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    • 6. 发明授权
    • Electroless palladium plating solution
    • 无电镀钯溶液
    • US07632343B2
    • 2009-12-15
    • US12186136
    • 2008-08-05
    • Kazuhiro KojimaHideto Watanabe
    • Kazuhiro KojimaHideto Watanabe
    • C23C18/44
    • C23C18/44H05K3/244
    • An electroless palladium plating solution is capable of forming a pure palladium plating film directly on an electroless nickel plating film without (pre)treatment such as substituted palladium plating treatment or the like, which pure palladium plating film has good adhesion and small variations in plating film thickness. An electroless palladium plating solution includes: a first complexing agent, a second complexing agent, phosphoric acid or a phosphate, sulfuric acid or a sulfate, and formic acid or a formate: the first complexing agent being an organopalladium complex having ethylenediamine as a ligand: the second complexing agent being a chelating agent having a carboxyl group or a salt thereof and/or a water-soluble aliphatic organic acid or a salt thereof.
    • 化学镀钯溶液能够直接在化学镀镍膜上形成纯钯电镀膜,而不需要(预处理)诸如取代的钯电镀处理等,其中纯钯电镀膜具有良好的附着力和较小的电镀膜变化 厚度。 化学镀钯溶液包括:第一络合剂,第二络合剂,磷酸或磷酸盐,硫酸或硫酸盐,甲酸或甲酸盐:第一络合剂是具有乙二胺作为配体的有机钯络合物: 第二络合剂是具有羧基的螯合剂或其盐和/或水溶性脂族有机酸或其盐。
    • 7. 发明申请
    • ELECTROLESS PALLADIUM PLATING SOLUTION
    • 电镀磷酸盐溶液
    • US20090044720A1
    • 2009-02-19
    • US12186136
    • 2008-08-05
    • Kazuhiro KojimaHideto Watanabe
    • Kazuhiro KojimaHideto Watanabe
    • C23C18/44
    • C23C18/44H05K3/244
    • [Object] To provide, an electroless palladium plating solution capable of forming a pure palladium plating film directly on an electroless nickel plating film without (pre)treatment such as substituted palladium plating treatment or the like, which pure palladium plating film has good adhesion and small variations in plating film thickness.[Means to Solve the Problem] An electroless palladium plating solution comprising: a first complexing agent, a second complexing agent, phosphoric acid or a phosphate, sulfuric acid or a sulfate, and formic acid or a formate; the first complexing agent being an organopalladium complex having ethylenediamine as a ligand; the second complexing agent being a chelating agent having a carboxyl group or a salt thereof and/or a water-soluble aliphatic organic acid or a salt thereof.
    • 本发明提供一种无电镀钯溶液,其能够直接在化学镀镍膜上形成纯钯电镀膜,而不需要(预处理)如取代的钯电镀处理等,该纯钯电镀膜具有良好的附着力, 镀膜厚度变化小。 解决问题的方法一种无电镀钯溶液,包括:第一络合剂,第二络合剂,磷酸或磷酸盐,硫酸或硫酸盐,甲酸或甲酸盐; 第一络合剂是具有乙二胺作为配体的有机钯络合物; 第二络合剂是具有羧基的螯合剂或其盐和/或水溶性脂族有机酸或其盐。
    • 8. 发明申请
    • Photoresist Coating Liquid Supplying Apparatus, And Photoresist Coating Liquid Supplying Method And Photoresist Coating Apparatus Using Such Photoresist Coating Liquid Supplying Apparatus
    • 光致抗蚀剂涂料液体供给装置和光致抗蚀剂涂料液体供给方法和使用这种光致抗蚀剂涂布液体供给装置的光致抗蚀剂涂布装置
    • US20080087615A1
    • 2008-04-17
    • US11664342
    • 2005-11-25
    • Katsuto TaniguchiKazuhiro KojimaAtsuko Noya
    • Katsuto TaniguchiKazuhiro KojimaAtsuko Noya
    • B01D17/12
    • G03F7/162B05C11/10
    • This invention provides a photoresist coating liquid supplying apparatus and a photoresist coating liquid supplying method, for supplying a photoresist coating liquid having a low particle content to a photoresist coating apparatus, and a photoresist coating apparatus using such a photoresist coating liquid supplying apparatus, which can realize coating without causing significant defects in a cost-effective manner. The photoresist coating liquid supplying apparatus comprises a buffer vessel for a photoresist coating liquid, a circulation filtering apparatus for drawing a part of the coating liquid from the buffer vessel, filtering the coating liquid, and then returning the filtered coating liquid to the buffer vessel, and a pipe for supplying the coating liquid from the buffer vessel or the circulation apparatus to a coating apparatus. The photoresist coating liquid supplying method uses the photoresist coating liquid supplying apparatus. The photoresist coating apparatus comprises a combination of the coating liquid supplying apparatus with a slit coating apparatus.
    • 本发明提供一种光致抗蚀剂涂布液供给装置和光致抗蚀剂涂敷液供给方法,用于向光致抗蚀剂涂布装置供给具有低颗粒含量的光致抗蚀剂涂布液,以及使用这种光致抗蚀剂涂布液供给装置的光致抗蚀剂涂敷装置, 实现涂层,而不会以成本有效的方式引起显着的缺陷。 光致抗蚀剂涂布液供给装置包括光致抗蚀剂涂布液用缓冲容器,用于从缓冲容器中拉出一部分涂布液的循环过滤装置,过滤涂布液,然后将过滤后的涂布液返回缓冲容器, 以及用于将涂布液从缓冲容器或循环装置供给到涂布装置的管道。 光致抗蚀剂涂布液供给方法使用光刻胶涂布液供给装置。 光刻胶涂布装置包括涂布液供给装置与狭缝涂布装置的组合。
    • 10. 发明授权
    • Image processing apparatus and image sensing apparatus
    • 图像处理装置和图像感测装置
    • US08526761B2
    • 2013-09-03
    • US12972054
    • 2010-12-17
    • Kazuhiro KojimaHaruo Hatanaka
    • Kazuhiro KojimaHaruo Hatanaka
    • G06K9/20
    • G06K9/00228G06T5/003G06T5/20G06T2207/10004G06T2207/30201
    • An image processing unit includes a second-taken image generation unit which performs a blurring process on a first taken image including a plurality of small areas so as to generate a second taken image, a focus degree deriving unit which derives a focus degree of each small area, and a combination process unit which combines each small area of the first taken image with each second small area of the second taken image corresponding to each small area of the first taken image. The combination process unit sets a mixing ratio of the second taken image in the combination to a larger value as a focus degree of each small area derived by the focus degree deriving unit is smaller. The second-taken image generation unit includes a face area detection unit which detects a face image area from the first taken image, and a blurring process unit which performs the blurring process on the first taken image on the basis of the detected face image area so as to generate the second taken image.
    • 图像处理单元包括:二次图像生成单元,对包括多个小区域的第一拍摄图像进行模糊处理,以生成第二拍摄图像;焦点导出单元,其导出每个小的焦点度 区域和组合处理单元,其将第一拍摄图像的每个小区域与对应于第一拍摄图像的每个小区域的第二拍摄图像的每个第二小区域组合。 组合处理单元将组合中的第二拍摄图像的混合比设定为较大值,因为由焦点度导出单元导出的每个小区域的焦点度较小。 第二拍摄图像生成单元包括:脸部区域检测单元,其从第一拍摄图像检测面部图像区域;以及模糊处理单元,其基于检测到的脸部图像区域对第一拍摄图像执行模糊处理,从而 以产生第二拍摄图像。