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1. 发明申请

US20060211809A1 Polymerizable composition and formed article using the same 失效
标题翻译：可聚合组合物和使用其的成型制品
公开(公告)号：US20060211809A1
公开(公告)日：2006-09-21
申请号：US10567116
申请日：2004-08-04
申请人： Junji Kodemura , Kazunori Toshima
发明人： Junji Kodemura , Kazunori Toshima
IPC分类号： C09B67/00
CPC分类号： C08F263/00 , C08F232/08 , C08F257/02 , C08F265/00 , C08F265/02 , C08F291/00 , C08G61/08 , C08G61/123 , C08G73/0616 , C08L45/00 , C08L51/00 , C08L51/003 , C08L65/00 , C08L2666/24 , C08L2666/02
摘要： A polymerizable composition which comprises a cycloolefin monomer (A), a filler (B), a polymer (C) having a carboxyl group or a carboxylic acid anhydride group and having an acid value of 0.1 to 100 mgKOH/g, and a metathesis polymerization catalyst (D). The polymerizable composition comprises a cycloolefin monomer and a large amount of a filler, and has a low viscosity and is excellent in fluidity, and further can provide a molded product which is excellent in the lowness of dielectric constant, the lowness of dielectric loss tangent, the lowness of linear expansion coefficient, high heat resistance and adhesiveness, and further is free of bubble inclusion.
摘要翻译：一种可聚合组合物，其包含环烯烃单体（A），填料（B），具有羧基或羧酸酐基的聚合物（C），酸值为0.1至100mgKOH / g，以及易位聚合催化剂（D）。可聚合组合物包含环烯烃单体和大量填料，并且具有低粘度和流动性优异，并且还可以提供一种成型产品，其介电常数低，介电损耗角正切低，线性膨胀系数低，耐热性和粘合性高，进一步没有气泡夹杂。

2. 发明授权

US08147953B2 Laminate and process for producing the same 失效
标题翻译：层压板及其制造方法
公开(公告)号：US08147953B2
公开(公告)日：2012-04-03
申请号：US10540377
申请日：2004-01-20
申请人： Shizuo Kitahara , Tetsuya Toyoshima , Kouichirou Maeda , Junji Kodemura , Yutaka Katoh
发明人： Shizuo Kitahara , Tetsuya Toyoshima , Kouichirou Maeda , Junji Kodemura , Yutaka Katoh
IPC分类号： B32B15/04 , B32B15/06 , B32B15/085 , C23C16/00
CPC分类号： C08J7/047 , B32B25/08 , B32B25/16 , C08J7/123 , C08J2423/00 , Y10T428/24942 , Y10T428/26 , Y10T428/263 , Y10T428/31678 , Y10T428/31692 , Y10T428/31696 , Y10T428/31931
摘要： An object of the invention is to provide a laminate which is good in adhesiveness between a substrate and a thin film laminated thereon by a dry film-forming method such as a chemical vapor growth method or a vacuum evaporation method even if the substrate is a polymer substrate made of a nonpolar polymer; and a process for producing the same. In order to attain the above-mentioned object, the invention provides a laminate comprising a polymer substrate, a primer layer comprising a cyclized rubber which is a conjugated diene polymer cyclized product or a derivative thereof, the layer being formed on the surface of the polymer substrate, and a thin film laminated on the surface of the primer layer by a dry film-forming method; and a process for producing the same.
摘要翻译：本发明的目的是提供一种层压体，其通过诸如化学气相生长法或真空蒸发法之类的干膜形成方法在基材和其上层压的薄膜之间具有良好的粘附性，即使基材是聚合物由非极性聚合物制成的基底; 及其制造方法。为了实现上述目的，本发明提供了一种层压体，其包括聚合物基材，包含作为共轭二烯聚合物环化产物的环化橡胶或其衍生物的底漆层，所述层在聚合物的表面上形成基板和通过干膜形成方法层压在底漆层的表面上的薄膜; 及其制造方法。

