki Fujita
发明人： Kazuhiro Shiomi , Masaaki Ishio , Toshiaki Fujita
IPC分类号： H01L31/0224 , H01B5/00
CPC分类号： H01L31/0508 , H01L31/022425 , H01L31/0512 , Y02E10/50
摘要： A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 μΩ·cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.
摘要翻译：太阳能电池电极线包括体积电阻率不大于约2.3μΩ·cm的核心材料和约19.6MPa至约85MPa范围内的抗强度，以及设置在表面上的热浸焊料镀层的核心材料。芯材料优选为氧含量不高于约20ppm的退火纯铜材料。芯材料可以是包括铝和铜层的中间层的复合材料，铜层设置在中间层的相对表面上。

5. 发明申请

US20070062574A1 Electrode wire material and solar cell having connection lead wire formed of the wire material 审中-公开
标题翻译：电极线材和太阳能电池具有由导线材料形成的连接引线
公开(公告)号：US20070062574A1
公开(公告)日：2007-03-22
申请号：US10558214
申请日：2004-05-19
申请人： Kazuhiro Shiomi , Toshiaki Fujita , Masaaki Ishio
发明人： Kazuhiro Shiomi , Toshiaki Fujita , Masaaki Ishio
IPC分类号： H01L31/00
CPC分类号： H01L31/0508 , B23K35/0272 , B23K35/262 , B32B15/015 , C22C13/00 , C22C38/08 , H01L31/0512 , Y02E10/50
摘要： An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer.
摘要翻译：可以在不使用平压辊或环形带的情况下制造可用于太阳能电池的电极线材，并且具有优异的可焊性。电极线材包括由条状导电材料形成的芯材料和形成在芯材表面上的热浸焊料镀层。在芯材中沿着长度方向形成用于储存熔融焊料的凹部，并且在该凹部填充热浸焊料镀层。用于储存熔融焊料的凹部优选在芯材的横向方向上的开口宽度大约为芯材料宽度的大约90％或更多。芯材优选由包含低热膨胀Fe合金的中间层和形成在中间层的两个表面上的铜层的包层材料形成。

6. 发明授权

US07830001B2 Cu-Mo substrate and method for producing same 失效
标题翻译： Cu-Mo基板及其制造方法
公开(公告)号：US07830001B2
公开(公告)日：2010-11-09
申请号：US11915201
申请日：2006-05-23
申请人： Masayuki Yokota , Kazuhiro Shiomi , Fumiaki Kikui , Masaaki Ishio
发明人： Masayuki Yokota , Kazuhiro Shiomi , Fumiaki Kikui , Masaaki Ishio
IPC分类号： H01L21/00
CPC分类号： H01L23/3735 , H01L23/142 , H01L23/3736 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/01019 , H01L2924/01079 , H01L2924/1305 , H01L2924/13055 , Y10T156/10 , Y10T428/12778 , H01L2924/00014 , H01L2924/00
摘要： A Cu—Mo substrate 10 according to the present invention includes: a Cu base 1 containing Cu as a main component; an Mo base having opposing first and second principal faces 2a, 2b and containing Mo as a main component, the second principal face 2b of the Mo base 2 being positioned on at least a portion of a principal face 1a of the Cu base 1; and a first Sn—Cu-type alloy layer 3 covering the first principal face 2a and side faces 2c and 2d of the Mo base 2, the first Sn—Cu-type alloy layer 3 containing no less than 1 mass % and no more than 13 mass % of Sn.
摘要翻译：根据本发明的Cu-Mo基板10包括：以Cu为主要成分的Cu基1; Mo基具有相对的第一和第二主面2a，2b并且包含Mo作为主要成分，Mo基底2的第二主面2b位于Cu基底1的主面1a的至少一部分上; 以及覆盖Mo基2的第一主面2a和侧面2c，2d的第一Sn-Cu系合金层3，含有1质量％以上且不大于1质量％的第一Sn-Cu系合金层3 13质量％的Sn。

7. 发明授权

US07166497B2 Electronic component package and method of manufacturing same 有权
标题翻译：电子元件封装及其制造方法
公开(公告)号：US07166497B2
公开(公告)日：2007-01-23
申请号：US10989675
申请日：2004-11-16
申请人： Kazuhiro Shiomi , Masaaki Ishio , Minoru Iizuka , Yoshikiyo Ogasawara
发明人： Kazuhiro Shiomi , Masaaki Ishio , Minoru Iizuka , Yoshikiyo Ogasawara
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/04 , H01L23/10 , H01L2924/01079 , H01L2924/16195
摘要： An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer. The ratio of the area of the first and second intermetallic compound layers in a longitudinal section of the fusion-welding layer relative to the area of the longitudinal section of the fusion-welding layer is in a range of from about 25% to about 98%. This package maintains superior airtightness even when exposed to a high-temperature atmosphere, which is higher than the melting point of the soldering material.
摘要翻译：电子部件封装包括具有其中包括电子部件的空腔部分的壳体和通过熔融焊接层熔合到壳体上以密封空腔部分的盖部件。壳体具有层叠在壳体上的第一金属层，以便在空腔部分的开放侧露出。盖部件具有芯部，层叠在芯部的面向壳体的一侧的第二金属层。熔焊层具有由焊料形成的焊接材料层，以及由于焊接材料的主要成分扩散到第一金属层中而设置在焊料层的相对侧上的第一和第二金属间化合物层和第二金属层。熔融层的纵截面中的第一和第二金属间化合物的面积相对于熔融层的纵截面的面积的比例为约25％〜98％。即使暴露在高于焊接材料的熔点的高温气氛下，该包装也保持优异的气密性。

