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1. 发明授权

US4801489A Printed circuit board capable of preventing electromagnetic interference 失效
标题翻译：能够防止电磁干扰的印刷电路板
公开(公告)号：US4801489A
公开(公告)日：1989-01-31
申请号：US25106
申请日：1987-03-12
申请人： Katsuya Nakagawa , Kazumasa Eguchi , Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada
发明人： Katsuya Nakagawa , Kazumasa Eguchi , Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada
IPC分类号： H05K1/02 , H05K1/09 , H05K3/34 , H05K3/46 , H05K9/00 , B32B3/00 , B32B31/00
CPC分类号： H05K1/0218 , H05K9/0039 , H05K1/095 , H05K2201/0715 , H05K2203/044 , H05K2203/0723 , H05K3/3468 , H05K3/4644 , Y10S428/901 , Y10T156/1089 , Y10T428/12014 , Y10T428/24917
摘要： A printed circuit board capable of preventing electromagnetic interference comprises a base plate composed of an insulating material. On the main surface of the base plate, a first electric conductive layer is formed by etching copper foil, which includes a signal electrode portion and a ground electrode portion. On the first electric conductive layer, an insulating layer such as a solder resist film is formed except for a part of the ground electrode portion, and on this layer, a second electric conductive layer is formed by screen-printing a copper ink so as to cover almost all of the first electric conductive layer. A part of the second electric conductive layer is connected to the ground electrode portion of the first electric conductive layer so that the second electric conductive layer acts as an electromagnetic shield. The copper ink is a mixture of copper powder, binder and other materials. A solder layer may be formed on the second electric conductive layer composed of the copper ink.
摘要翻译：能够防止电磁干扰的印刷电路板包括由绝缘材料构成的基板。在基板的主表面上，通过蚀刻包含信号电极部分和接地电极部分的铜箔形成第一导电层。在第一导电层上，除了接地电极部分的一部分之外，形成除了阻焊膜之外的绝缘层，在该层上，通过丝网印刷铜墨形成第二导电层，以便覆盖几乎所有的第一导电层。第二导电层的一部分连接到第一导电层的接地电极部分，使得第二导电层用作电磁屏蔽。铜墨是铜粉，粘合剂和其他材料的混合物。可以在由铜墨构成的第二导电层上形成焊料层。

2. 发明授权

US4789411A Conductive copper paste composition 失效
标题翻译：导电铜浆组成
公开(公告)号：US4789411A
公开(公告)日：1988-12-06
申请号：US29830
申请日：1987-03-24
申请人： Kazumasa Eguchi , Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada
发明人： Kazumasa Eguchi , Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada
IPC分类号： H01B1/22 , H05K1/09 , H05K9/00 , B23K35/34
CPC分类号： H05K9/0083 , H01B1/22 , H05K1/095
摘要： A conductive copper paste composition is adapted to yield a highly conductive film receptive to solders without pretreatment. This conductive paste comprises a copper metal powder, a resin component including a thermosetting resin, and an assortment of additives. In use, the paste is applied to an insulation substrate to a predetermined circuit pattern and cured in situ. Soldering can then be performed directly on the cured circuit. This contributes not only to the conductivity of the circuit but dispenses with the activation treatment and electroless plating or electroplating that have heretofore been essential prior to soldering. The invention, therefore, results in a substantial curtailment of production process and a proportional economic advantage. In addition, this conductive paste can be used in such applications as electrode and through-hole connections, formation of electromagnetic and electrostatic shield layers, and so on in the manufacture and assembly of electronic components and circuits.
摘要翻译：导电铜浆组合物适于产生不经预处理而接受焊料的高导电膜。该导电糊包括铜金属粉末，包含热固性树脂的树脂组分和各种添加剂。在使用中，将膏体施加到绝缘基板至预定电路图案并原位固化。然后可以在固化电路上直接进行焊接。这不仅有助于电路的导电性，而且还省去了在焊接之前迄今为止必须的激活处理和化学镀或电镀。因此，本发明导致生产过程大大削减并具有比例的经济优势。此外，该导电性糊剂可用于诸如电极和通孔连接，电磁和静电屏蔽层的形成等在电子元件和电路的制造和组装中的应用。