3. 发明授权

US06833180B1 Adhesive for semiconductor part 失效
标题翻译：用于半导体零件的粘合剂
公开(公告)号：US06833180B1
公开(公告)日：2004-12-21
申请号：US09462214
申请日：2000-01-04
申请人： Junji Kodemura
发明人： Junji Kodemura
IPC分类号： B32B300
CPC分类号： H01L24/83 , C09J9/02 , H01B1/20 , H01B1/22 , H01B1/24 , H01L24/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/29369 , H01L2224/29393 , H01L2224/29399 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/1579 , Y10T428/249994 , Y10T428/25 , Y10T428/254 , Y10T428/256 , Y10T428/31515 , Y10T428/31522 , Y10T428/31678 , Y10T428/31692 , Y10T428/31696 , Y10T428/31855 , Y10T428/31931 , H01L2924/00 , H01L2924/3512 , H01L2924/00015 , H01L2924/00012 , H01L2924/00014
摘要： An adhesive for semiconductor parts, comprising, as a base polymer, at least one cyclic structure-containing thermoplastic polymer selected from the group consisting of (a) a cycloolefin polymer and (b) an aromatic-condensed polymer having a repeating unit of an aromatic ring in its main chain, and having a number average molecular weight of 1,000 to 500,000, an adhesive sheet formed of the adhesive, a semiconductor part package making use of the adhesive, and a production process of the package.
摘要翻译：一种用于半导体部件的粘合剂，其包含作为基础聚合物的至少一种选自（a）环烯烃聚合物和（b）具有芳族化合物的重复单元的芳族稠合聚合物的含环状结构的热塑性聚合物环，其数均分子量为1,000〜500,000，由粘合剂形成的粘合片，使用粘合剂的半导体部件封装以及封装的制造过程。

4. 发明申请

US20100124615A1 Process for Producing Crosslinkable Resin Formed Product 审中-公开
标题翻译：生产可交联树脂成型产品的方法
公开(公告)号：US20100124615A1
公开(公告)日：2010-05-20
申请号：US12223611
申请日：2007-02-06
申请人： Tomoyoshi Ohtaki , Kazuyuki Onishi , Narumi Suzuki , Kiyoshige Kojima , Junji Kodemura
发明人： Tomoyoshi Ohtaki , Kazuyuki Onishi , Narumi Suzuki , Kiyoshige Kojima , Junji Kodemura
IPC分类号： B05D3/02 , C08F112/00
CPC分类号： C08G61/06 , B32B15/08 , B32B27/32 , C08G61/08 , C08J5/24 , C08J2365/00 , C08L65/00 , H05K1/032 , Y10T428/31678
摘要： A process for producing a crosslinkable resin formed product is disclosed which comprises providing a polymerizable composition containing a cycloolefin monomer, a metathesis polymerization catalyst, a chain transfer agent, and a crosslinking agent, and heating the polymerizable composition to 50° C. or more to effect ring-opening metathesis bulk polymerization, the temperature of the polymerizable composition before heating being maintained at −10° C. to +20° C. According to the present invention, a process for efficiently producing a crosslinkable resin formed product which exhibits excellent flowability when melted by heat and does not produce voids(blurs) inside a laminate or impair flatness when laminated on a substrate is provided.
摘要翻译：公开了一种生产可交联树脂成型体的方法，其包括提供含有环烯烃单体，易位聚合催化剂，链转移剂和交联剂的可聚合组合物，并将可聚合组合物加热至50℃以上至效果开环复分解本体聚合，加热前的可聚合组合物的温度保持在-10℃至+ 20℃。根据本发明，一种有效生产交联性树脂成型产品的流程性优异的方法当通过热熔融并且不产生层压体内部的空隙（模糊）或在层压在基板上时损害平坦度。

