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    • 1. 发明授权
    • Manufacture of a semiconductor device with a MOS transistor having an LDD structure using SiGe spacers
    • 具有使用SiGe间隔物的具有LDD结构的MOS晶体管的半导体器件的制造
    • US06255183B1
    • 2001-07-03
    • US09064207
    • 1998-04-22
    • Jurriaan SchmitzYouri V. PonomarevPierre H. Woerlee
    • Jurriaan SchmitzYouri V. PonomarevPierre H. Woerlee
    • H01L21336
    • H01L29/6659H01L21/2254H01L21/28247H01L21/823864H01L29/665Y10S438/923
    • A method of manufacturing a semiconductor device with a MOS transistor having an LDD structure. A gate dielectric (6) and a gate electrode (7, 8) are formed on a surface (5) of a silicon substrate (1). The surface adjacent the gate electrode is then exposed, and a layer of semiconductor material (10) is formed on an edge (9) of the surface adjoining the gate electrode. Ions (13, 14) are subsequently implated, with the gate electrode and the layer of semiconductor material acting as a mask. Finally, a heat treatment is carried out whereby a source zone (16, 17) and a drain zone (18, 19) are formed through activation of the implanted ions and through diffusion of atoms of a dopant from the layer of semiconductor material. The portions (b) of these zones formed by diffusion are weakly doped here and lie between the more strongly doped portions (a) formed through activation of implanted ions and the channel zone (20, 21). An LDD structure has thus been formed. In the method, a layer of semiconductor material formed by Si1-xGex, 0.1
    • 一种制造具有LDD结构的MOS晶体管的半导体器件的方法。 在硅衬底(1)的表面(5)上形成栅电介质(6)和栅电极(7,8)。 然后暴露与栅电极相邻的表面,并且在与栅电极相邻的表面的边缘(9)上形成一层半导体材料(10)。 随后,栅极电极和半导体材料层用作掩模,随后引入离子(13,14)。 最后,进行热处理,由此通过激活注入的离子并且通过从半导体材料层扩散掺杂剂的原子而形成源极区(16,17)和漏极区(18,19)。 这些由扩散形成的这些区域的部分(b)在这里是弱掺杂的,位于通过激活注入的离子和沟道区(20,21)形成的更强的掺杂部分(a)之间。 因此形成了LDD结构。 在该方法中,在与栅电极相邻的边缘上设置由Si1-xGex形成的半导体材料层,0.1
    • 9. 发明申请
    • Semiconductor Device Having Strip-Shaped Channel And Method For Manufacturing Such A Device
    • 具有带状通道的半导体器件及其制造方法
    • US20080203476A1
    • 2008-08-28
    • US11813015
    • 2005-12-19
    • Youri V. Ponomarev
    • Youri V. Ponomarev
    • H01L29/78H01L21/336
    • H01L29/785H01L27/1266H01L29/42392H01L29/66795
    • The invention relates to a semiconductor device (10) consisting of a substrate (11) and a semiconductor body (2) comprising a strip-shaped semiconductor region (3,3A,3B) of silicon in which a field effect transistor is formed, wherein a source region (4) of a first conductivity type, a channel region (33) of a second conductivity type opposed to the first, and a drain region (5) of the first conductivity type are arranged in succession, successively, seen in the longitudinal direction of the strip-shaped semiconductor region (3,3A,3B), and wherein the channel region (33) is provided with a gate dielectric (6), on which a first gate electrode (7) is present on a first vertical side of the strip-shaped semiconductor region (3,3A,3B), which gate electrode (7) is provided with a first connection region (7A), and on which a second gate electrode (8) is present on a second vertical side of the strip-shaped semiconductor region (3,3A,3B) positioned opposite the first vertical side, which second gate electrode (8) is provided with a second connection region (8A). According to the invention the first and second gate electrodes (7,8) completely fill the space on either side of the strip-shaped semiconductor region (3,3A,3B) over the width of the connection regions (7A,8A). In a preferred embodiment the gate electrodes (7,8) each border a horizontal side of the strip-shaped semiconductor region (3,3A,3B). The device (10) according to the invention is very compact, suitable for the sub 45 nm domain and easy to manufacture.
    • 本发明涉及由衬底(11)和半导体本体(2)构成的半导体器件(10),半导体器件(2)包括形成场效应晶体管的硅片的带状半导体区域(3,3A,3B) ,其中连续地依次排列第一导电类型的源极区(4),与第一导电类型相对的第二导电类型的沟道区(33)和第一导电类型的漏极区(5) 在条形半导体区域(3,3A,3B)的纵向方向上,并且其中沟道区域(33)设置有栅极电介质(6),其上存在第一栅电极(7) 在所述条形半导体区域(3,3A,3B)的第一垂直侧上,所述栅电极(7)设置有第一连接区域(7A),并且所述第二栅电极(8) 存在于位于对面的条形半导体区域(3,3A,3B)的第二垂直侧 位于第一垂直侧,该第二栅电极(8)设置有第二连接区域(8A)。 根据本发明,第一和第二栅电极(7,8)在连接区域(7A,8)的宽度上完全填充条形半导体区域(3,3A,3B)两侧的空间 一个)。 在优选实施例中,栅极电极(7,8)分别与条形半导体区域(3,3A,3B)的水平边界。 根据本发明的装置(10)非常紧凑,适合于低于45nm的结构域并且易于制造。