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1. 发明申请

US20130334590A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20130334590A1
公开(公告)日：2013-12-19
申请号：US13765941
申请日：2013-02-13
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Takashi WATANABE , Jun Takayasu
IPC分类号： H01L29/792 , H01L21/306
CPC分类号： H01L29/792 , H01L21/30625 , H01L21/76819 , H01L21/7682 , H01L27/11524 , H01L27/1157
摘要： According to one embodiment, a semiconductor device includes a substrate, a foundation structure, a first insulating film, and a second insulating film. The foundation structure is provided on the substrate. The foundation structure includes a plurality of circuit components and a gap provided between the circuit components. The first insulating film is provided on the foundation structure. The second insulating film is provided on the first insulating film. A Young's modulus of the second insulating film is lower than a Young's modulus of the first insulating film and a Young's modulus of a silicon oxide film.
摘要翻译：根据一个实施例，半导体器件包括衬底，基底结构，第一绝缘膜和第二绝缘膜。基底结构设置在基板上。基础结构包括多个电路部件和设置在电路部件之间的间隙。第一绝缘膜设置在基础结构上。第二绝缘膜设置在第一绝缘膜上。第二绝缘膜的杨氏模量低于第一绝缘膜的杨氏模量和氧化硅膜的杨氏模量。

2. 发明授权

US09539696B2 Retainer ring, polish apparatus, and polish method 有权
标题翻译：保持环，抛光装置和抛光方法
公开(公告)号：US09539696B2
公开(公告)日：2017-01-10
申请号：US14578845
申请日：2014-12-22
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Dai Fukushima , Takashi Watanabe , Jun Takayasu
IPC分类号： B24B37/32 , B24B37/10 , B24B37/04
CPC分类号： B24B37/32 , B24B37/042 , B24B37/10 , B24B37/107
摘要： A retainer ring configured to be attachable, at a first side thereof, to a polish head of a polish apparatus configured to polish a polish object by depressing the polish object against a polish pad is disclosed. The retainer ring is configured to depress the polish pad at a second side thereof. The retainer ring includes a contact surface contacting the polish pad. The contact surface applies depressing force on the polish pad. The depressing force is directed from a polish head side and is applied so as to be centered on an imaginary circle of pressure center having a radius falling substantially in a middle of an inner radius of the retainer ring and an outer radius of the retainer ring. An area of the contact surface is greater in a first region inside the circle of pressure center than in a second region outside the circle of pressure center.
摘要翻译：公开了一种保持环，其被构造成可以在其第一侧被附着到抛光装置的抛光头，所述抛光装置被配置为通过将抛光物体压靠抛光垫来抛光抛光物体来抛光抛光物体。保持环构造成在其第二侧压下抛光垫。保持环包括接触抛光垫的接触表面。接触表面在抛光垫上施加抑制力。按压力从抛光头侧引导，并且被施加以在具有大体上位于保持环的内半径的中间的半径的压力中心的假想圆和保持环的外半径的中心。接触表面的区域在压力中心圆周内的第一区域内比在压力中心圆外的第二区域内更大。

3. 发明授权

US09502318B2 Polish apparatus, polish method, and method of manufacturing semiconductor device 有权
标题翻译：波兰装置，抛光方法和制造半导体器件的方法
公开(公告)号：US09502318B2
公开(公告)日：2016-11-22
申请号：US14641734
申请日：2015-03-09
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Dai Fukushima , Jun Takayasu , Takashi Watanabe
IPC分类号： H01L21/66 , H01L21/67 , B24B49/10 , B24B49/12 , B24B37/013 , H01L21/3105
CPC分类号： H01L22/26 , B24B37/013 , B24B49/105 , B24B49/12 , H01L21/31053
摘要： A polish apparatus including a rotatable table configured to receive a polish pad having a polish surface; a polish head configured to hold a polish object and configured to be capable of placing the polish object in contact with the polish surface while holding the polish object; at least one contact portion being provided with a contact surface and configured to be capable of contacting the polish surface when the table is in rotation; and a measurement portion configured to measure a state of the contact surface of the contact portion being configured to contact the polish surface of the polish pad.
摘要翻译：一种抛光装置，包括可旋转工作台，其被配置为容纳具有抛光表面的抛光垫; 抛光头构造成保持抛光物体并且被配置为能够在保持抛光物体的同时使抛光物体与抛光表面接触; 至少一个接触部分设置有接触表面，并且被配置成当所述工作台旋转时能够接触所述抛光表面; 以及测量部分，被配置为测量接触部分的接触表面的状态，其被配置为接触抛光垫的抛光表面。

