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    • 8. 发明授权
    • Structure for packaging integrated circuits
    • 封装集成电路结构
    • US3984739A
    • 1976-10-05
    • US567418
    • 1975-04-11
    • Yoshifumi MochizukiKatsuhiko KomiyamaSatoshi Kimura
    • Yoshifumi MochizukiKatsuhiko KomiyamaSatoshi Kimura
    • G06F11/18G06F15/16H01L23/31H01L23/495H05K5/00
    • H01L23/3121H01L23/49572H01L24/01H01L2924/14
    • An integrated circuit package structure wherein electrodes of an integrated circiut chip are directly bonded to metal lead members within the package. A portion of the substrate is enclosed inside the package to support the package. Holes are provided on the substrate for positioning and securing the package to the substrate. The substrate has a generally rectangular opening disposed therethrough arranged and configured to receive an integrated circuit chip and at least two additional openings disposed in said substrate so as to form at least two support arms adjacent to the rectangular opening. The integrated circuit package has a top member, a bottom member and a circuit chip. The circuit chip has a plurality of electrodes disposed thereon in a predetermined configuration for selectively coupling the lead members which are disposed on the substrate. By the use of the integrated circuit package structure of the present invention, circuit packages may be securely and easily coupled to a substrate and held in position.
    • 一种集成电路封装结构,其中集成循环芯片的电极直接结合到封装内的金属引线构件。 衬底的一部分被封装在包装内以支撑包装。 在基板上设置孔,用于将包装定位并固定到基板上。 衬底具有穿过其布置和配置为接纳集成电路芯片和设置在所述衬底中的至少两个附加开口的大致矩形的开口,以形成邻近矩形开口的至少两个支撑臂。 集成电路封装具有顶部构件,底部构件和电路芯片。 电路芯片具有以预定构造设置在其上的多个电极,用于选择性地耦合设置在基板上的引线构件。 通过使用本发明的集成电路封装结构,电路封装件可以牢固且容易地耦合到衬底并保持就位。