3. 发明授权

US5341274A Printed circuit board with enhanced EMI suppression 失效
标题翻译：具有增强EMI抑制功能的印刷电路板
公开(公告)号：US5341274A
公开(公告)日：1994-08-23
申请号：US477322
申请日：1990-02-08
申请人： Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada , Shohei Morimoto
发明人： Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada , Shohei Morimoto
IPC分类号： H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H05K3/34 , H05K3/46 , H05K9/00
CPC分类号： H05K1/0216 , H05K1/0218 , H05K1/162 , H05K9/0039 , H05K1/095 , H05K1/117 , H05K2201/0715 , H05K2201/09236 , H05K2201/09272 , H05K2201/09672 , H05K2201/10689 , H05K3/3447 , H05K3/4644 , H05K3/4664 , Y10S428/901
摘要： The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.
摘要翻译：辐射噪声抑制效果通过提供形成为使得电路图案被覆盖的绝缘层，除了在其上形成电路图案的基板上的至少一部分电源图案或接地图案之外，导电层是通过改变导电层和绝缘层的图案形状，或者通过增加或减少这些层的数量，形成为连接到电源图案的未绝缘部分或绝缘层上的接地图案。

4. 发明授权

US5466893A Printed circuit board having enhanced EMI suppression 失效
标题翻译：具有增强的EMI抑制的印刷电路板
公开(公告)号：US5466893A
公开(公告)日：1995-11-14
申请号：US219790
申请日：1994-03-30
申请人： Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada , Shohei Morimoto
发明人： Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada , Shohei Morimoto
IPC分类号： H05K1/00
CPC分类号： H05K1/00
摘要： The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.
摘要翻译：辐射噪声抑制效果通过提供形成为使得电路图案被覆盖的绝缘层，除了在其上形成电路图案的基板上的至少一部分电源图案或接地图案之外，导电层是通过改变导电层和绝缘层的图案形状，或者通过增加或减少这些层的数量，形成为连接到电源图案的未绝缘部分或绝缘层上的接地图案。

5. 发明授权

US5449863A Printed circuit board 失效
标题翻译：印刷电路板
公开(公告)号：US5449863A
公开(公告)日：1995-09-12
申请号：US220257
申请日：1994-03-30
申请人： Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada , Shohei Morimoto
发明人： Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada , Shohei Morimoto
IPC分类号： H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H05K3/34 , H05K3/46 , H05K9/00 , H05K1/00
CPC分类号： H05K1/0216 , H05K1/0218 , H05K1/162 , H05K9/0039 , H05K1/095 , H05K1/117 , H05K2201/0715 , H05K2201/09236 , H05K2201/09272 , H05K2201/09672 , H05K2201/10689 , H05K3/3447 , H05K3/4644 , H05K3/4664 , Y10S428/901
摘要： The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.
摘要翻译：辐射噪声抑制效果通过提供形成为使得电路图案被覆盖的绝缘层，除了在其上形成电路图案的基板上的至少一部分电源图案或接地图案之外，导电层是通过改变导电层和绝缘层的图案形状，或者通过增加或减少这些层的数量，形成为连接到电源图案的未绝缘部分或绝缘层上的接地图案。

6. 发明授权

US5981043A Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield 失效
标题翻译：导电涂料组合物，使用它制造的印刷电路板和具有电磁屏蔽的柔性印刷电路组件
公开(公告)号：US5981043A
公开(公告)日：1999-11-09
申请号：US992518
申请日：1997-12-17
申请人： Hisatoshi Murakami , Shinichi Wakita , Tsunehiko Terada , Shohei Morimoto
发明人： Hisatoshi Murakami , Shinichi Wakita , Tsunehiko Terada , Shohei Morimoto
IPC分类号： H05K1/09 , B32B9/00
CPC分类号： H05K1/095 , Y10S428/901 , Y10T428/24917 , Y10T428/31681
摘要： The invention provides a conductive, flexure-resistant electromagnetic-shielded flexible printed circuit assembly obtainable by forming a copper foil circuit on a heat-resistant plastic film, disposing successively thereon an undercoat layer, a metal-powder-containing electromagnetic paste shield layer and an overcoat layer, with the ground pattern of the copper foil circuit being electrically connected to the above shield layer through the undercoat layer at appropriate intervals.
摘要翻译：本发明提供了一种导电抗弯曲电磁屏蔽柔性印刷电路组件，其可通过在耐热塑料膜上形成铜箔电路，连续地设置在其上的底涂层，含金属粉末的电磁胶片屏蔽层和外涂层，其中铜箔电路的接地图案以适当的间隔通过底涂层电连接到上述屏蔽层。

