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    • 3. 发明授权
    • Semiconductor memory device with resistance change film and method of manufacturing the same
    • 具有电阻变化膜的半导体存储器件及其制造方法
    • US09595567B2
    • 2017-03-14
    • US13585141
    • 2012-08-14
    • Kazuhiko Yamamoto
    • Kazuhiko Yamamoto
    • H01L29/49H01L27/24H01L29/40H01L45/00
    • H01L27/249H01L45/08H01L45/1226H01L45/146H01L45/1616
    • According to one embodiment, a semiconductor memory device includes a semiconductor substrate, a plurality of insulating layers, a plurality of first interconnection layers, a plurality of second interconnection layers, a plurality of memory cells, and a resistance change film. The insulating layers and first interconnection layers are arranged in parallel with the semiconductor substrate. The second interconnection layers are arranged so as to intersect the first interconnection layers. The second interconnection layers are arranged perpendicular to the semiconductor substrate. The memory cells are arranged at intersections of the first and second interconnection layers. Each of the memory cells includes the resistance change film arranged between the first and second interconnection layers. The side of the first interconnection layer in contact with the resistance change film is retreated more in a direction to separate from the second interconnection layer than the side of the insulating layer.
    • 根据一个实施例,半导体存储器件包括半导体衬底,多个绝缘层,多个第一互连层,多个第二互连层,多个存储单元和电阻变化膜。 绝缘层和第一互连层与半导体衬底平行布置。 第二互连层被布置成与第一互连层相交。 第二互连层被布置成垂直于半导体衬底。 存储单元布置在第一和第二互连层的交点处。 每个存储单元包括布置在第一和第二互连层之间的电阻变化膜。 与电阻变化膜接触的第一互连层的一侧比与绝缘层的侧面沿着与第二互连层分离的方向更多地退避。