5. 发明申请

US20090305018A1 Crosslinkable-Resin Formed Product, Crosslinked-Resin Formed Product, and Crosslinked Resin-Metal Clad Laminate 审中-公开
标题翻译：可交联树脂成型产品，交联树脂成型产品和交联树脂金属包层压板
公开(公告)号：US20090305018A1
公开(公告)日：2009-12-10
申请号：US12223610
申请日：2007-02-06
申请人： Tomoyoshi Ohtaki , Kazuyuki Onishi , Narumi Suzuki , Kiyoshige Kojima , Junji Kodemura
发明人： Tomoyoshi Ohtaki , Kazuyuki Onishi , Narumi Suzuki , Kiyoshige Kojima , Junji Kodemura
IPC分类号： B32B15/08 , C08G61/06 , B32B27/32
CPC分类号： C08G61/06 , B32B15/08 , B32B27/32 , C08G61/08 , C08J5/24 , C08J2365/00 , C08L65/00 , H05K1/032 , Y10T428/31678
摘要： A crosslinkable resin formed product comprising a cycloolefin resin obtained by ring-opening metathesis bulk polymerization of a cycloolefin monomer and a crosslinking agent, the cycloolefin resin having a weight average molecular weight (Mw) of 10,000 to 50,000 and a molecular weight distribution (Mw/Mn) of 4.4 or less, a crosslinked resin formed product produced by crosslinking the crosslinkable resin formed product, and a crosslinked resin-metal clad laminate produced by laminating the crosslinked resin formed product on a metal foil are disclosed. According to the present invention, a crosslinkable resin formed product which exhibits excellent flowability when melted by heat, and does not produce voids inside the laminate or impair flatness when laminated with a substrate, a crosslinked resin formed product produced by crosslinking the crosslinkable resin formed product, and a crosslinked resin-metal clad laminate produced by laminating the crosslinked resin formed product on a metal foil are provided.
摘要翻译：一种可交联树脂成型体，其通过环烯烃单体的开环复分解本体聚合得到的环烯烃树脂和交联剂，所述环烯烃树脂的重均分子量（Mw）为10,000〜50,000，分子量分布（Mw / Mn）为4.4以下，通过将交联性树脂成形体交联而制造的交联树脂成形体，以及通过将交联树脂成形体层叠在金属箔上而制造的交联树脂 - 金属覆层层叠体。根据本发明，提供一种可交联树脂成型体，其在通过热熔融时表现出优异的流动性，并且在与基材层压时不会在层压体内产生空隙或在与基材层压时损害平坦度，将交联性树脂成形体并且提供了通过将交联树脂成形产品层压在金属箔上制成的交联树脂 - 金属覆层层压板。

6. 发明申请

US20110144292A1 POLYMERIZABLE COMPOSITION, CROSSLINKABLE RESIN, AND MANUFACTURE METHODS AND APPLICATIONS THEREOF 有权
标题翻译：可聚合组合物，可交联树脂及其制造方法及其应用
公开(公告)号：US20110144292A1
公开(公告)日：2011-06-16
申请号：US12446126
申请日：2007-10-19
申请人： Kiyoshige Kojima , Junji Kodemura
发明人： Kiyoshige Kojima , Junji Kodemura
IPC分类号： C08F2/38 , B05D3/10 , B05D7/24 , B05D5/00
CPC分类号： C08G61/08 , C07C6/06 , C08F290/06 , C08F299/00 , C08F299/06 , C08G2261/1642 , C08G2261/3324 , C08G2261/3325 , C08G2261/418 , C08J5/24 , C08J2365/00 , C08K5/0025 , C08K5/101 , C08L65/00 , H01B3/448 , Y10S526/902
摘要： A polymerizable composition suitable as an electric material and the like used in an electric circuit board, which comprises a norbornene monomer, a metathesis polymerization catalyst, and a chain transfer agent composed of a compound represented by formula (A): CH2═CH—Y—OCO—CR1═CH2 wherein Y represents a divalent hydrocarbon group having 3 to 20 carbon atoms, and R1 represents a hydrogen atom or a methyl group. By further comprising a crosslinking agent in the polymerizable composition, obtaining a crosslinkable resin by carrying out bulk polymerization, and crosslinking the crosslinkable resin to obtain a molded article and a crosslinked resin composite having excellent characteristics such as electric insulation, adhesion, mechanical strength, heat resistance, dielectric properties and the like.
摘要翻译：一种适用于电路板中使用的电气材料等的可聚合组合物，其包含降冰片烯单体，易位聚合催化剂和由式（A）表示的化合物组成的链转移剂：CH 2 = CH-Y -OCO-CR 1 = CH 2，其中Y表示碳原子数3〜20的二价烃基，R 1表示氢原子或甲基。通过在聚合性组合物中进一步含有交联剂，通过进行本体聚合得到交联性树脂，交联交联性树脂，得到成型体和交联树脂复合体，其具有优异的电绝缘性，粘合性，机械强度，热性电阻，介电特性等。

