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1. 发明授权

US11871097B2 Electronic device, imaging apparatus, and mobile body 有权
公开(公告)号：US11871097B2
公开(公告)日：2024-01-09
申请号：US17438718
申请日：2020-03-12
申请人： KYOCERA Corporation
发明人： Hiroyuki Abe
IPC分类号： H04N23/52 , H04N23/54
CPC分类号： H04N23/52 , H04N23/54
摘要： An electronic device includes a first substrate and a second substrate, a first metal plate, and a second metal plate. On each of the first substrate and the second substrate, an electronic component is mounted. The first substrate and the second substrate are positioned toward a stacking direction with respective main surfaces facing each other. The first metal plate includes a flat portion that is interposed between the first substrate and the second substrate and that directly or indirectly abuts the electronic component mounted on the first substrate and the electronic component mounted on the second substrate, and a first shield portion that covers a portion of the side surface of the first substrate. The second metal plate includes a second shield portion that covers the entire circumference of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate. The first metal plate and the second metal plate abut each other directly or indirectly.

2. 发明授权

US11647265B2 Electronic apparatus, imaging apparatus, and mobile body 有权
公开(公告)号：US11647265B2
公开(公告)日：2023-05-09
申请号：US17269616
申请日：2019-08-23
申请人： KYOCERA Corporation
发明人： Hiroyuki Abe , Takahiro Okada
IPC分类号： H04N5/225 , B60R11/04 , G03B17/12 , H05K1/02 , H05K1/18 , B60R11/00
CPC分类号： H04N5/2252 , B60R11/04 , G03B17/12 , H04N5/2253 , H05K1/0274 , H05K1/182 , B60R2011/0021 , H05K2201/10121
摘要： An electronic apparatus includes a substrate, a housing, and an adhesive. The housing has opposing surfaces respectively opposing side surfaces of a first diagonal portion and second diagonal portion serving as a pair of diagonal portions of the substrate and encloses the substrate. The adhesive is positioned between the side surfaces of the first diagonal portion and the second diagonal portion of the substrate and the opposing surfaces of the housing.

3. 发明授权

US09448014B2 Channel member, and heat exchanger, semiconductor unit, and semiconductor manufacturing apparatus including the same 有权
标题翻译：通道构件，热交换器，半导体单元和包括其的半导体制造装置
公开(公告)号：US09448014B2
公开(公告)日：2016-09-20
申请号：US14353514
申请日：2012-10-29
申请人： KYOCERA Corporation
发明人： Kenji Tsubokawa , Kazuhiko Fujio , Kenjiro Maeda , Hiroyuki Abe
IPC分类号： H01L23/367 , H01L23/373 , H01L23/473 , F28F3/12 , H01L21/67 , H01L21/48 , F28F13/12 , F28F21/04 , H01J37/32
CPC分类号： F28F3/12 , F28F13/12 , F28F21/04 , H01J37/32715 , H01J37/32724 , H01L21/4882 , H01L21/67109 , H01L23/367 , H01L23/3731 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Channel members 100 to 107 according to the present invention have an inner spiral channel 9 through which a fluid 23 flows. The channel 9 is formed by a lid part 1, a bottom plate part 3, and a wall part 2 connected to the lid part 1 and the bottom plate part 3. The wall part 2 is made of a ceramic laminate. Even if the wall part 2 of the channel members 100 to 107 is narrow between channel segments 9, its good corrosion resistance allows the channel 9 to be resistant to collapse when the fluid 23 is supplied at high pressure. A heat exchanger 200, a semiconductor unit 300, and a semiconductor manufacturing apparatus 400 including any of the channel members 100 to 107 have improved heat exchange efficiency between the channel members 100 to 107 and the fluid 23.
摘要翻译：根据本发明的通道构件100至107具有流体23流过的内螺旋通道9。通道9由盖部1，底板部3和与盖部1和底板部3连接的壁部2形成。壁部2由陶瓷层叠体构成。即使通道构件100至107的壁部分2在通道段9之间较窄，其良好的耐腐蚀性允许通道9在高压下供应流体23时能够抗倒塌。包括通道构件100至107中的任何一个的热交换器200，半导体单元300和半导体制造装置400具有改善的通道构件100至107与流体23之间的热交换效率。

