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    • 1. 发明授权
    • Method for producing electrically insulated coils
    • 电绝缘线圈的制造方法
    • US5733402A
    • 1998-03-31
    • US636768
    • 1996-04-19
    • Katsuo SugawaraTohru KoyamaSyoichi Maruyama
    • Katsuo SugawaraTohru KoyamaSyoichi Maruyama
    • H01B13/06H01F41/12H02K15/12B32B31/00
    • H01B13/065H01F41/127H02K15/12
    • In the production of electrically insulated coils which make up insulating layers, insulating material is wound around an electric conductor to form an insulating substrate, then impregnating varnish consisting of thermosetting resin is applied to the insulating substrate and hardened. In this electrically insulated coil production method, the impregnating varnish is made up of acid anhydride setting epoxy resin elements that include latent accelerators. These accelerators take more than 30 days to increase their initial viscosity by three times during storage at 25 degrees centigrade. After the insulating substrate is impregnated with the varnish, the substrate is heated at a temperature which will cause the impregnating varnish on the surface of the insulating substrate to lose its fluidity in under 30 minutes in order to preset the varnish. Next, the varnish is set at a heat at least 10 degrees centigrade lower than the presetting temperature and thereby, electrically insulated coils with high reliability are obtained.
    • 在构成绝缘层的电绝缘线圈的制造中,将绝缘材料缠绕在电导体上以形成绝缘基板,然后将由热固性树脂构成的浸渍清漆施加到绝缘基板上并硬化。 在这种电绝缘线圈制造方法中,浸渍清漆由包含潜在促进剂的酸酐固化环氧树脂元素组成。 这些加速器在25摄氏度储存期间需要30多天才能将其初始粘度提高3倍。 在绝缘基板浸渍清漆后,基板在使绝缘基板表面上的浸渍清漆在30分钟内失去其流动性的温度被加热,以便预设清漆。 接下来,将清漆设定在比预设温度低至少10摄氏度的热量,从而获得高可靠性的电绝缘线圈。
    • 3. 发明申请
    • Thermosetting resin compounds
    • 热固性树脂化合物
    • US20060276568A1
    • 2006-12-07
    • US11505294
    • 2006-08-17
    • Masaki AkatsukaYoshitaka TakazawaKatsuo Sugawara
    • Masaki AkatsukaYoshitaka TakazawaKatsuo Sugawara
    • C08L63/00
    • C08G59/5033C08G59/22C08G59/245C08L33/00C08L63/00C09K19/388C08L2666/04
    • This invention provides a thermosetting resin compound containing 25% or more by volume of anisotropic structure in the resin ingredient, wherein a structure constituting said anisotropic structure has a covalent bond and the maximum diameter of the structure is 400 nm or more. The resin ingredient of said thermosetting resin compound is preferably a hardened epoxy resin compound containing a mesogen-structured epoxy resin monomer and an epoxy resin hardening agent. The epoxy resin monomer in the thermosetting resin compound is preferably an epoxy resin monomer expressed by Formula (1) below E-M-S-M-E  (1)(where E, M, and S respectively indicate an epoxy group, a mesogen group, and a spacer). Therefore, this invention can provide a highly thermal conductive hardened thermosetting resin compound whose thermal conductivity is increased highly.
    • 本发明提供一种在树脂成分中含有25体积%以上的各向异性结构的热固性树脂化合物,其中构成所述各向异性结构的结构具有共价键,结构的最大直径为400nm以上。 所述热固性树脂化合物的树脂成分优选为含有介晶结构的环氧树脂单体和环氧树脂硬化剂的硬化环氧树脂化合物。 热固性树脂化合物中的环氧树脂单体优选为下述式(1)表示的环氧树脂单体<βin-line-formula description =“In-line Formulas”end =“lead”?> EMSME(1) in-line-formula description =“In-line Formulas”end =“tail”?>(其中E,M和S分别表示环氧基,介晶基和间隔基)。 因此,本发明可以提供导热性高的高导热硬化性热固性树脂化合物。
    • 4. 发明授权
    • Cured thermosetting resin product
    • 固化热固性树脂产品
    • US07109288B2
    • 2006-09-19
    • US10477926
    • 2001-05-18
    • Masaki AkatsukaYoshitaka TakazawaKatsuo Sugawara
    • Masaki AkatsukaYoshitaka TakazawaKatsuo Sugawara
    • C08G63/00C08G59/00
    • C08G59/5033C08G59/22C08G59/245C08L33/00C08L63/00C09K19/388C08L2666/04
    • This invention provides a thermosetting resin compound containing 25% or more by volume of anisotropic structure in the resin ingredient, wherein a structure constituting said anisotropic structure has a covalent bond and the maximum diameter of the structure is 400 nm or more. The resin ingredient of said thermosetting resin compound is preferably a hardened epoxy resin compound containing a mesogen-structured epoxy resin monomer and an epoxy resin hardening agent. The epoxy resin monomer in the thermosetting resin compound is preferably an epoxy resin monomer expressed by the following formula: E-M-S-M-E, wherein E, M, and S respectively indicate an epoxy group, a mesogen group, and a spacer. Therefore, this invention can provide a highly thermal conductive hardened thermosetting resin compound whose thermal conductivity is increased highly.
    • 本发明提供一种在树脂成分中含有25体积%以上的各向异性结构的热固性树脂化合物,其中构成所述各向异性结构的结构具有共价键,结构的最大直径为400nm以上。 所述热固性树脂化合物的树脂成分优选为含有介晶结构的环氧树脂单体和环氧树脂硬化剂的硬化环氧树脂化合物。 热固性树脂化合物中的环氧树脂单体优选为由下式表示的环氧树脂单体:E-M-S-M-E,其中E,M和S分别表示环氧基,介晶基和间隔基。 因此,本发明可以提供导热性高的高导热硬化性热固性树脂化合物。