8. 发明授权

US07754973B2 Electrode wire for solar cell 有权
标题翻译：太阳能电池用电极线
公开(公告)号：US07754973B2
公开(公告)日：2010-07-13
申请号：US11569450
申请日：2005-05-18
申请人： Kazuhiro Shiomi , Masaaki Ishio , Toshiaki Fujita
发明人： Kazuhiro Shiomi , Masaaki Ishio , Toshiaki Fujita
IPC分类号： H01B5/00
CPC分类号： H01L31/0508 , H01L31/022425 , H01L31/0512 , Y02E10/50
摘要： A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 μΩ·cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.
摘要翻译：一种太阳能电池电极线包括体积电阻率不大于约2.3μΩ·cm·cm的核心材料和约19.6MPa-约85MPa范围内的抗强度，以及设置在芯材表面。芯材料优选为氧含量不高于约20ppm的退火纯铜材料。芯材料可以是包括铝和铜层的中间层的复合材料，铜层设置在中间层的相对表面上。

9. 发明申请

US20090272577A1 CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PROCESSED FROM THE CLAD MATERIAL 审中-公开
标题翻译：用于接线连接的接头材料和从材料加工的接线连接部件
公开(公告)号：US20090272577A1
公开(公告)日：2009-11-05
申请号：US12296735
申请日：2007-04-25
申请人： Kazuhiro Shiomi , Masaaki Ishio
发明人： Kazuhiro Shiomi , Masaaki Ishio
IPC分类号： H01R4/02 , H01B1/02
CPC分类号： H05K3/222 , H01L23/49582 , H01L24/37 , H01L24/40 , H01L24/84 , H01L2224/371 , H01L2224/37147 , H01L2224/37599 , H01L2224/40095 , H01L2224/40225 , H01L2224/45124 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01R13/03 , H05K3/341 , H05K2201/10363 , H05K2201/10909 , H05K2201/2081 , Y02P70/613 , H01L2924/00 , H01L2224/48
摘要： A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability.
摘要翻译：用于布线连接的复合材料具有由纯Cu或具有比纯Al更高的导电性的Cu合金形成的导电层，由纯Al或Al合金形成并且层叠在导电层的一个表面上的表面层，以及在导电层的另一个表面上通过热浸镀锡形成的焊料层。布线连接构件具有设置有焊接到半导体元件的电极的导电层的第一连接端和设置有例如外部布线装置的导电层的第二连接端。布线连接部件由用于布线连接的复合材料加工。该布线构件防止熔融焊料沉积在局部加热装置的加压和加热部分上，同时还具有优异的可焊性。

10. 发明授权

US06921970B2 Package for electronic parts, lid thereof, material for the lid and method for producing the lid material 有权
标题翻译：用于电子部件的封装，其盖，盖的材料和盖材料的制造方法
公开(公告)号：US06921970B2
公开(公告)日：2005-07-26
申请号：US10490484
申请日：2002-11-08
申请人： Kazuhiro Shiomi , Masaaki Ishio
发明人： Kazuhiro Shiomi , Masaaki Ishio
IPC分类号： H01L23/10 , H01L21/44
CPC分类号： B32B15/018 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/16195 , H01L2924/00
摘要： A lid material (1) according to the present invention comprises: a base layer (2) composed of a low thermal expansion metal; an intermediate metal layer (3) provided on one surface of the base layer (2) and composed of a low proof stress metal having a proof stress of not greater than 110 N/mm2; and a brazing material layer (4) provided on the intermediate metal layer (3) and composed of a silver brazing alloy mainly comprising silver. The intermediate metal layer (3) and the brazing material layer (4) are press- and diffusion-bonded to each other, and the brazing material layer (4) has a blistered area ratio of not greater than 0.5% as observed on an outer surface of the brazing material layer. The low proof stress metal is preferably oxygen-free copper. A lid produced from the lid material (1) exhibits an excellent bonding property when the lid is brazed to a case mainly composed of a ceramic material for an electronic component package. Further, the lid suppresses the breakage of the case, and ensures excellent brazing workability.
摘要翻译：根据本发明的盖材料（1）包括：由低热膨胀金属构成的基层（2）; 设置在基层（2）的一个表面上并由耐力不大于110N / mm 2的低应力金属组成的中间金属层（3）; 以及设置在中间金属层（3）上并由主要包含银的银钎焊合金构成的钎料层（4）。中间金属层（3）和钎焊材料层（4）彼此挤压和扩散接合，并且钎焊材料层（4）的气泡面积比不大于0.5％，如在外部钎料层的表面。低应力金属优选为无氧铜。当将盖子钎焊到主要由用于电子部件包装的陶瓷材料构成的壳体时，由盖材料（1）制成的盖子具有优异的粘合性能。此外，盖子抑制壳体的破损，并且确保优异的钎焊加工性。

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