7. 发明授权

US5736070A Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield 失效
标题翻译：导电涂料组合物，使用它制造的印刷电路板和具有电磁屏蔽的柔性印刷电路组件
公开(公告)号：US5736070A
公开(公告)日：1998-04-07
申请号：US637460
申请日：1996-04-25
申请人： Hisatoshi Murakami , Shinichi Wakita , Tsunehiko Terada , Shohei Morimoto
发明人： Hisatoshi Murakami , Shinichi Wakita , Tsunehiko Terada , Shohei Morimoto
IPC分类号： H01B1/22 , H05K1/02 , H05K1/09 , H05K9/00 , C08K3/08
CPC分类号： H05K9/0083 , H01B1/22 , H05K1/0218 , H05K1/095 , H05K9/0024
摘要： The invention relates to an electroconductive coating composition with excellent conductivity, adhesion to copper foil and solder dip resistance which is suitable for the formation of a jumper circuit and an electromagnetic shield layer, a printed circuit board fabricated with the above composition, and a durable electromagnetic-shielded flexible printed circuit assembly, wherein said coating composition comprises, by weight, 100 parts of copper metal powder coated with 0.05-0.2 parts of titanate or/and zirconate, 5-30 parts of resole phenolic resin, 0.5-4 parts of a chelating agent, 0.1-5 parts of an adhesion improving agent and 0.5-7 parts of a conductivity improving agent. This composition is less expensive than the silver paste, superior to the latter in the conductivity and adhesion to copper foil of the coating film and in solder dip resistance, thus being suited for the construction of a jumper circuit and an electromagnetic shield layer. It lends itself well to the mounting of IC, MSI, LSI, etc. by dipping in a molten solder bath.
摘要翻译：本发明涉及一种具有优良导电性，对铜箔的粘附性和适合于形成跳线电路和电磁屏蔽层的耐焊锡性的导电涂料组合物，具有上述组合物制造的印刷电路板和耐久电磁其中所述涂料组合物按重量计包含100份涂覆有0.05-0.2份钛酸酯或/和锆酸盐的铜金属粉末，5-30份酚醛树脂酚醛树脂，0.5-4份螯合剂，0.1-5份粘合改进剂和0.5-7份导电性改进剂。该组合物比银膏便宜，对于涂膜的铜箔的导电性和粘附性以及焊锡浸渍电阻优于后者，因此适用于跨接电路和电磁屏蔽层的构造。它适用于通过浸入熔融焊料浴中安装IC，MSI，LSI等。

8. 发明授权

US06274422B1 Method for manufacturing a semiconductor device 失效
标题翻译：半导体器件的制造方法
公开(公告)号：US06274422B1
公开(公告)日：2001-08-14
申请号：US09290096
申请日：1999-04-12
申请人： Shinichi Wakita
发明人： Shinichi Wakita
IPC分类号： H01L218234
CPC分类号： H01L27/0629
摘要： A first conductive type well layer is formed on a surface of a first conductive type semiconductor substrate. A second conductive type impurity diffusion layer having the conductive type opposite from the first conductive type is formed on a surface of this first conductive type well layer. A second conductive type well layer is formed below the first conductive type well layer. This second conductive type well layer is provided at its both ends with terminals comprising second conductive type well layers passing through the first conductive type semiconductor substrate to reach its surface.
摘要翻译：第一导电型阱层形成在第一导电型半导体衬底的表面上。在该第一导电类型阱层的表面上形成具有与第一导电类型相反的导电类型的第二导电型杂质扩散层。在第一导电类型阱层下面形成第二导电类型阱层。该第二导电类型阱层的两端设置有通过第一导电型半导体衬底到达其表面的第二导电类型阱层的端子。