4. 发明授权

US12028591B2 Imaging apparatus and mobile object 有权
公开(公告)号：US12028591B2
公开(公告)日：2024-07-02
申请号：US17754044
申请日：2020-09-08
申请人： KYOCERA Corporation
发明人： Hiroyuki Abe , Kazuki Shirato
IPC分类号： H04N23/51 , H04N23/54
CPC分类号： H04N23/51 , H04N23/54
摘要： An imaging apparatus includes an imaging substrate, a connector substrate, and a housing. The imaging substrate is provided with an imaging device that produces image data. The connector substrate is movably connected to the imaging substrate. The connector substrate includes a terminal configured to be connectable in a first direction to an external connector to which the image data is output. The imaging substrate and the connector substrate are accommodated in the housing. The housing includes a restricting section that restricts a position of the connector substrate in the first direction. The connector substrate is configured to be movable within a predetermined range in a direction intersecting the first direction.

5. 发明授权

US11863852B2 Electronic device, imaging apparatus, and mobile body 有权
公开(公告)号：US11863852B2
公开(公告)日：2024-01-02
申请号：US17438689
申请日：2020-03-12
申请人： KYOCERA Corporation
发明人： Hiroyuki Abe , Kazuki Shirato
IPC分类号： H04N23/54 , H05K1/18 , H04N23/51 , H04N23/52 , H04N23/57
CPC分类号： H04N23/54 , H04N23/51 , H04N23/52 , H04N23/57 , H05K1/181 , H05K2201/10151
摘要： An electronic device 10 includes a first substrate 12, a second substrate 13, a third substrate 14, a first metal plate 15, and a second metal plate 16. An electronic component 21 is mounted on the first substrate 12. An electronic component 23 is mounted on the second substrate 13. An electronic component 23 is mounted on the third substrate 14. The first metal plate 15 includes a first flat portion 27 and a first shield portion 28. The first flat portion 27 is interposed between the first substrate 12 and the second substrate 13. The first flat portion 27 abuts the electronic component 23. The first shield portion 28 covers the entire circumference of a side surface of the first substrate 12. The second metal plate 16 includes a second flat portion 32 and a second shield portion 33. The second flat portion 32 is interposed between the second substrate 13 and the third substrate 14. The second flat portion 32 abuts the electronic component 23. The second shield portion 33 covers at least portions of side surfaces of the second substrate 13 and the third substrate 14.

6. 发明授权

US11754911B2 Imaging apparatus and mobile object 有权
公开(公告)号：US11754911B2
公开(公告)日：2023-09-12
申请号：US17754048
申请日：2020-09-08
申请人： KYOCERA Corporation
发明人： Hiroyuki Abe
IPC分类号： G03B17/55 , G03B17/12 , H04N23/52
CPC分类号： G03B17/55 , G03B17/12 , H04N23/52
摘要： An imaging apparatus includes an imaging optical system. The imaging apparatus includes a holding member that holds the imaging optical system. The imaging apparatus includes an imaging device including a light-receiving region and located in an image-forming plane of the imaging optical system. The imaging apparatus includes an elastic member that is located close to the imaging device toward the imaging optical system and surrounds the light-receiving region without overlapping the light-receiving region when viewed in an optical axial direction of the imaging optical system. The elastic member is in contact with the imaging device such that the area of contact between the elastic member and the imaging device is ring-shaped. The imaging apparatus includes a plate-like member that is located farther from an optical axis of the imaging optical system than an inside perimeter of the elastic member and overlaps at least part of the elastic member when viewed in the optical axial direction of the imaging optical system. The plate-like member includes a portion in contact with the holding member and a portion in contact with the elastic member.

7. 发明授权

US11597331B2 Bonded structure, imaging apparatus, and moveable body 有权
公开(公告)号：US11597331B2
公开(公告)日：2023-03-07
申请号：US16973187
申请日：2019-05-24
申请人： KYOCERA Corporation
发明人： Hiroyuki Abe , Takahiro Okada
IPC分类号： B60R11/04 , H04N5/225 , B64D47/08
摘要： A bonded structure (14) includes a first member (15), a second member (16), and an adhesive body (17). The second member (16) includes a support (18). The support (18) includes a facing surface and a side surface. The facing surface faces the first member (15). The side surface is inclined outward as viewed from the first member side. The adhesive body (17) is located between the first member (15) and the second member (16). The adhesive body (17) extends from the facing surface to the side surface. The adhesive body (17) has a fillet shape at an end thereof by the side surface. The adhesive body (17) fixes the first member (15) to the second member (16).

