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    • 3. 发明授权
    • Capacitor and method for fabricating the same, and semiconductor device and method for fabricating the same
    • 电容器及其制造方法,半导体器件及其制造方法
    • US06974985B2
    • 2005-12-13
    • US09960398
    • 2001-09-24
    • Masaki KurasawaKazuaki KuriharaKenji Maruyama
    • Masaki KurasawaKazuaki KuriharaKenji Maruyama
    • H01L27/105H01L21/02H01L21/8246H01L27/108
    • H01L28/55H01L28/91
    • The semiconductor device comprises: a memory cell transistor formed on a semiconductor substrate 10; insulation films 22, 30 covering the memory cell transistor; a buffer structure 40 formed on the insulation film; and a capacitor including a lower electrode 42 formed on the buffer structure 40 and electrically connected to the source/drain diffused layer 20; a capacitor dielectric film 44 formed on the lower electrode 42, and formed of a perovskite ferroelectric material having a smaller thermal expansion coefficient than that of the buffer structure 40 and having a crystal oriented substantially perpendicular to a surface of the lower electrode 42. The buffer structure for mitigating the influence of the stress from the substrate is formed below the lower electrode, whereby a polarization direction of the capacitor dielectric film can be made parallel with a direction of an electric field applied between the upper electrode and the lower electrode. An intrinsic polarization of the ferroelectric film can be utilized as it is.
    • 半导体器件包括:形成在半导体衬底10上的存储单元晶体管; 覆盖存储单元晶体管的绝缘膜22,30; 形成在绝缘膜上的缓冲结构40; 以及电容器,包括形成在缓冲结构40上并电连接到源/漏扩散层20的下电极42; 形成在下部电极42上的电容电介质膜44,由与缓冲结构体40的热膨胀系数相比具有较小的热膨胀系数的钙钛矿型铁电体材料形成,并具有大致垂直于下部电极42的表面取向的晶体。 用于减轻来自基板的应力的影响的缓冲结构形成在下电极的下方,由此可以使电容器电介质膜的极化方向与施加在上电极和下电极之间的电场的方向平行。 可以直接利用铁电体膜的固有极化。
    • 4. 发明授权
    • Method of producing semiconductor device
    • 半导体器件的制造方法
    • US07674634B2
    • 2010-03-09
    • US10532249
    • 2003-11-05
    • Kenji MaruyamaMasaki KurasawaMasao KondoYoshihiro Arimoto
    • Kenji MaruyamaMasaki KurasawaMasao KondoYoshihiro Arimoto
    • H01L21/8246
    • H01L27/11502H01L27/11507H01L28/55
    • A semiconductor device incorporating a capacitor structure that includes a ferroelectric thin film is obtained by forming, on a single crystalline substrate 10 having a surface suited for growing thereon a thin film layer of ferroelectric single crystal having a plane (111), a ferroelectric single crystalline thin film 12′ containing Pb and having a plane (111) 11 in parallel with the surface of the substrate (or a ferroelectric polycrystalline thin film containing Pb and oriented parallel with the plane (111) in parallel with the surface of the substrate) and part 16 of a circuit of a semiconductor device, to thereby fabricate the single crystalline substrate 10 having said ferroelectric thin film containing Pb and said part of the circuit of the semiconductor device; and bonding said single crystalline substrate 10 to another substrate on which the other circuit of the semiconductor device has been formed in advance, to couple the two circuits together.The capacitor in the semiconductor device thus obtained includes a ferroelectric thin film having a large amount of polarizing charge. The semiconductor device can be used as a highly reliable nonvolatile memory.
    • 通过在具有适于生长表面的单晶衬底10上形成具有平面(111)的铁电单晶薄膜层,铁电单结晶 含有Pb的具有与基板表面平行的平面(111)11的薄膜12'(或含有Pb的铁电体多晶薄膜,与基板的表面平行取向平行),以及 半导体器件的电路的第16部分,从而制造具有含有Pb的所述铁电薄膜和所述半导体器件的所述电路的所述部分的单晶衬底10; 并将所述单晶衬底10预先连接到其上形成有半导体器件的另一电路的另一衬底上,以将两个电路耦合在一起。 由此得到的半导体装置中的电容器具有大量的极化电荷的铁电薄膜。 半导体器件可以用作高度可靠的非易失性存储器。
    • 9. 发明申请
    • Manufacturing method for ferroelectric memory device
    • 铁电存储器件的制造方法
    • US20080145953A1
    • 2008-06-19
    • US11998176
    • 2007-11-28
    • Hiroaki TamuraMasaki KurasawaHideki Yamawaki
    • Hiroaki TamuraMasaki KurasawaHideki Yamawaki
    • H01L21/00
    • H01L27/11507H01L27/11502
    • A manufacturing method for a ferroelectric memory device including: forming a lower electrode; forming an electrode oxide film composed of an oxide of a constituent material of the lower electrode; forming a first ferroelectric layer on the lower electrode by reaction between organometallic source material gas and oxygen gas; forming a second ferroelectric layer on the first ferroelectric layer by reaction between organometallic source material gas and oxygen gas; and forming an upper electrode on the second ferroelectric layer. In the method, the oxygen gas in the forming of the first ferroelectric layer is in an amount less than the amount of oxygen necessary for reaction of the organometallic source material gas. In the method, the oxygen gas in the forming of the second ferroelectric layer is in an amount greater than the amount of oxygen necessary for reaction of the organometallic source material gas.
    • 一种铁电存储器件的制造方法,包括:形成下电极; 形成由下电极的构成材料的氧化物构成的电极氧化膜; 通过有机金属源材料气体和氧气之间的反应在下电极上形成第一铁电层; 通过有机金属源材料气体和氧气之间的反应在第一铁电体层上形成第二铁电层; 以及在所述第二铁电层上形成上电极。 在该方法中,形成第一铁电体层中的氧气的量小于有机金属源材料气体反应所需的氧气量。 在该方法中,形成第二铁电体层的氧气的量比有机金属源材料气体反应所需的氧气的量大。