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1. 发明申请

US20090022885A1 METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME 失效
标题翻译：金属图案形成方法，获得的金属图案，使用其的印刷电路板和使用其的TFT布线板
公开(公告)号：US20090022885A1
公开(公告)日：2009-01-22
申请号：US11815609
申请日：2006-02-08
申请人： Kazuhiko Matsumoto , Koichi Kawamura , Takeyoshi Kano
发明人： Kazuhiko Matsumoto , Koichi Kawamura , Takeyoshi Kano
IPC分类号： B05D5/12
CPC分类号： C23C18/1608 , C23C18/1653 , C23C18/2086 , C23C18/30 , H05K3/182 , H05K3/387 , H05K2203/0545
摘要： The invention provides a method of forming a metallic pattern including: (a) forming, in a pattern form on a substrate, a polymer layer which contains a polymer that has a functional group that interacts with an electroless plating catalyst or a precursor thereof; (b) imparting the electroless plating catalyst or precursor thereof onto the polymer layer; and (c) forming a metallic film in the pattern form by subjecting the substrate having the polymer layer to electroless plating using an electroless plating solution, wherein the substrate is treated using a solution comprising a surface charge modifier or 1×10−10 to 1×10−4 mmol/l of a plating catalyst poison before or during the (c) forming of the metallic film. The invention further provides a metallic pattern obtained thereby. Furthermore, the invention provides a printed wiring board and a TFT wiring board, each of which uses the metallic pattern as a conductive layer.
摘要翻译：本发明提供一种形成金属图案的方法，包括：（a）以图案形式在基底上形成聚合物层，该聚合物层含有具有与化学镀催化剂或其前体相互作用的官能团的聚合物; （b）将化学镀催化剂或其前体赋予聚合物层; 和（c）通过使用具有聚合物层的基材进行化学镀以形成化学镀方法形成图案形式的金属膜，其中使用包含表面电荷调节剂的溶液或1×10 -10至1×10 -4 在（c）形成金属膜之前或期间，电镀催化剂毒素为mmol / l。本发明还提供了由此获得的金属图案。此外，本发明提供一种印刷线路板和TFT布线板，其中每个都使用金属图案作为导电层。

2. 发明授权

US08187664B2 Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same 失效
标题翻译：金属图案形成方法，由此获得的金属图案，使用该金属图案的印刷线路板以及使用该图案的TFT布线板
公开(公告)号：US08187664B2
公开(公告)日：2012-05-29
申请号：US11815609
申请日：2006-02-08
申请人： Kazuhiko Matsumoto , Koichi Kawamura , Takeyoshi Kano
发明人： Kazuhiko Matsumoto , Koichi Kawamura , Takeyoshi Kano
IPC分类号： B05D5/12
CPC分类号： C23C18/1608 , C23C18/1653 , C23C18/2086 , C23C18/30 , H05K3/182 , H05K3/387 , H05K2203/0545
摘要： The invention provides a method of forming a metallic pattern including: (a) forming, in a pattern form on a substrate, a polymer layer which contains a polymer that has a functional group that interacts with an electroless plating catalyst or a precursor thereof; (b) imparting the electroless plating catalyst or precursor thereof onto the polymer layer; and (c) forming a metallic film in the pattern form by subjecting the substrate having the polymer layer to electroless plating using an electroless plating solution, wherein the substrate is treated using a solution comprising a surface charge modifier or 1×10−10 to 1×10−4 mmol/l of a plating catalyst poison before or during the (c) forming of the metallic film. The invention further provides a metallic pattern obtained thereby. Furthermore, the invention provides a printed wiring board and a TFT wiring board, each of which uses the metallic pattern as a conductive layer.
摘要翻译：本发明提供一种形成金属图案的方法，包括：（a）以图案形式在基底上形成聚合物层，该聚合物层含有具有与化学镀催化剂或其前体相互作用的官能团的聚合物; （b）将化学镀催化剂或其前体赋予聚合物层; 和（c）通过使用具有聚合物层的基板进行化学镀以形成金属膜，使用化学镀溶液进行无电镀，其中使用包含表面电荷调节剂的溶液或1×10 -10至1 在（c）形成金属膜之前或期间，电镀催化剂毒素为×10-4mmol / l。本发明还提供了由此获得的金属图案。此外，本发明提供一种印刷线路板和TFT布线板，其中每个都使用金属图案作为导电层。

