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    • 3. 发明申请
    • SPECTROSCOPY MODULE
    • 光谱模块
    • US20090290155A1
    • 2009-11-26
    • US12464273
    • 2009-05-12
    • Katsumi SHIBAYAMATomofumi SUZUKIMasaki HIROSE
    • Katsumi SHIBAYAMATomofumi SUZUKIMasaki HIROSE
    • G01J3/28
    • G01J3/2803G01J3/02G01J3/0202G01J3/0208G01J3/0243G01J3/0259G01J3/0262G01J3/0286G01J3/18
    • In a spectroscopy module 1, a light passing hole 50 through which a light L1 advancing to a spectroscopic portion 4 passes is formed in a light detecting element 5. Therefore, it is possible to prevent the relative positional relationship between the light passing hole 50 and a light detecting portion 5a of the light detecting element 5 from deviating. Moreover, the light detecting element 5 is bonded to a front plane 2a of a substrate 2 with an optical resin adhesive 63. Thus, it is possible to reduce a stress generated onto the light detecting element 5 due to a thermal expansion difference between the light detecting element 5 and the substrate 2. Additionally, on the light detecting element 5, a first convex portion 101 is formed so as to be located at least between the light detecting portion 5a and the light passing hole 50 when viewed from a direction substantially perpendicular to the front plane 2a. Thus, when the light detecting element 5 is attached to the substrate 2 via the optical resin adhesive 63, the optical resin adhesive 63 is dammed at the first convex portion 101. Thus, the optical resin adhesive 63 is prevented from penetrating into the light passing hole 50.
    • 在光谱模块1中,在光检测元件5中形成有通过向分光部4前进的光L1通过的光通过孔50.因此,能够防止光通过孔50与 光检测元件5的光检测部分5a偏离。 此外,光检测元件5利用光学树脂粘合剂63接合到基板2的前面2a。因此,可以减少由于光的热膨胀差而在光检测元件5上产生的应力 检测元件5和基板2.此外,在光检测元件5上,当从基本上垂直的方向观察时,形成至少位于光检测部分5a和光通过孔50之间的第一凸部101 到前平面2a。 因此,当光检测元件5经由光学树脂粘合剂63安装到基板2上时,光学树脂粘合剂63被阻挡在第一凸部101处。因此,防止光学树脂粘合剂63渗透到光通过 孔50。
    • 4. 发明申请
    • METHOD FOR MANUFACTURING SPECTROSCOPY MODULE, AND SPECTROSCOPY MODULE
    • 制造光谱模块的方法和光谱模块
    • US20090290154A1
    • 2009-11-26
    • US12464267
    • 2009-05-12
    • Katsumi SHIBAYAMATomofumi SUZUKI
    • Katsumi SHIBAYAMATomofumi SUZUKI
    • G01J3/28B23P11/00
    • G01J3/18G01J3/02G01J3/0202G01J3/0208G01J3/0243G01J3/0259G01J3/0262G01J3/04G01J3/2803Y10T29/49826Y10T29/49895Y10T156/10
    • In a spectroscopy module 1, a light detecting element 5 having a light passing hole 50 is used. Therefore, it is possible to prevent the relative positional relationship between the light passing hole 50 and a light detecting portion 5a of the light detecting element 5 from deviating. Moreover, the light detecting element 5 is electrically connected to a wiring 9 formed on a front plane 2a of a substrate 2 by face-down bonding, and a resin layer 79 is formed as an underfill resin between the substrate 2 and the light detecting element 5. Therefore, it is possible to improve the fixing strength between the substrate 2 and the light detecting element 5. Additionally, before the resin layer 79 is formed, a resin layer 78 is formed along a guide portion 77 that surrounds the passing hole 50. Thus, the resin layer 79 is prevented from penetrating into the light passing hole 50, which makes it possible to make a light be appropriately incident into the substrate 2.
    • 在光谱模块1中,使用具有光通过孔50的光检测元件5。 因此,可以防止光通过孔50和光检测元件5的光检测部分5a之间的相对位置关系偏离。 此外,光检测元件5通过面朝下接合与形成在基板2的前面2a上的布线9电连接,并且在基板2和光检测元件之间形成树脂层79作为底部填充树脂 因此,可以提高基板2和光检测元件5之间的固定强度。另外,在形成树脂层79之前,沿着包围通孔50的引导部77形成树脂层78 因此,防止了树脂层79渗入光通过孔50,这使得可以使光适当地入射到基板2中。
    • 5. 发明申请
    • SPECTROSCOPY MODULE
    • 光谱模块
    • US20090284741A1
    • 2009-11-19
    • US12465276
    • 2009-05-13
    • Katsumi SHIBAYAMATomofumi SUZUKI
    • Katsumi SHIBAYAMATomofumi SUZUKI
    • G01J3/02
    • G01J3/02G01J3/0208G01J3/0243G01J3/0256G01J3/0259G01J3/0286G01J3/0297
    • In a spectroscopy module 1, a light passing hole 50 through which a light L1 advancing to a spectroscopic portion 4 passes is formed in a light detecting element 5. Therefore, it is possible to prevent the relative positional relationship between the light passing hole 50 and a light detecting portion 5a of the light detecting element 5 from deviating. Moreover, the light detecting element 5 is bonded to a front plane 2a of a substrate 2 with an optical resin adhesive 63. Thus, it is possible to reduce a stress generated onto the light detecting element 5 due to a thermal expansion difference between the light detecting element 5 and the substrate 2. Additionally, on the light detecting element 5, a first pool portion 101 is formed so as to be located at least between the light detecting portion 5a and the light passing hole 50 when viewed from a direction substantially perpendicular to the front plane 2a. Thus, when the light detecting element 5 is attached to the substrate 2 via the optical resin adhesive 63, the optical resin adhesive 63 is pooled to remain at the first pool portion 101. Thus, the optical resin adhesive 63 is prevented from penetrating into the light passing hole 50.
    • 在光谱模块1中,在光检测元件5中形成有通过向分光部4前进的光L1通过的光通过孔50.因此,能够防止光通过孔50与 光检测元件5的光检测部分5a偏离。 此外,光检测元件5利用光学树脂粘合剂63接合到基板2的前面2a。因此,可以减少由于光的热膨胀差而在光检测元件5上产生的应力 检测元件5和基板2.此外,在光检测元件5上,当从基本上垂直的方向观察时,第一池部分101形成为至少位于光检测部分5a和光通过孔50之间 到前平面2a。 因此,当光检测元件5通过光学树脂粘合剂63附着到基板2上时,将光学树脂粘合剂63汇集以保持在第一池部101处。因此,防止光学树脂粘合剂63渗透到 光通过孔50。