4. 发明授权

US09296083B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US09296083B2
公开(公告)日：2016-03-29
申请号：US14109011
申请日：2013-12-17
申请人： Kabushiki Kaisha Toshiba
发明人： Dai Fukushima , Jun Takayasu , Takashi Watanabe
IPC分类号： B24B49/16 , B24B49/08 , B24B37/005 , B24B37/30 , B24B37/04 , H01L21/67 , B24B49/10 , H01L21/02
CPC分类号： B24B37/005 , B24B37/042 , B24B37/30 , B24B49/08 , B24B49/10 , B24B49/16 , H01L21/02024 , H01L21/67219
摘要： A polishing apparatus including a membrane including a pressure chamber and being configured to hold a wafer; a polishing portion including a polish pad contacting a polish surface of the wafer when polishing the wafer; a monitoring portion monitoring a state of inflation of the pressure chamber; and a controller controlling polishing of the wafer by the polishing portion based on a result of monitoring by the monitoring portion.
摘要翻译：一种抛光装置，包括：膜，包括压力室并被构造成保持晶片; 抛光部分，其包括在抛光晶片时与抛光晶片接触的抛光垫; 监视压力室的充气状态的监视部分; 以及控制器，其基于所述监视部的监视结果，通过所述研磨部控制所述晶片的研磨。

5. 发明授权

US08823079B2 Semiconductor device and method for manufacturing same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08823079B2
公开(公告)日：2014-09-02
申请号：US13765941
申请日：2013-02-13
申请人： Kabushiki Kaisha Toshiba
发明人： Takashi Watanabe , Jun Takayasu
IPC分类号： H01L29/792 , H01L21/30 , H01L21/306
CPC分类号： H01L29/792 , H01L21/30625 , H01L21/76819 , H01L21/7682 , H01L27/11524 , H01L27/1157
摘要： According to one embodiment, a semiconductor device includes a substrate, a foundation structure, a first insulating film, and a second insulating film. The foundation structure is provided on the substrate. The foundation structure includes a plurality of circuit components and a gap provided between the circuit components. The first insulating film is provided on the foundation structure. The second insulating film is provided on the first insulating film. A Young's modulus of the second insulating film is lower than a Young's modulus of the first insulating film and a Young's modulus of a silicon oxide film.
摘要翻译：根据一个实施例，半导体器件包括衬底，基底结构，第一绝缘膜和第二绝缘膜。基底结构设置在基板上。基础结构包括多个电路部件和设置在电路部件之间的间隙。第一绝缘膜设置在基础结构上。第二绝缘膜设置在第一绝缘膜上。第二绝缘膜的杨氏模量低于第一绝缘膜的杨氏模量和氧化硅膜的杨氏模量。

