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    • 5. 发明授权
    • Nonvolatile semiconductor memory device and method for manufacturing nonvolatile semiconductor memory device
    • 用于制造非易失性半导体存储器件的非易失性半导体存储器件和方法
    • US08729517B2
    • 2014-05-20
    • US13044951
    • 2011-03-10
    • Takuya KonnoKazuhiko Yamamoto
    • Takuya KonnoKazuhiko Yamamoto
    • H01L45/00
    • H01L45/141H01L27/2409H01L27/2463H01L45/148H01L45/1608
    • According to one embodiment, a nonvolatile semiconductor memory device includes a first interconnect, a second interconnect and a resistance change layer. The first interconnect extends in a first direction on a major surface of a substrate. The second interconnect extends in a second direction non-parallel to the first direction. The resistance change layer includes a conductive nanomaterial, the resistance change layer located between the first interconnect and the second interconnect and being capable of reversibly changing between a first resistance state and a second resistance state by a voltage applied or a current supplied through the first interconnect and the second interconnect. The resistance change layer has a density varied along a third direction generally perpendicular to the first direction and the second direction.
    • 根据一个实施例,非易失性半导体存储器件包括第一互连,第二互连和电阻变化层。 第一互连在衬底的主表面上沿第一方向延伸。 第二互连在不平行于第一方向的第二方向上延伸。 电阻变化层包括导电纳米材料,电阻变化层位于第一互连和第二互连之间,并且能够通过施加的电压或通过第一互连提供的电流在第一电阻状态和第二电阻状态之间可逆地改变 和第二互连。 电阻变化层的密度沿大致垂直于第一方向和第二方向的第三方向变化。