3. 发明授权

US07849593B2 Method of making multi-layer circuit board 失效
标题翻译：制作多层电路板的方法
公开(公告)号：US07849593B2
公开(公告)日：2010-12-14
申请号：US11628478
申请日：2005-05-31
申请人： Koichi Kawamura , Takeyoshi Kano
发明人： Koichi Kawamura , Takeyoshi Kano
IPC分类号： H05K3/02
CPC分类号： H05K3/386 , H05K3/381 , H05K3/4644 , H05K3/4652 , H05K2203/1163 , H05K2203/1168 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： The invention provides a multi-layer circuit board sequentially having an insulating substrate, a first electrically conductive pattern arbitrarily formed, an insulating material layer and a second electrically conductive pattern formed by providing an electrically conductive material on a graft polymer pattern formed on the insulating material layer, and having an electrically conductive path which electrically connects the first electrically conductive pattern present on the insulating substrate and the second electrically conductive pattern. The graft polymer pattern includes a combination of a region where a graft polymer is present and a region where no graft polymer is present, or a combination of a region where a hydrophilic graft polymer is present and a region where a hydrophobic graft polymer is present.
摘要翻译：本发明提供一种多层电路板，其顺序地具有绝缘基板，任意形成的第一导电图案，绝缘材料层和通过在形成于绝缘材料上的接枝聚合物图案上提供导电材料而形成的第二导电图案并且具有将存在于绝缘基板上的第一导电图案与第二导电图案电连接的导电路径。接枝聚合物图案包括存在接枝聚合物的区域和不存在接枝聚合物的区域的组合，或存在亲水接枝聚合物的区域和存在疏水接枝聚合物的区域的组合。

4. 发明申请

US20080029294A1 Multi-Layer Circuit Board And Production Method Thereof 失效
标题翻译：多层电路板及其制作方法
公开(公告)号：US20080029294A1
公开(公告)日：2008-02-07
申请号：US11628478
申请日：2005-05-31
申请人： Koichi Kawamura , Takeyoshi Kano
发明人： Koichi Kawamura , Takeyoshi Kano
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K3/386 , H05K3/381 , H05K3/4644 , H05K3/4652 , H05K2203/1163 , H05K2203/1168 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： The invention provides a multi-layer circuit board sequentially having an insulating substrate, a first electrically conductive pattern arbitrarily formed, an insulating material layer and a second electrically conductive pattern formed by providing an electrically conductive material on a graft polymer pattern formed on the insulating material layer, and having an electrically conductive path which electrically connects the first electrically conductive pattern present on the insulating substrate and the second electrically conductive pattern. The graft polymer pattern includes a combination of a region where a graft polymer is present and a region where no graft polymer is present, or a combination of a region where a hydrophilic graft polymer is present and a region where a hydrophobic graft polymer is present.
摘要翻译：本发明提供一种多层电路板，其顺序地具有绝缘基板，任意形成的第一导电图案，绝缘材料层和通过在形成于绝缘材料上的接枝聚合物图案上提供导电材料而形成的第二导电图案并且具有将存在于绝缘基板上的第一导电图案与第二导电图案电连接的导电路径。接枝聚合物图案包括存在接枝聚合物的区域和不存在接枝聚合物的区域的组合，或存在亲水接枝聚合物的区域和存在疏水接枝聚合物的区域的组合。

5. 发明申请

US20070212883A1 Method For Forming Surface Graft, Method For Forming Conductive Film, Method For Forming Method Pattern, Method For Forming Multilayer Wiring Board, Surface Graft Material, And Conductive Material 失效
标题翻译：形成表面接枝的方法，形成导电膜的方法，成型方法方法，形成多层接线板，表面接枝材料和导电材料的方法
公开(公告)号：US20070212883A1
公开(公告)日：2007-09-13
申请号：US10594227
申请日：2005-03-24
申请人： Takeyoshi Kano , Koichi Kawamura
发明人： Takeyoshi Kano , Koichi Kawamura
IPC分类号： C23C18/16 , B32B27/00 , C08F2/48 , C23C18/20 , C08J7/18 , B32B5/16
CPC分类号： C08J7/12 , C08J7/045 , C08J7/16 , C08J2379/08 , C23C18/1601 , C23C18/1653 , C23C18/1692 , C23C18/2006 , C23C18/2086 , C23C18/28 , C25D5/34 , H05K3/389 , H05K3/4661 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/4921 , Y10T428/25 , Y10T428/31721
摘要： The present invention provides a method for forming a surface graft, comprising the process of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and a surface graft material obtained thereby. The present invention also provides a method for forming a conductive film, comprising the processes of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and causing a conductive material to adhere to the graft polymer, and a conductive material obtained thereby.
摘要翻译：本发明提供了一种形成表面接枝物的方法，包括向基体上具有聚合引发部分的含有聚酰亚胺的基材的表面施加能量的方法，以在基材的表面上产生活性点，并产生从活性点开始并且具有极性基团直接结合到基材表面的接枝聚合物，以及由此获得的表面接枝材料。本发明还提供一种形成导电膜的方法，其包括在基体上具有聚合引发部分的含有聚酰亚胺的基材的表面施加能量的工序，以在基板的表面上产生活性点，并产生从活性点开始直接键合到基材表面并具有极性基团并使导电材料附着到接枝聚合物上的接枝聚合物，以及由此获得的导电材料。

