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    • 4. 发明授权
    • Method of fabricating quantum well structure
    • 量子阱结构的制作方法
    • US07955881B2
    • 2011-06-07
    • US12500074
    • 2009-07-09
    • Katsushi AkitaTakamichi SumitomoYohei EnyaTakashi KyonoMasaki Ueno
    • Katsushi AkitaTakamichi SumitomoYohei EnyaTakashi KyonoMasaki Ueno
    • H01L21/00
    • H01L21/0262H01L21/0242H01L21/02458H01L21/0254H01L33/007H01L33/06
    • In the method of fabricating a quantum well structure which includes a well layer and a barrier layer, the well layer is grown at a first temperature on a sapphire substrate. The well layer comprises a group III nitride semiconductor which contains indium as a constituent. An intermediate layer is grown on the InGaN well layer while monotonically increasing the sapphire substrate temperature from the first temperature. The group III nitride semiconductor of the intermediate layer has a band gap energy larger than the band gap energy of the InGaN well layer, and a thickness of the intermediate layer is greater than 1 nm and less than 3 nm in thickness. The barrier layer is grown on the intermediate layer at a second temperature higher than the first temperature. The barrier layer comprising a group III nitride semiconductor and the group III nitride semiconductor of the barrier layer has a band gap energy larger than the band gap energy of the well layer.
    • 在制造包括阱层和势垒层的量子阱结构的方法中,阱层在蓝宝石衬底的第一温度下生长。 阱层包含含有铟作为成分的III族氮化物半导体。 在InGaN阱层上生长中间层,同时使蓝宝石衬底温度从第一温度单调增加。 中间层的III族氮化物半导体的带隙能量大于InGaN阱层的带隙能量,中间层的厚度大于1nm且小于3nm。 阻挡层在高于第一温度的第二温度下在中间层上生长。 包含III族氮化物半导体的阻挡层和势垒层的III族氮化物半导体的带隙能量大于阱层的带隙能量。
    • 5. 发明授权
    • Semiconductor device having quantum well structure, and method of forming the same
    • 具有量子阱结构的半导体器件及其形成方法
    • US06998284B2
    • 2006-02-14
    • US11057830
    • 2005-02-15
    • Takashi KyonoMasaki UenoKatsushi Akita
    • Takashi KyonoMasaki UenoKatsushi Akita
    • H01L21/00
    • H01L33/32B82Y20/00H01L33/06H01S5/3407H01S5/34333
    • A method of forming a semiconductor device having a quantum well structure, comprises the steps of: (a) forming a well film at a first temperature, the well film being made of a III-V nitride semiconductor containing nitrogen, indium and gallium; (b) forming a first barrier film on the well film, the first barrier film being made of a III-V nitride semiconductor containing nitrogen, indium and gallium, and an indium composition of the first barrier film being smaller than that of the well film; (c) changing temperature without forming a semiconductor film; and (d) forming a second barrier film at a second temperature higher than the first temperature, the second barrier film being made of a III-V nitride semiconductor on the first barrier film, the first barrier film being formed at a third temperature, the third temperature being equal to or higher than the first temperature, and the third temperature being lower than the second temperature.
    • 一种形成具有量子阱结构的半导体器件的方法包括以下步骤:(a)在第一温度下形成阱膜,阱膜由含有氮,铟和镓的III-V族氮化物半导体制成; (b)在所述阱膜上形成第一阻挡膜,所述第一阻挡膜由包含氮,铟和镓的III-V族氮化物半导体制成,并且所述第一阻挡膜的铟组合物小于所述阱膜的铟组分 ; (c)不形成半导体膜而改变温度; 和(d)在高于第一温度的第二温度下形成第二阻挡膜,第二阻挡膜由第一阻挡膜上的III-V族氮化物半导体构成,第一阻挡膜形成在第三温度, 第三温度等于或高于第一温度,第三温度低于第二温度。
    • 6. 发明申请
    • Semiconductor device having quantum well structure, and method of forming the same
    • 具有量子阱结构的半导体器件及其形成方法
    • US20050199903A1
    • 2005-09-15
    • US11057830
    • 2005-02-15
    • Takashi KyonoMasaki UenoKatsushi Akita
    • Takashi KyonoMasaki UenoKatsushi Akita
    • H01L21/20H01L21/205H01L33/06H01L33/32H01S5/34H01S5/343H01L29/24
    • H01L33/32B82Y20/00H01L33/06H01S5/3407H01S5/34333
    • A method of forming a semiconductor device having a quantum well structure, comprises the steps of: (a) forming a well film at a first temperature, the well film being made of a III-V nitride semiconductor containing nitrogen, indium and gallium; (b) forming a first barrier film on the well film, the first barrier film being made of a III-V nitride semiconductor containing nitrogen, indium and gallium, and an indium composition of the first barrier film being smaller than that of the well film; (c) changing temperature without forming a semiconductor film; and (d) forming a second barrier film at a second temperature higher than the first temperature, the second barrier film being made of a III-V nitride semiconductor on the first barrier film, the first barrier film being formed at a third temperature, the third temperature being equal to or higher than the first temperature, and the third temperature being lower than the second temperature.
    • 一种形成具有量子阱结构的半导体器件的方法包括以下步骤:(a)在第一温度下形成阱膜,阱膜由含有氮,铟和镓的III-V族氮化物半导体制成; (b)在所述阱膜上形成第一阻挡膜,所述第一阻挡膜由包含氮,铟和镓的III-V族氮化物半导体制成,并且所述第一阻挡膜的铟组合物小于所述阱膜的铟组分 ; (c)不形成半导体膜而改变温度; 和(d)在高于第一温度的第二温度下形成第二阻挡膜,第二阻挡膜由第一阻挡膜上的III-V族氮化物半导体构成,第一阻挡膜形成在第三温度, 第三温度等于或高于第一温度,第三温度低于第二温度。