6. 发明申请

US20160247710A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20160247710A1
公开(公告)日：2016-08-25
申请号：US14796409
申请日：2015-07-10
申请人： Kabushiki Kaisha Toshiba
发明人： Toshiyuki Morita , Jun Takayasu
IPC分类号： H01L21/768 , H01L21/311 , H01L23/532 , H01L21/02 , H01L23/522 , H01L23/528
CPC分类号： H01L21/7682 , H01L21/76826 , H01L21/76831 , H01L23/5222 , H01L23/53295
摘要： In one embodiment, a method of manufacturing a semiconductor device includes forming plugs in a first insulator, and forming a first film on the first insulator and the plugs. The method further includes forming openings in the first film to expose the plugs in the openings, and forming a second insulator on side faces of the openings. The method further includes forming an interconnect material adjacent to the second insulator in the openings to form interconnects including the interconnect material on the plugs in the openings. The method further includes removing the first film after forming the interconnects, and forming a third insulator on the interconnects to form an air gap between the interconnects.
摘要翻译：在一个实施例中，制造半导体器件的方法包括在第一绝缘体中形成插塞，并在第一绝缘体和插头上形成第一膜。该方法还包括在第一膜中形成开口以露出开口中的插塞，并在开口的侧面上形成第二绝缘体。该方法还包括在开口中形成与第二绝缘体相邻的互连材料，以形成在开口中的插塞上包括互连材料的互连。该方法还包括在形成互连件之后去除第一膜，以及在互连件上形成第三绝缘体，以在互连之间形成气隙。

7. 发明申请

US20150183082A1 RETAINER RING, POLISH APPARATUS, AND POLISH METHOD 有权
标题翻译：保持器环，抛光装置和抛光方法
公开(公告)号：US20150183082A1
公开(公告)日：2015-07-02
申请号：US14578845
申请日：2014-12-22
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Dai FUKUSHIMA , Takashi Watanabe , Jun Takayasu
IPC分类号： B24B37/32 , B24B37/10 , B24B37/04
CPC分类号： B24B37/32 , B24B37/042 , B24B37/10 , B24B37/107
摘要： A retainer ring configured to be attachable, at a first side thereof, to a polish head of a polish apparatus configured to polish a polish object by depressing the polish object against a polish pad is disclosed. The retainer ring is configured to depress the polish pad at a second side thereof. The retainer ring includes a contact surface contacting the polish pad. The contact surface applies depressing force on the polish pad. The depressing force is directed from a polish head side and is applied so as to be centered on an imaginary circle of pressure center having a radius falling substantially in a middle of an inner radius of the retainer ring and an outer radius of the retainer ring. An area of the contact surface is greater in a first region inside the circle of pressure center than in a second region outside the circle of pressure center.
摘要翻译：公开了一种保持环，其被构造成可以在其第一侧被附着到抛光装置的抛光头，所述抛光装置被配置为通过将抛光物体压靠抛光垫来抛光抛光物体来抛光抛光物体。保持环构造成在其第二侧压下抛光垫。保持环包括接触抛光垫的接触表面。接触表面在抛光垫上施加抑制力。按压力从抛光头侧引导，并且被施加为以具有大致落在保持环的内半径的中间的半径的压力中心的假想圆和保持环的外半径为中心。接触表面的区域在压力中心圆周内的第一区域内比在压力中心圆外的第二区域内更大。

8. 发明申请

US20140342640A1 POLISHING APPARATUS AND POLISHING METHOD 有权
标题翻译：抛光装置和抛光方法
公开(公告)号：US20140342640A1
公开(公告)日：2014-11-20
申请号：US14109011
申请日：2013-12-17
申请人： Kabushiki Kaisha Toshiba
发明人： Dai Fukushima , Jun Takayasu , Takashi Watanabe
IPC分类号： B24B37/005 , B24B37/04 , H01L21/683 , H01L21/304
CPC分类号： B24B37/005 , B24B37/042 , B24B37/30 , B24B49/08 , B24B49/10 , B24B49/16 , H01L21/02024 , H01L21/67219
摘要： A polishing apparatus including a membrane including a pressure chamber and being configured to hold a wafer; a polishing portion including a polish pad contacting a polish surface of the wafer when polishing the wafer; a monitoring portion monitoring a state of inflation of the pressure chamber; and a controller controlling polishing of the wafer by the polishing portion based on a result of monitoring by the monitoring portion.
摘要翻译：一种抛光装置，包括：膜，包括压力室并被构造成保持晶片; 抛光部分，其包括在抛光晶片时与抛光晶片接触的抛光垫; 监视压力室的充气状态的监视部分; 以及控制器，其基于所述监视部的监视结果，通过所述研磨部控制所述晶片的研磨。

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