6. 发明授权

US06878470B2 Visible image receiving material, conductive pattern material and organic electroluminescence element, using member having surface hydrophilicity 失效
标题翻译：可见图像接收材料，导电图案材料和有机电致发光元件，使用具有表面亲水性的构件
公开(公告)号：US06878470B2
公开(公告)日：2005-04-12
申请号：US10359741
申请日：2003-02-07
申请人： Koichi Kawamura , Takao Nakayama , Miki Takahashi , Takeyoshi Kano
发明人： Koichi Kawamura , Takao Nakayama , Miki Takahashi , Takeyoshi Kano
IPC分类号： B41M3/00 , B41M5/00 , B41M5/50 , B41M5/52 , C09D11/10 , G03F7/00 , H01L27/32 , H01L51/00 , H01L51/40 , H05K3/12 , H05K3/38 , H01J1/62 , B32B3/10 , H05B33/00
CPC分类号： H05K3/38 , B41M3/006 , B41M5/506 , B41M5/52 , C09D11/101 , G03F7/0007 , H01L27/3211 , H01L27/3295 , H01L51/0004 , H01L51/0021 , H05K3/12 , H05K2203/1168 , Y10S428/917 , Y10T428/24802
摘要： The invention includes a visible image receiving material, a conductive pattern material and an organic electroluminescence element, to which a member having a hydrophilic graft chain on a surface thereof through attention to the strong hydrophilicity of the graft chain.
摘要翻译：本发明包括可见图像接收材料，导电图案材料和有机电致发光元件，通过注意接枝链的强亲水性，其表面上具有亲水性接枝链的构件。

7. 发明授权

US07291427B2 Surface graft material, conductive pattern material, and production method thereof 失效
标题翻译：表面接枝材料，导电图案材料及其制造方法
公开(公告)号：US07291427B2
公开(公告)日：2007-11-06
申请号：US11084046
申请日：2005-03-21
申请人： Koichi Kawamura , Takeyoshi Kano
发明人： Koichi Kawamura , Takeyoshi Kano
IPC分类号： G03F7/039 , G03F7/09 , G03F7/16 , G03F7/40
CPC分类号： G03F7/165 , C23C18/1608 , C23C18/1612 , C23C18/182 , C23C18/1844 , C23C18/1868 , C23C18/1893 , C23C18/204 , C23C18/2086 , C23C18/30 , G03F7/405 , H05K3/185 , H05K3/389 , H05K2203/1157
摘要： A surface graft material including a substrate and a surface graft polymer chain, wherein the surface graft polymer chain includes a photocleavable moiety at one of its terminals, and the surface graft polymer chain is directly bonded to a surface of the substrate by a covalent bond between the photocleavable moiety and the substrate. A graft pattern formation method comprising exposing the graft material to cleave the photocleavable moiety in the exposed area, and removing the graft polymer chain from the exposed are to form a surface graft polymer chain pattern. A conductive pattern material and a metal particle pattern material using the graft pattern.
摘要翻译：包括基材和表面接枝聚合物链的表面接枝材料，其中所述表面接枝聚合物链在其一个末端包含可光致发光部分，并且所述表面接枝聚合物链通过所述基材的表面之间的共价键直接键合到所述基材的表面可光洁剂部分和底物。移植物图案形成方法包括使接枝材料暴露以暴露区域中的可光切割部分，以及从暴露部分移除接枝聚合物链，形成表面接枝聚合物链图案。导电图案材料和使用该接枝图案的金属颗粒图案材料。