7. 发明申请

US20100252310A1 COMPOSITE FOR MULTILAYER CIRCUIT BOARD 审中-公开
标题翻译：复合材料多层电路板
公开(公告)号：US20100252310A1
公开(公告)日：2010-10-07
申请号：US12670956
申请日：2008-07-25
申请人： Kiyoshige Kojima , Junji Kodemura
发明人： Kiyoshige Kojima , Junji Kodemura
IPC分类号： H05K1/00 , B32B15/08 , B32B37/06 , B05D3/02
CPC分类号： H05K3/4655 , H05K3/386 , H05K3/4652 , H05K2201/0195 , H05K2201/0358 , H05K2203/1105 , H05K2203/1476 , Y10T428/2848
摘要： A crosslinkable and polymerizable composition containing a monomer and a cross-linking agent is applied onto a metal foil to form a coated film of the composition, and heat is applied to the coated film to firstly bulk polymerize the entire coated film of the crosslinkable and polymerizable composition. Then, by applying heat to the coated film from the metal foil side, cooling a surface far from the metal foil as needed, and subjecting a limited region adjacent to the metal foil in the thickness direction of the coated film to a cross-linking reaction, a composite for multilayer circuit board is obtained, in which the metal foil layer, a hard resin layer containing a hard resin obtained by bulk polymerization reaction and cross-linking reaction, and an adhesive resin layer containing an adhesive resin obtained by bulk polymerization reaction are laminated in this order.
摘要翻译：将含有单体和交联剂的交联性和可聚合组合物施加到金属箔上以形成组合物的涂膜，并将热量施加到涂膜上，首先将可交联和可聚合的整个涂膜组成。然后，通过从金属箔侧向涂膜施加热量，根据需要冷却远离金属箔的表面，并且将与金属箔相邻的有限区域沿涂布膜的厚度方向进行交联反应得到金属箔层，含有通过本体聚合反应和交联反应得到的硬质树脂的硬质树脂层和通过本体聚合反应得到的粘合性树脂的粘合性树脂层的多层电路板用复合体按此顺序层压。

8. 发明申请

US20100144924A1 POLYMERIZABLE COMPOSITION 有权
标题翻译：可聚合组合物
公开(公告)号：US20100144924A1
公开(公告)日：2010-06-10
申请号：US12521502
申请日：2007-12-27
申请人： Akihiko Yoshiwara , Junji Kodemura
发明人： Akihiko Yoshiwara , Junji Kodemura
IPC分类号： B05D5/12 , C08J9/32
CPC分类号： C08L65/00 , C08G61/08 , C08G2261/418 , C08J5/24 , C08J2365/00 , C08K3/36 , C08K7/26 , H01B3/448 , H05K1/0373 , H05K2201/0158 , H05K2201/0254
摘要： A polymerizable composition is obtained by mixing a metathesis polymerization catalyst including benzylidene(1,3-dimethyl-4-imidazolidin-2-ylidene)(tricyclohexylphosphine)ruthenium dichloride, a cycloolefin monomer such as 2-norbornene or tetracyclo[6.2.1.13,6.02,7]dodec-4-ene, a chain transfer agent such as allyl methacrylate, and hollow particles such as Shirasu balloons. A crosslinkable resin composite is obtained by coating or impregnating the polymerizable composition onto or into a support medium, and carrying out bulk polymerization of the polymerizable composition. A crosslinked resin composite is obtained by crosslinking the crosslinkable resin composite.
摘要翻译：通过将包含亚苄基（1,3-二甲基-4-咪唑烷-2-亚基）（三环己基膦）二氯化钌，易环烯烃单体如2-降冰片烯或四环[6.2.1.13,6.02 ，7]十二碳-4-烯，链转移剂如甲基丙烯酸烯丙酯和中空颗粒如白砂糖气球。通过将可聚合组合物涂布或浸渍到载体介质上或浸渍到载体介质中并进行可聚合组合物的本体聚合来获得可交联树脂复合材料。通过使交联性树脂复合体交联而得到交联树脂复合体。

