专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4801489A Printed circuit board capable of preventing electromagnetic interference 失效
标题翻译：能够防止电磁干扰的印刷电路板
公开(公告)号：US4801489A
公开(公告)日：1989-01-31
申请号：US25106
申请日：1987-03-12
申请人： Katsuya Nakagawa , Kazumasa Eguchi , Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada
发明人： Katsuya Nakagawa , Kazumasa Eguchi , Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada
IPC分类号： H05K1/02 , H05K1/09 , H05K3/34 , H05K3/46 , H05K9/00 , B32B3/00 , B32B31/00
CPC分类号： H05K1/0218 , H05K9/0039 , H05K1/095 , H05K2201/0715 , H05K2203/044 , H05K2203/0723 , H05K3/3468 , H05K3/4644 , Y10S428/901 , Y10T156/1089 , Y10T428/12014 , Y10T428/24917
摘要： A printed circuit board capable of preventing electromagnetic interference comprises a base plate composed of an insulating material. On the main surface of the base plate, a first electric conductive layer is formed by etching copper foil, which includes a signal electrode portion and a ground electrode portion. On the first electric conductive layer, an insulating layer such as a solder resist film is formed except for a part of the ground electrode portion, and on this layer, a second electric conductive layer is formed by screen-printing a copper ink so as to cover almost all of the first electric conductive layer. A part of the second electric conductive layer is connected to the ground electrode portion of the first electric conductive layer so that the second electric conductive layer acts as an electromagnetic shield. The copper ink is a mixture of copper powder, binder and other materials. A solder layer may be formed on the second electric conductive layer composed of the copper ink.
摘要翻译：能够防止电磁干扰的印刷电路板包括由绝缘材料构成的基板。在基板的主表面上，通过蚀刻包含信号电极部分和接地电极部分的铜箔形成第一导电层。在第一导电层上，除了接地电极部分的一部分之外，形成除了阻焊膜之外的绝缘层，在该层上，通过丝网印刷铜墨形成第二导电层，以便覆盖几乎所有的第一导电层。第二导电层的一部分连接到第一导电层的接地电极部分，使得第二导电层用作电磁屏蔽。铜墨是铜粉，粘合剂和其他材料的混合物。可以在由铜墨构成的第二导电层上形成焊料层。

2. 发明授权

US4789411A Conductive copper paste composition 失效
标题翻译：导电铜浆组成
公开(公告)号：US4789411A
公开(公告)日：1988-12-06
申请号：US29830
申请日：1987-03-24
申请人： Kazumasa Eguchi , Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada
发明人： Kazumasa Eguchi , Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada
IPC分类号： H01B1/22 , H05K1/09 , H05K9/00 , B23K35/34
CPC分类号： H05K9/0083 , H01B1/22 , H05K1/095
摘要： A conductive copper paste composition is adapted to yield a highly conductive film receptive to solders without pretreatment. This conductive paste comprises a copper metal powder, a resin component including a thermosetting resin, and an assortment of additives. In use, the paste is applied to an insulation substrate to a predetermined circuit pattern and cured in situ. Soldering can then be performed directly on the cured circuit. This contributes not only to the conductivity of the circuit but dispenses with the activation treatment and electroless plating or electroplating that have heretofore been essential prior to soldering. The invention, therefore, results in a substantial curtailment of production process and a proportional economic advantage. In addition, this conductive paste can be used in such applications as electrode and through-hole connections, formation of electromagnetic and electrostatic shield layers, and so on in the manufacture and assembly of electronic components and circuits.
摘要翻译：导电铜浆组合物适于产生不经预处理而接受焊料的高导电膜。该导电糊包括铜金属粉末，包含热固性树脂的树脂组分和各种添加剂。在使用中，将膏体施加到绝缘基板至预定电路图案并原位固化。然后可以在固化电路上直接进行焊接。这不仅有助于电路的导电性，而且还省去了在焊接之前迄今为止必须的激活处理和化学镀或电镀。因此，本发明导致生产过程大大削减并具有比例的经济优势。此外，该导电性糊剂可用于诸如电极和通孔连接，电磁和静电屏蔽层的形成等在电子元件和电路的制造和组装中的应用。

3. 发明授权

US5341274A Printed circuit board with enhanced EMI suppression 失效
标题翻译：具有增强EMI抑制功能的印刷电路板
公开(公告)号：US5341274A
公开(公告)日：1994-08-23
申请号：US477322
申请日：1990-02-08
申请人： Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada , Shohei Morimoto
发明人： Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada , Shohei Morimoto
IPC分类号： H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H05K3/34 , H05K3/46 , H05K9/00
CPC分类号： H05K1/0216 , H05K1/0218 , H05K1/162 , H05K9/0039 , H05K1/095 , H05K1/117 , H05K2201/0715 , H05K2201/09236 , H05K2201/09272 , H05K2201/09672 , H05K2201/10689 , H05K3/3447 , H05K3/4644 , H05K3/4664 , Y10S428/901
摘要： The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.
摘要翻译：辐射噪声抑制效果通过提供形成为使得电路图案被覆盖的绝缘层，除了在其上形成电路图案的基板上的至少一部分电源图案或接地图案之外，导电层是通过改变导电层和绝缘层的图案形状，或者通过增加或减少这些层的数量，形成为连接到电源图案的未绝缘部分或绝缘层上的接地图案。

4. 发明授权

US5466893A Printed circuit board having enhanced EMI suppression 失效
标题翻译：具有增强的EMI抑制的印刷电路板
公开(公告)号：US5466893A
公开(公告)日：1995-11-14
申请号：US219790
申请日：1994-03-30
申请人： Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada , Shohei Morimoto
发明人： Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada , Shohei Morimoto
IPC分类号： H05K1/00
CPC分类号： H05K1/00
摘要： The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.
摘要翻译：辐射噪声抑制效果通过提供形成为使得电路图案被覆盖的绝缘层，除了在其上形成电路图案的基板上的至少一部分电源图案或接地图案之外，导电层是通过改变导电层和绝缘层的图案形状，或者通过增加或减少这些层的数量，形成为连接到电源图案的未绝缘部分或绝缘层上的接地图案。

5. 发明授权

US5449863A Printed circuit board 失效
标题翻译：印刷电路板
公开(公告)号：US5449863A
公开(公告)日：1995-09-12
申请号：US220257
申请日：1994-03-30
申请人： Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada , Shohei Morimoto
发明人： Fumio Nakatani , Shinichi Wakita , Hisatoshi Murakami , Tsunehiko Terada , Shohei Morimoto
IPC分类号： H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H05K3/34 , H05K3/46 , H05K9/00 , H05K1/00
CPC分类号： H05K1/0216 , H05K1/0218 , H05K1/162 , H05K9/0039 , H05K1/095 , H05K1/117 , H05K2201/0715 , H05K2201/09236 , H05K2201/09272 , H05K2201/09672 , H05K2201/10689 , H05K3/3447 , H05K3/4644 , H05K3/4664 , Y10S428/901
摘要： The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.
摘要翻译：辐射噪声抑制效果通过提供形成为使得电路图案被覆盖的绝缘层，除了在其上形成电路图案的基板上的至少一部分电源图案或接地图案之外，导电层是通过改变导电层和绝缘层的图案形状，或者通过增加或减少这些层的数量，形成为连接到电源图案的未绝缘部分或绝缘层上的接地图案。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式