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    • 1. 发明申请
    • CIRCUIT BOARD AND ELECTRONIC DEVICE
    • 电路板和电子设备
    • US20130335933A1
    • 2013-12-19
    • US13779518
    • 2013-02-27
    • KABUSHIKI KAISHA TOSHIBA
    • Norihiro ISHIIHiroki Matsushita
    • H05K1/11
    • H05K1/111H05K3/3442H05K2201/09381Y02P70/611Y02P70/613
    • A circuit board includes a substrate having a mounting pad formed thereon, a packaged electronic device having a mounting surface coupled to the mounting pad and an electrode formed on a side surface of the packaged electronic device, and a conductive material that is disposed on a portion of the electrode formed on the side surface of the packaged electronic device and on a portion of the mounting pad. A first region of the pad is aligned with and adjacent to a portion of an outer edge of the electrode and includes the portion of the mounting pad. The second region of the pad is positioned between the mounting surface and the substrate and has at least one concave component that forms an insulating region. The circuit board can reduce the packaging height of parts and facilitate thinner electronic devices.
    • 电路板包括其上形成有安装焊盘的基板,具有连接到安装焊盘的安装表面的封装电子器件和形成在封装的电子器件的侧表面上的电极,以及导电材料, 的电极形成在封装的电子器件的侧表面上并在安装衬垫的一部分上。 焊盘的第一区域与电极的外边缘的一部分对准并且邻近电极的外边缘的一部分并且包括安装焊盘的部分。 衬垫的第二区域位于安装表面和衬底之间,并且具有形成绝缘区域的至少一个凹形部件。 电路板可以减少零件的包装高度,并有助于更薄的电子设备。