9. 发明授权

US5567357A Conductive paint having good adhesion to molding of metallic oxide 失效
标题翻译：导电涂料对金属氧化物的成型具有良好的粘合性
公开(公告)号：US5567357A
公开(公告)日：1996-10-22
申请号：US424427
申请日：1995-04-21
申请人： Shinichi Wakita
发明人： Shinichi Wakita
IPC分类号： C09D5/24 , C09D161/04 , C09D161/06 , H01B1/22 , H05K1/09 , H01B1/16
CPC分类号： H01B1/22 , C09D5/24 , H05K1/095
摘要： A conductive paint having a good adhesion to a molding of metallic oxide comprises: 100 parts by weight of silver-plated copper powder containing silver plating in the amount of not more than 30 wt %; 13.6-6.0 parts by weight of phenolic resin (solid content); 0.2-0.7 part by weight of one selected from saturated fatty acids, unsaturated fatty acids, metallic salts thereof, and coupling agents containing saturated fatty acids or unsaturated fatty acids; 1.0-4.0 parts by weight of triethanolamine; and 0.1-1.0 part by weight of dihydroxybenzene. The phenolic resin is a resol phenolic resin having an infrared spectrum that satisfies the following relationships:(A) 1/n=0.8-1.2(B) m/n=0.8-1.2(C) b/a=0.8-1.2(D) c/a=1.2-1.5wherein 1, m, n, a, b and c are, respectively, infrared transmittances of 2-monosubstitution product, 2,4-disubstitution product, 2,4,6-trisubstitution product, methylol group, dimethylenether, and phenol group.
摘要翻译： PCT No.PCT / JP94 / 01401 Sec。 371日期1995年04月21日 102（e）1995年4月21日PCT PCT 1994年8月24日PCT公布。公开号WO95 / 06092 日期1995年3月2日具有与金属氧化物成型性良好的粘合性的导电性涂料包含：100重量份含银量的不超过30重量％的镀银铜粉末; 13.6-6.0重量份酚醛树脂（固含量）; 0.2-0.7重量份选自饱和脂肪酸，不饱和脂肪酸，其金属盐和含有饱和脂肪酸或不饱和脂肪酸的偶联剂; 1.0-4.0重量份三乙醇胺; 和0.1-1.0重量份的二羟基苯。酚醛树脂是具有满足以下关系的红外光谱的甲阶酚醛树脂：（A）1 / n = 0.8-1.2（B）m / n = 0.8-1.2（C）b / a = 0.8-1.2（D ）c / a = 1.2-1.5其中1，m，n，a，b和c分别是2-单取代产物，2,4-二取代产物，2,4,6-三取代产物，羟甲基的红外透射率，二甲基苯和苯酚基。

10. 发明授权

US5917751A Nonvolatile semiconductor memory device 失效
标题翻译：非易失性半导体存储器件
公开(公告)号：US5917751A
公开(公告)日：1999-06-29
申请号：US52427
申请日：1998-03-31
申请人： Shinichi Wakita
发明人： Shinichi Wakita
IPC分类号： G11C17/00 , G11C16/02 , G11C16/06 , G11C16/16 , G11C16/34 , H01L21/8247 , H01L27/115 , H01L29/788 , H01L29/792 , G11C16/04
CPC分类号： G11C16/3409 , G11C16/16 , G11C16/3404
摘要： A nonvolatile semiconductor memory device includes a memory cell array in which memory cells constituted by semiconductor storage elements are divided into a plurality of memory cell blocks each having a common source line and a common digit line, a peripheral circuit for addressing the memory cells and outputting data from the memory cells, a data detecting circuit for detecting, for each memory cell block, the presence/absence of a semiconductor storage element in which the threshold voltage of a transistor constituting the memory cell is the ground potential or less, and a source potential setting circuit capable of changing the source potential setting condition of each memory cell block in accordance with the detection result from the data detecting circuit.
摘要翻译：非易失性半导体存储器件包括存储单元阵列，其中由半导体存储元件构成的存储单元被划分为具有公共源极线和公共数字线的多个存储单元块，用于寻址存储单元并输出的外围电路来自存储器单元的数据，用于每个存储单元块检测构成存储单元的晶体管的阈值电压为接地电位的半导体存储元件的存在/不存在的数据检测电路，以及源电位设定电路能够根据来自数据检测电路的检测结果改变每个存储单元块的源极电位设定条件。

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