8. 发明申请

US20140319672A1 FLOW CHANNEL MEMBER, HEAT EXCHANGER USING SAME, SEMICONDUCTOR DEVICE, AND DEVICE FOR MANUFACTURING SEMICONDUCTOR 有权
标题翻译：流通道构件，使用其的热交换器，半导体器件和用于制造半导体的器件
公开(公告)号：US20140319672A1
公开(公告)日：2014-10-30
申请号：US14353514
申请日：2012-10-29
申请人： KYOCERA CORPORATION
发明人： Kenji Tsubokawa , Kazuhiko Fujio , Kenjiro Maeda , Hiroyuki Abe
IPC分类号： F28F3/12 , F28F13/12 , H01L23/367 , F28F21/04
CPC分类号： F28F3/12 , F28F13/12 , F28F21/04 , H01J37/32715 , H01J37/32724 , H01L21/4882 , H01L21/67109 , H01L23/367 , H01L23/3731 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Channel members 100 to 107 according to the present invention have an inner spiral channel 9 through which a fluid 23 flows. The channel 9 is formed by a lid part 1, a bottom plate part 3, and a wall part 2 connected to the lid part 1 and the bottom plate part 3. The wall part 2 is made of a ceramic laminate. Even if the wall part 2 of the channel members 100 to 107 is narrow between channel segments 9, its good corrosion resistance allows the channel 9 to be resistant to collapse when the fluid 23 is supplied at high pressure. A heat exchanger 200, a semiconductor unit 300, and a semiconductor manufacturing apparatus 400 including any of the channel members 100 to 107 have improved heat exchange efficiency between the channel members 100 to 107 and the fluid 23.
摘要翻译：根据本发明的通道构件100至107具有流体23流过的内螺旋通道9。通道9由盖部1，底板部3和与盖部1和底板部3连接的壁部2形成。壁部2由陶瓷层叠体构成。即使通道构件100至107的壁部分2在通道段9之间较窄，其良好的耐腐蚀性允许通道9在高压下供应流体23时能够抗倒塌。包括通道构件100至107中的任何一个的热交换器200，半导体单元300和半导体制造装置400具有改善的通道构件100至107与流体23之间的热交换效率。

9. 发明授权

US12061314B2 Vehicle-mounted camera and mobile body 有权
公开(公告)号：US12061314B2
公开(公告)日：2024-08-13
申请号：US17263545
申请日：2019-07-26
申请人： KYOCERA Corporation
发明人： Yasushi Koshiba , Takahiro Okada , Hiroyuki Abe , Hiroshi Nakao , Riyou Morishima
IPC分类号： G02B1/12 , B60R11/04 , B60S1/56 , G02B7/02 , G03B17/08 , B60R11/00
CPC分类号： G02B1/12 , B60R11/04 , B60S1/56 , G02B7/02 , G03B17/08 , B60R2011/004
摘要： A vehicle-mounted camera and a mobile body that improve the quality of a captured image are provided. The vehicle-mounted camera includes a lens arranged closest to a subject side and a housing that supports the lens. The lens is at least partially subjected to a surface treatment that changes its water-contact characteristics, or the housing has at least a shape to change its water-contact characteristics or is at least subjected to a surface treatment that changes the water-contact characteristics.

10. 发明授权

US11543614B2 Imaging apparatus, mobile object, and manufacturing method 有权
公开(公告)号：US11543614B2
公开(公告)日：2023-01-03
申请号：US16643478
申请日：2018-08-15
申请人： KYOCERA Corporation
发明人： Hiroyuki Abe , Takahiro Okada
IPC分类号： G02B7/00 , G02B7/02 , H04N5/225
摘要： Misalignment of a substrate portion which integrates an image sensor and a substrate is suppressed. An imaging apparatus comprises: an imaging optical system including at least one optical element; a holding member holding the imaging optical system; an image sensor configured to capture a subject image formed by the imaging optical system; a substrate having the image sensor mounted thereon; and a bonding member fixing a substrate portion to the holding member, the substrate portion integrating the image sensor and the substrate, wherein the bonding member is partly in contact with a surface of the substrate portion, and at at least two positions in a part of the surface of the substrate portion in contact with the bonding member, the surface of the substrate portion faces different directions.

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