会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • METHOD OF MANUFACTURING NONVOLATILE SEMICONDUCTOR MEMORY WITH BACKING WIRINGS
    • 用支撑线制造非易失性半导体存储器的方法
    • US20120083112A1
    • 2012-04-05
    • US13324614
    • 2011-12-13
    • Hideki SUGIYAMAHideki Hara
    • Hideki SUGIYAMAHideki Hara
    • H01L21/28
    • H01L27/115H01L27/11568
    • A nonvolatile semiconductor memory comprises a first memory cell transistor, a second memory cell transistor, a connection layer, protrusion portions and a contact portion. The first memory cell transistor comprises a first gate electrode formed above a first channel region, and a second gate electrode formed on a side of the first gate electrode through an insulating film. The second memory cell transistor comprises a third gate electrode formed above a second channel region, and a fourth gate electrode formed on a side of the third gate electrode through an insulating film and facing the second gate electrode. The connection layer connects the second gate electrode and the fourth gate electrode. The protrusion portions are formed of a material different than that of the second and fourth gate electrodes, and are formed on both ends of the connection layer. The contact portion is formed on the connection layer.
    • 非易失性半导体存储器包括第一存储单元晶体管,第二存储单元晶体管,连接层,突出部分和接触部分。 第一存储单元晶体管包括形成在第一沟道区上方的第一栅电极和通过绝缘膜形成在第一栅电极侧的第二栅电极。 第二存储单元晶体管包括形成在第二沟道区上方的第三栅极电极和通过绝缘膜形成在面向第二栅电极的第三栅电极侧的第四栅电极。 连接层连接第二栅电极和第四栅电极。 突起部由不同于第二和第四栅电极的材料形成,并且形成在连接层的两端。 接触部分形成在连接层上。
    • 5. 发明申请
    • SEMICONDUCTOR ELEMENT MOUNTING BOARD
    • 半导体元件安装板
    • US20100213597A1
    • 2010-08-26
    • US12682649
    • 2008-10-15
    • Mitsuo SuginoHideki HaraToru Meura
    • Mitsuo SuginoHideki HaraToru Meura
    • H01L23/48H01L23/31
    • H01L23/3735H01L23/49833H01L23/5389H01L2924/0002H05K1/0271H05K3/284H05K2203/1322H01L2924/00
    • A semiconductor element mounting board includes: aboard having surfaces; a semiconductor element mounted on one of the surfaces of the board; a first layer into which the semiconductor element is embedded, the first layer being provided on the one surface of the board; a second layer provided on the other surface of the board, the second layer being constituted from the same material as that of the first layer, the constituent material of the second layer having the same composition ratio as that of the constituent material of the first layer; and surface layers provided on the first and second layers, respectively, each of the surface layers being formed from at least a single layer. In such a semiconductor element mounting board, each of the surface layers has rigidity higher than that of each of the first and second layers. It is preferred that in the case where a Young's modulus of each surface layer at 25° C. is defined as X GPa and a Young's modulus of the first layer at 25° C. is defined as Y GPa, the X and the Y satisfy a relation of 0.5≦X−Y≦13.
    • 半导体元件安装板包括:具有表面; 安装在所述板的一个表面上的半导体元件; 第一层,半导体元件被嵌入其中,第一层设置在板的一个表面上; 设置在所述板的另一个表面上的第二层,所述第二层由与所述第一层相同的材料构成,所述第二层的构成材料具有与所述第一层的构成材料相同的组成比 ; 以及分别设置在第一和第二层上的表面层,每个表面层由至少单层形成。 在这样的半导体元件安装基板中,每个表面层的刚性比第一和第二层的刚性要高。 优选的是,将25℃下的各表面层的杨氏模量定义为X GPa,在25℃下将第一层的杨氏模量定义为YGPa的情况下,X和Y满足 关系为0.5≦̸ X-Y≦̸ 13。
    • 8. 发明授权
    • Method of manufacturing floating gate type transistor
    • 制造浮栅型晶体管的方法
    • US6090667A
    • 2000-07-18
    • US190205
    • 1998-11-13
    • Hideki Hara
    • Hideki Hara
    • H01L21/28H01L21/822H01L21/8234H01L21/8247H01L27/04H01L27/088H01L27/115H01L29/788H01L29/792
    • H01L27/11526H01L27/115H01L27/11531
    • A semiconductor device includes a field oxide film, a plurality of word lines, an insulating interlayer film, a plurality of contact holes, a plurality of protective diffusion layers, a plurality of common contact holes, and a plurality of metal plugs. The field oxide film is formed on a silicon substrate having one conductivity type. The word lines are formed by patterning on the field oxide film. The insulating interlayer film is formed on the field oxide film to cover the word lines. The contact holes are formed in the field oxide film to be self-aligned with the word lines. The protective diffusion layers have an opposite conductivity type and are formed on a surface of the semiconductor substrate to correspond to the contact holes. The common contact holes are formed in the insulating interlayer film to extend across the word lines and the protective diffusion layers. The common contact holes are formed at a depth to reach the protective diffusion layers while partly exposing the word lines. The metal plugs fill the common contact holes to electrically connect the protective diffusion layers and the word lines with each other. A method of manufacturing a semiconductor device is also disclosed.