9. 发明申请

US20100324247A1 POLYMERIZABLE COMPOSITION, CROSSLINKABLE RESIN, AND PRODUCTION METHODS AND APPLICATIONS THEREOF 审中-公开
标题翻译：可聚合组合物，可交联树脂及其生产方法及其应用
公开(公告)号：US20100324247A1
公开(公告)日：2010-12-23
申请号：US12446138
申请日：2007-10-19
申请人： Kiyoshige Kojima , Junji Kodemura
发明人： Kiyoshige Kojima , Junji Kodemura
IPC分类号： C08F132/08 , B05D3/10
CPC分类号： C08G61/08 , C08F290/00 , C08F290/06 , C08F299/00 , C08G2261/3324 , C08G2261/418 , C08J5/24 , C08J2365/00 , C08K5/01 , C08L65/00 , H05K1/032
摘要： A polymerizable composition comprising a norbornene monomer, a metathesis polymerization catalyst, and a nonpolar radical generating agent, from which a crosslinkable resin can be obtained that is suitable as an electric material and the like used in an electric circuit board. By coating or impregnating this polymerizable composition onto or into a support, and then carrying out bulk polymerization to obtain a crosslinkable resin composite, and then crosslinking the crosslinkable resin composite to obtain a crosslinked resin composite having excellent characteristics such as electric insulation, adhesion, mechanical strength, heat resistance, dielectric properties and the like. The compound has a dipole moment of 0.5 or less, generates radicals by heating, and can initiate a crosslinking reaction.
摘要翻译：包含降冰片烯单体，易位聚合催化剂和非极性自由基发生剂的可聚合组合物，可以从其获得适合作为电路板中使用的电气材料等的可交联树脂。通过将该可聚合组合物涂布或浸渍到支撑体上，然后进行本体聚合以获得可交联树脂复合材料，然后交联可交联树脂复合材料以获得具有优异特性的交联树脂复合材料，例如电绝缘性，粘合性，机械性强度，耐热性，介电性等。该化合物的偶极矩为0.5以下，通过加热而生成自由基，可引发交联反应。

10. 发明申请

US20100015871A1 MOLDED ARTICLE, PROCESS FOR PRODUCING THE SAME, AND CROSSLINKED MOLDED ARTICLE AND COPPER-CLAD LAMINATE EACH OBTAINED THEREFROM 审中-公开
标题翻译：模制品，其生产方法和交联的模制品和铜箔层压板
公开(公告)号：US20100015871A1
公开(公告)日：2010-01-21
申请号：US12443439
申请日：2007-09-28
申请人： Hirotoshi Tanimoto , Tomoo Sugawara , Junji Kodemura
发明人： Hirotoshi Tanimoto , Tomoo Sugawara , Junji Kodemura
IPC分类号： B32B17/10 , C08J5/00
CPC分类号： B32B17/04 , B32B5/028 , B32B5/26 , B32B15/08 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/0257 , B32B2264/10 , B32B2264/101 , B32B2264/102 , B32B2264/108 , B32B2307/3065 , B32B2307/308 , B32B2307/4026 , B32B2307/71 , B32B2457/00 , B32B2605/00 , C08J5/24 , H05K1/032 , H05K1/0366 , H05K2201/0158 , Y10T442/2049
摘要： The present invention intends to provide a crosslinkable molded article and a crosslinked molded article free from molding failures, wherein their coefficient of thermal expansion is sufficiently low, their dimensional accuracy is high and a polymerizable composition is sufficiently filled in a fibrous material; a process for producing the same; and a use of such molded articles.A process for producing the molded articles of the present invention is characterized by producing a crosslinkable molded article by performing ring-opening bulk polymerization of a polymerizable composition comprising a cycloolefin monomer, a metathesis catalyst and, in accordance with need, a crosslinking agent and/or a filler in the presence of a glass yarn cloth having a bulk density of 0.50 to 1.10 g/cm3 and, then, if desired, conducting a crosslinking reaction.
摘要翻译：本发明提供一种交联性成型品和没有成型故障的交联成型品，其热膨胀系数足够低，尺寸精度高，可聚合组合物充分填充在纤维材料中; 其制造方法; 以及这种模塑制品的用途。本发明的成型体的制造方法的特征在于，通过进行包含环烯烃单体，复分解催化剂的聚合性组合物的开环本体聚合，根据需要制造交联性成型体和/ 或填料，在堆积密度为0.50〜1.10g / cm 3的玻璃纱布的存在下，然后，如果需要，进行交联反应。

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