8. 发明授权

US07279195B2 Method of forming metal fine particle pattern and method of forming electroconductive pattern 失效
标题翻译：形成金属微粒图案的方法和形成导电图案的方法
公开(公告)号：US07279195B2
公开(公告)日：2007-10-09
申请号：US10921355
申请日：2004-08-19
申请人： Takeyoshi Kano , Koichi Kawamura
发明人： Takeyoshi Kano , Koichi Kawamura
IPC分类号： B05D3/00 , G03F7/04 , G03F7/09 , G03F7/11 , G03F7/23
CPC分类号： H05K3/185 , B41M3/006 , B41M5/368 , G03F7/0047 , G03F7/0388 , G03F7/095 , G03F7/0955 , G03F7/265 , G03F7/38 , G03F7/405 , H05K2203/1105 , H05K2203/1157
摘要： A method of forming a metal fine particle pattern including forming a polymerization initiation layer on a support, wherein a polymer which has, in its side chain, a cross-linking group and a functional group having the ability to initiate polymerization is fixed by a cross-linking reaction, forming a graft polymer region in a pattern on the surface of the polymerization initiation layer, wherein the graft polymer layer has the ability to contain a metal ion or a metal salt, adding a metal ion or a metal salt to the graft polymer layer, and thereafter reducing the metal ion or a metal ion in the metal salt to form a metal fine particle dispersion region; and a method of forming an electroconductive pattern using the method of forming a metal fine particle pattern.
摘要翻译：一种形成金属微粒图案的方法，包括在载体上形成聚合引发层，其中在其侧链具有交联基团和具有引发聚合能力的官能团的聚合物通过十字连接反应，在聚合引发层的表面上形成图案的接枝聚合物区域，其中接枝聚合物层具有容纳金属离子或金属盐的能力，向接枝物中加入金属离子或金属盐聚合物层，然后还原金属盐中的金属离子或金属离子，形成金属微粒分散区; 以及使用形成金属细粒图案的方法形成导电图案的方法。

9. 发明授权

US07056642B2 Method of graft polymerization and variety of materials utilizing the same as well as producing method thereof 失效
标题翻译：接枝聚合方法及使用其的各种材料及其制备方法
公开(公告)号：US07056642B2
公开(公告)日：2006-06-06
申请号：US10662458
申请日：2003-09-16
申请人： Takeyoshi Kano , Koichi Kawamura
发明人： Takeyoshi Kano , Koichi Kawamura
IPC分类号： G03F7/004
CPC分类号： B41C1/1016 , B41C1/1041 , B41C2201/04 , B41C2210/02 , B41C2210/04 , B41C2210/06 , B41C2210/14 , B41C2210/22 , B41C2210/24 , B41C2210/262 , B41N3/036 , C08F265/04 , G03F7/0045 , G03F7/027 , G03F7/0388 , G03F7/0955 , G03F7/11
摘要： A method of graft polymerization which includes a step of forming a polymerization initiating layer in which a polymer having, on a side chain thereof, a crosslinking group and a functional group having polymerization initiating capability is immobilized on a support by a crosslinking reaction, and a step of conatacting a compound having a polymerizable functional group with the polymerization initiating layer, and then bonding the compound to the polymerization initiating layer supplying energy thereto, as well as a hydrophilic member, a printing plate precursor, a pattern forming material, a pattern forming method, a method of producing a particle-adsorbed material, and a method of producing a metal particle-dispersed thin layer film, to which the above-mentioned method of graft polymerization can be applied.
摘要翻译：一种接枝聚合方法，包括形成聚合引发层的步骤，其中具有交联基团和具有聚合引发能力的官能团的聚合物在其侧链上通过交联反应固定在载体上，将具有聚合性官能团的化合物与聚合引发层相接合的步骤，然后将化合物与向其供应能量的聚合引发层接合，以及亲水部件，印版前体，图案形成材料，图案形成方法，颗粒吸附材料的制造方法以及可以应用上述接枝聚合方法的金属颗粒分散薄膜的制造方法。

10. 发明申请

US20060068424A1 Biosensor 审中-公开
标题翻译：生物传感器
公开(公告)号：US20060068424A1
公开(公告)日：2006-03-30
申请号：US11202138
申请日：2005-08-12
申请人： Toshiaki Kubo , Koichi Kawamura , Takeyoshi Kano
发明人： Toshiaki Kubo , Koichi Kawamura , Takeyoshi Kano
IPC分类号： C12Q1/68 , C12M1/34
CPC分类号： G01N33/54393 , G01N33/54373
摘要： An object of the present invention is to provide a biosensor wherein at least two types of surfaces are patterned without impairing the sensor surface and non-specific adsorption is thereby suppressed. The present invention provides a biosensor comprising a substrate coated with a hydrophobic compound having a photoactive group, or a substrate which is coated with a hydrophobic polymer and is further modified with a compound having a photoactive group.
摘要翻译：本发明的目的是提供一种生物传感器，其中至少两种类型的表面被图案化而不损害传感器表面，由此抑制了非特异性吸附。本发明提供一种生物传感器，其包括涂布有具有光活性基团的疏水性化合物的基材或涂布有疏水性聚合物的基材，并进一步用具有光活性基团的化合物改性。

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