    • 半导体器件包括场氧化膜,多个字线,绝缘层间膜,多个接触孔,多个保护性扩散层,多个公共接触孔和多个金属插塞。 场氧化膜形成在具有一种导电类型的硅衬底上。 字线通过在场氧化膜上图案化而形成。 绝缘层间膜形成在场氧化膜上以覆盖字线。 接触孔形成在场氧化膜中以与字线自对准。 保护性扩散层具有相反的导电型,并且形成在半导体衬底的与接触孔相对应的表面上。 公共接触孔形成在绝缘层间膜中,以跨越字线和保护扩散层延伸。 常见的接触孔形成在深度上以到达保护性扩散层,同时部分地暴露字线。 金属插头填充公共接触孔,以将保护性扩散层和字线彼此电连接。 还公开了半导体器件的制造方法。
    • 9. 发明授权
    • Fabrication method of nonvolatile semiconductor memory device
    • 非易失性半导体存储器件的制造方法
    • US5492846A
    • 1996-02-20
    • US334318
    • 1994-11-01
    • Hideki Hara
    • Hideki Hara
    • G11C17/00H01L21/8247H01L27/115H01L29/78H01L29/788H01L29/792
    • H01L27/11521
    • A fabrication method of a split-gate type flash EEPROM with an improved data-storage characteristic. Insulator strips extending along a first direction are formed on a semiconductor substrate at intervals. The strips are in contact with active regions and a field insulator film. After a first gate insulator film is formed on uncovered parts of the active regions, respectively, a first patterned conductor film is formed to cover the insulator strips and the first gate insulator film. The first conductor film is anisotropically etched to produce floating gate electrodes lower in height than the stripes on the first gate insulator film without using a mask. Each of the floating gate electrodes has an oblique side face. A second gate insulator film is formed to cover the floating gate electrodes and exposed parts of the active regions. A second conductor film is formed to cover the second gate insulator film and the insulator strips. The second conductor film is etched back to flatten a surface of the second conductor film until tops of the strips are exposed. The second conductor film is patterned to produce control gate electrodes. After the insulator strips are removed, drain regions and source regions are formed in the active regions respectively.
    • 具有改进的数据存储特性的分闸式快闪EEPROM的制造方法。 间隔地在半导体衬底上形成沿着第一方向延伸的绝缘体条。 条带与有源区和场绝缘膜接触。 在分别在有源区的未覆盖部分上形成第一栅极绝缘膜之后,形成第一图案化导体膜以覆盖绝缘体条和第一栅极绝缘膜。 第一导体膜被各向异性地蚀刻以产生高于第一栅极绝缘膜上的条纹的浮动栅电极,而不使用掩模。 每个浮栅电极具有倾斜的侧面。 形成第二栅极绝缘膜以覆盖浮动栅电极和有源区的暴露部分。 形成第二导体膜以覆盖第二栅极绝缘膜和绝缘体条。 将第二导体膜回蚀刻以使第二导体膜的表面变平,直到条的顶部露出。 图案化第二导体膜以产生控制栅电极。 在去除绝缘体条之后,分别在有源区中形成漏区和源极区。
    • 10. 发明授权
    • Method of manufacturing nonvolatile semiconductor memory with backing wirings
    • 制造具有背衬布线的非易失性半导体存储器的方法
    • US08815675B2
    • 2014-08-26
    • US13324614
    • 2011-12-13
    • Hideki SugiyamaHideki Hara
    • Hideki SugiyamaHideki Hara
    • H01L31/072
    • H01L27/115H01L27/11568
    • A nonvolatile semiconductor memory comprises a first memory cell transistor, a second memory cell transistor, a connection layer, protrusion portions and a contact portion. The first memory cell transistor comprises a first gate electrode formed above a first channel region, and a second gate electrode formed on a side of the first gate electrode through an insulating film. The second memory cell transistor comprises a third gate electrode formed above a second channel region, and a fourth gate electrode formed on a side of the third gate electrode through an insulating film and facing the second gate electrode. The connection layer connects the second gate electrode and the fourth gate electrode. The protrusion portions are formed of a material different than that of the second and fourth gate electrodes, and are formed on both ends of the connection layer. The contact portion is formed on the connection layer.
    • 非易失性半导体存储器包括第一存储单元晶体管,第二存储单元晶体管,连接层,突出部分和接触部分。 第一存储单元晶体管包括形成在第一沟道区上方的第一栅电极和通过绝缘膜形成在第一栅电极侧的第二栅电极。 第二存储单元晶体管包括形成在第二沟道区上方的第三栅极电极和通过绝缘膜形成在面向第二栅电极的第三栅电极侧的第四栅电极。 连接层连接第二栅电极和第四栅电极。 突起部由不同于第二和第四栅电极的材料形成,并且形成在连接层的两端。 接触部分形成在连接层上。